公开(公告)号：US07767589B2

公开(公告)日：2010-08-03

申请号：US11848820

申请日：2007-08-31

申请人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

发明人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

IPC分类号： H01L21/469 ,  H01L21/31 ,  H01L23/58 ,  H01L21/76

CPC分类号： H01L23/3192 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L23/4821 ,  H01L23/5221 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter2/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 1015 ohm-centimeter, and a defect density less than 0.5/centimeter2.

摘要翻译： 根据本公开的一个实施例，用于钝化电路器件的方法通常包括提供具有衬底表面的衬底，在衬底表面上形成电子部件，以及用第一保护介电层涂覆衬底表面和电气部件。 第一保护介电层由通常不透水的材料制成，其透湿度小于0.01克/米2 /天，吸湿率小于0.04％，介电常数小于10，介电损耗小于0.005，击穿 电压强度大于800万伏/厘米，电阻率大于1015欧姆厘米，缺陷密度小于0.5 /厘米2。

公开(公告)号：US20080185174A1

公开(公告)日：2008-08-07

申请号：US11848820

申请日：2007-08-31

申请人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

发明人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

IPC分类号： H05K1/16 ,  H01L21/31 ,  H01L21/76

CPC分类号： H01L23/3192 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L23/4821 ,  H01L23/5221 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter2/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 1015 ohm-centimeter, and a defect density less than 0.5/centimeter2.

摘要翻译： 根据本公开的一个实施例，用于钝化电路器件的方法通常包括提供具有衬底表面的衬底，在衬底表面上形成电子部件，以及用第一保护介电层涂覆衬底表面和电气部件。 第一保护介电层由通常不透湿的材料制成，其透湿度小于0.01克/米2天，吸湿率小于0.04％，介电常数小于10，a 介电损耗小于0.005，击穿电压强度大于800万伏/厘米，薄层电阻率大于10欧姆厘米，缺陷密度小于0.5 /厘米2， / SUP>。

公开(公告)号：US07902083B2

公开(公告)日：2011-03-08

申请号：US12691216

申请日：2010-01-21

申请人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

发明人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

IPC分类号： H01L21/469 ,  H01L21/31 ,  H01L23/58 ,  H01L21/76

CPC分类号： H01L23/3192 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L23/4821 ,  H01L23/5221 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter2/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 1015 ohm-centimeter, and a defect density less than 0.5/centimeter2.

摘要翻译： 根据本公开的一个实施例，用于钝化电路器件的方法通常包括提供具有衬底表面的衬底，在衬底表面上形成电子部件，以及用第一保护介电层涂覆衬底表面和电气部件。 第一保护介电层由通常不透水的材料制成，其透湿度小于0.01克/米2 /天，吸湿率小于0.04％，介电常数小于10，介电损耗小于0.005，击穿 电压强度大于800万伏/厘米，电阻率大于1015欧姆厘米，缺陷密度小于0.5 /厘米2。

公开(公告)号：US20100120254A1

公开(公告)日：2010-05-13

申请号：US12691216

申请日：2010-01-21

申请人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

发明人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L23/3192 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L23/4821 ,  H01L23/5221 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter2/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 1015 ohm-centimeter, and a defect density less than 0.5/centimeter2.

摘要翻译： 根据本公开的一个实施例，用于钝化电路器件的方法通常包括提供具有衬底表面的衬底，在衬底表面上形成电子部件，以及用第一保护介电层涂覆衬底表面和电气部件。 第一保护介电层由通常不透水的材料制成，其透湿度小于0.01克/米2 /天，吸湿率小于0.04％，介电常数小于10，介电损耗小于0.005，击穿 电压强度大于800万伏/厘米，电阻率大于1015欧姆厘米，缺陷密度小于0.5 /厘米2。

公开(公告)号：US08148830B2

公开(公告)日：2012-04-03

申请号：US12533409

申请日：2009-07-31

申请人： John M. Bedinger ,  Michael A. Moore

发明人： John M. Bedinger ,  Michael A. Moore

IPC分类号： H01L23/29

CPC分类号： H05K3/284 ,  H01L23/3192 ,  H01L23/4821 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/1322 ,  Y10T29/49124 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49982 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014

摘要： A circuit board assembly includes a circuit board having an outer surface configured with a plurality of discrete electrical components. The assembly includes a first protective dielectric layer overlying the outer surface, and a second dielectric layer overlying the first protective dielectric layer and the discrete electrical components. The second dielectric layer includes a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 3.0, a dielectric loss less than 0.008, a moisture absorption less than 0.04 percent, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 300° Celsius, pinhole free in films greater than 50 Angstroms, hydrophobic with a wetting angle greater than 45 degrees, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 30%.

摘要翻译： 电路板组件包括具有被配置有多个分立的电气部件的外表面的电路板。 该组件包括覆盖在外表面上的第一保护介电层和覆盖第一保护介电层和分立电气部件的第二介电层。 第二电介质层包括弹性模量小于3.5千兆帕（GPa），介电常数小于3.0的介电材料，小于0.008的介电损耗，小于0.04％的吸湿性，超过的击穿电压强度 200万伏/厘米（MV /厘米），温度稳定至300摄氏度，大于50埃的薄膜中无针孔，疏水性大于45度的润湿角度，能够在3D结构下保形地沉积， 厚度均匀度小于或等于30％。

公开(公告)号：US20090291200A1

公开(公告)日：2009-11-26

申请号：US12533503

申请日：2009-07-31

申请人： John M. Bedinger ,  Michael A. Moore

发明人： John M. Bedinger ,  Michael A. Moore

IPC分类号： B05D5/12

CPC分类号： H05K3/284 ,  H01L23/3192 ,  H01L23/4821 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/1322 ,  Y10T29/49124 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49982 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014

摘要： A method includes providing a circuit board having an outer surface, the outer surface configured with a plurality of discrete electrical components that are each manufactured independently of one another, and coating the outer surface and the plurality of discrete electrical components with a first protective dielectric layer. The method further includes coating the first protective dielectric layer with a second dielectric layer. The second dielectric layer includes a dielectric material having a modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 2.7, a dielectric loss less than 0.002, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 3000 Celsius, a defect densities less than 0.5/centimeter, a pinhole free in films greater than 50 Angstroms, and is capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.

摘要翻译： 一种方法包括提供具有外表面的电路板，所述外表面被配置有彼此独立制造的多个分立电气部件，并且用第一保护介电层涂覆所述外表面和所述多个分立的电部件 。 该方法还包括用第二介电层涂覆第一保护介电层。 第二电介质层包括弹性模量小于3.5千兆帕（GPa），介电常数小于2.7的介电材料，介电损耗小于0.002，击穿电压强度超过2百万伏/厘米（ MV / cm），温度稳定度为3000摄氏度，缺陷密度小于0.5 /厘米，薄膜中大小不超过50埃的针孔，并且能够在厚度均匀度小于或等于3维的3D结构下保形地沉积 至10％。

公开(公告)号：US08319112B2

公开(公告)日：2012-11-27

申请号：US12533448

申请日：2009-07-31

申请人： John M. Bedinger ,  Michael A. Moore

发明人： John M. Bedinger ,  Michael A. Moore

IPC分类号： H05K1/00

CPC分类号： H05K3/284 ,  H01L23/3192 ,  H01L23/4821 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/1322 ,  Y10T29/49124 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49982 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014

摘要： A circuit board assembly includes a circuit board having an outer surface, the outer surface being configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a domed lid enclosure disposed over one of the plurality of discrete electrical components and an additional dielectric coating overlying the outer surface and the domed lid enclosure.

摘要翻译： 电路板组件包括具有外表面的电路板，所述外表面配置有彼此独立制造的多个分立电气部件。 电路板组件还包括设置在多个离散电气部件中的一个上的圆顶形盖子外壳和覆盖外表面和圆顶形盖子外壳的附加电介质涂层。

公开(公告)号：US08857050B2

公开(公告)日：2014-10-14

申请号：US12533503

申请日：2009-07-31

申请人： John M. Bedinger ,  Michael A. Moore

发明人： John M. Bedinger ,  Michael A. Moore

IPC分类号： H05K3/30 ,  H05K3/28 ,  H01L23/482 ,  H01L23/31 ,  H01L23/00

CPC分类号： H05K3/284 ,  H01L23/3192 ,  H01L23/4821 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/1322 ,  Y10T29/49124 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49982 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014

摘要： A method includes providing a circuit board having an outer surface, the outer surface configured with a plurality of discrete electrical components that are each manufactured independently of one another, and coating the outer surface and the plurality of discrete electrical components with a first protective dielectric layer. The method further includes coating the first protective dielectric layer with a second dielectric layer. The second dielectric layer includes a dielectric material having a modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 2.7, a dielectric loss less than 0.002, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 3000 Celsius, a defect densities less than 0.5/centimeter, a pinhole free in films greater than 50 Angstroms, and is capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.

摘要翻译： 一种方法包括提供具有外表面的电路板，所述外表面配置有彼此独立制造的多个分立电气部件，并且用第一保护介电层涂覆所述外表面和所述多个离散电部件 。 该方法还包括用第二介电层涂覆第一保护介电层。 第二电介质层包括弹性模量小于3.5千兆帕（GPa），介电常数小于2.7的介电材料，介电损耗小于0.002，击穿电压强度超过2百万伏/厘米（ MV / cm），温度稳定度为3000摄氏度，缺陷密度小于0.5 /厘米，薄膜中大小不超过50埃的针孔，并且能够在厚度均匀度小于或等于3维的3D结构下保形地沉积 至10％。

公开(公告)号：US08173906B2

公开(公告)日：2012-05-08

申请号：US11848891

申请日：2007-08-31

申请人： John M. Bedinger ,  Michael A. Moore

发明人： John M. Bedinger ,  Michael A. Moore

IPC分类号： H05K1/00

CPC分类号： H05K3/284 ,  H01L23/3192 ,  H01L23/4821 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/1322 ,  Y10T29/49124 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49982 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014

摘要： According to one embodiment of the disclosure, an environmental protection coating comprises a circuit assembly having a first protective dielectric layer and a second dielectric layer. The circuit assembly has an outer surface on which a plurality of discrete electrical components are attached. The first protective dielectric layer overlays the circuit assembly. The second dielectric layer overlays the first protective dielectric layer and is made of a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), dielectric constant less than 2.7, dielectric loss less than 0.008, breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), temperature stability to 300° Celsius, defect densities less than 0.5/centimeter, pinhole free in films greater than 50 Angstroms, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.

摘要翻译： 根据本公开的一个实施例，环境保护涂层包括具有第一保护介电层和第二电介质层的电路组件。 电路组件具有附接有多个分立电气部件的外表面。 第一保护介电层覆盖电路组件。 第二电介质层覆盖第一保护介电层，并由弹性模量小于3.5千兆帕（GPa），介电常数小于2.7，介电损耗小于0.008的电介质材料制成，击穿电压强度超过2 百万伏/厘米（MV /厘米），温度稳定至300摄氏度，缺陷密度小于0.5厘米，薄膜中无针孔大于50埃，能够平滑地沉积在3D结构之上和之下，厚度均匀度小于或等于 等于10％。

公开(公告)号：US20090290314A1

公开(公告)日：2009-11-26

申请号：US12533448

申请日：2009-07-31

申请人： John M. Bedinger ,  Michael A. Moore

发明人： John M. Bedinger ,  Michael A. Moore

IPC分类号： H05K1/18

CPC分类号： H05K3/284 ,  H01L23/3192 ,  H01L23/4821 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/1322 ,  Y10T29/49124 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49982 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014

摘要： A circuit board assembly includes a circuit board having an outer surface, the outer surface being configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a domed lid enclosure disposed over one of the plurality of discrete electrical components and an additional dielectric coating overlying the outer surface and the domed lid enclosure.

摘要翻译： 电路板组件包括具有外表面的电路板，所述外表面配置有彼此独立制造的多个分立电气部件。 电路板组件还包括设置在多个离散电气部件中的一个上的圆顶形盖子外壳和覆盖外表面和圆顶形盖子外壳的附加电介质涂层。