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    High-speed router backplane
    1.
    发明授权
    High-speed router backplane 有权

    公开(公告)号：US07088711B2

    公开(公告)日：2006-08-08

    申请号：US10068616

    申请日：2002-02-05

    申请人： Joel R. Goergen ,  Ashby Armistead ,  Greg Hunt

    发明人： Joel R. Goergen ,  Ashby Armistead ,  Greg Hunt

    IPC分类号： H04L12/50

    CPC分类号： H05K1/0245 ,  H05K1/0228 ,  H05K1/0248 ,  H05K1/0298 ,  H05K7/1459 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09263

    摘要： A high-speed router backplane is disclosed. The disclosed construction and layout techniques enable the construction of a reliable, high-layer-count, and economical backplane for routers and the like that use signaling across the backplane at trace speeds of 2.5 Gbps or greater. Specific ranges of differential trace geometry characteristics, with significant single-ended coupling to adjacent ground planes, have been found to provide the parameters needed for such signaling. New trace routing and layering techniques also help in the realization of a backplane embodiment containing roughly 600 operable high-speed differential pairs, while also providing sufficient electromagnetic interference management to allow power distribution to occur within the same backplane.

    Method of fabricating a circuit board
    2.
    发明授权
    Method of fabricating a circuit board 有权
    制造电路板的方法

    公开(公告)号：US09560774B2

    公开(公告)日：2017-01-31

    申请号：US13420167

    申请日：2012-03-14

    申请人： Joel R. Goergen ,  Greg Hunt

    发明人： Joel R. Goergen ,  Greg Hunt

    IPC分类号： H05K3/20 ,  H05K3/42 ,  H05K1/02 ,  H05K3/00

    CPC分类号： H05K3/429 ,  H05K1/0216 ,  H05K1/0237 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165

    摘要： A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.

    摘要翻译： 公开了一种高速路由器背板。 路由器背板在多个信号层上使用差分信号对，每个信号对夹在一对数字接地层之间。 通孔用于将差分信号对连接到外部组件。 为了降低路由复杂度，差分信号对中的至少一些在其路径的某处沿着不同的信号层路由通路对。 钻出至少一些通孔和通孔以减少孔的导电短截线长度部分。 孔的钻孔部分包括从第一轮廓到第二轮廓的转变，以减少从钻孔的端部的射频反射。

    HIGH-SPEED ROUTER WITH BACKPLANE USING MULTI-DIAMETER DRILLED THRU-HOLES AND VIAS
    6.
    发明申请
    HIGH-SPEED ROUTER WITH BACKPLANE USING MULTI-DIAMETER DRILLED THRU-HOLES AND VIAS 有权
    使用多直径钻孔螺栓和六角柱的背板高速路由器

    公开(公告)号：US20120167386A1

    公开(公告)日：2012-07-05

    申请号：US13420167

    申请日：2012-03-14

    申请人： Joel R. Goergen ,  Greg Hunt

    发明人： Joel R. Goergen ,  Greg Hunt

    IPC分类号： H05K3/42

    CPC分类号： H05K3/429 ,  H05K1/0216 ,  H05K1/0237 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165

    摘要： A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.

    摘要翻译： 公开了一种高速路由器背板。 路由器背板在多个信号层上使用差分信号对，每个信号对夹在一对数字接地层之间。 通孔用于将差分信号对连接到外部组件。 为了降低路由复杂度，差分信号对中的至少一些在其路径的某处沿着不同的信号层路由通路对。 钻出至少一些通孔和通孔以减少孔的导电短截线长度部分。 孔的钻孔部分包括从第一轮廓到第二轮廓的转变，以减少从钻孔的端部的射频反射。

    High-speed router with backplane using muli-diameter drilled thru-holes and vias
    8.
    发明申请
    High-speed router with backplane using muli-diameter drilled thru-holes and vias 有权
    具有背板的高速路由器使用多孔直径钻孔和通孔

    公开(公告)号：US20090045889A1

    公开(公告)日：2009-02-19

    申请号：US11891785

    申请日：2007-08-13

    申请人： Joel R. Goergen ,  Greg Hunt

    发明人： Joel R. Goergen ,  Greg Hunt

    IPC分类号： H03H7/01 ,  H01K3/00 ,  H05K1/11

    CPC分类号： H05K3/429 ,  H05K1/0216 ,  H05K1/0237 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165

    摘要： A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.

    摘要翻译： 公开了一种高速路由器背板。 路由器背板在多个信号层上使用差分信号对，每个信号对夹在一对数字接地层之间。 通孔用于将差分信号对连接到外部组件。 为了降低路由复杂度，差分信号对中的至少一些在其路径的某处沿着不同的信号层路由通路对。 钻出至少一些通孔和通孔以减少孔的导电短截线长度部分。 孔的钻孔部分包括从第一轮廓到第二轮廓的转变，以减少从钻孔的端部的射频反射。

    Process and system for iontophoretic wrinkle reduction
    10.
    发明授权
    Process and system for iontophoretic wrinkle reduction 有权
    离子电渗疗法减少皱纹的过程和系统

    公开(公告)号：US08747383B2

    公开(公告)日：2014-06-10

    申请号：US12970224

    申请日：2010-12-16

    申请人： Ray Francis ,  John Trengove ,  Greg Hunt ,  Josh Hoyt ,  Jim Thorne ,  Darrick Carter

    发明人： Ray Francis ,  John Trengove ,  Greg Hunt ,  Josh Hoyt ,  Jim Thorne ,  Darrick Carter

    IPC分类号： A61M31/00

    CPC分类号： A61N1/30 ,  A45D44/22 ,  A61N1/22 ,  A61N1/328

    摘要： A method and system for wrinkle reduction. The method includes the steps of positioning and applying a patch to skin of a consumer and adhesively securing the patch to the skin. A chemical composition on the patch includes both active ingredients and adhesive. A pair of electrodes are connected to a battery-driven, microprocessor-based controller. A current is applied through the electrodes in the patch for a selected time. The chemical composition in the patch is propelled into the consumer through use of the current in order to relax the skin of the consumer. The patch is removed and any residue of the chemical composition is massaged into the skin.

    摘要翻译： 一种减少皱纹的方法和系统。 该方法包括以下步骤：将贴片定位并施加到消费者的皮肤上并且将贴片粘附到皮肤上。 补片上的化学成分包括活性成分和粘合剂。 一对电极连接到电池驱动的基于微处理器的控制器。 电流通过贴片中的电极施加一段时间。 贴片中的化学成分通过使用电流推进消费者，以放松消费者的皮肤。 去除贴片，并将化学成分的任何残留物按摩到皮肤中。