摘要:
A method for identifying and modifying, in a VLSI hierarchical chip design, parent buffer placements which lead to wiring track inefficiencies with respect to data flow and the parent placement area geometry. Parent placement area is reviewed and a subset is categorized and distinguished as either horizontal slots or vertical slots. Buffer to buffer data flow is reviewed for cases where data flow direction is either strongly horizontal or strongly vertical. Situations where buffer to buffer data flow is oriented in the same direction as the parent placement slots in which the buffers reside are reported. Additionally, an attempt is made to find a valid placement location for the buffers excluding parent placement areas oriented in the same direction as the data flow.
摘要:
A method for identifying and modifying, in a VLSI hierarchical chip design, parent buffer placements which lead to wiring track inefficiencies with respect to data flow and the parent placement area geometry. Parent placement area is reviewed and a subset is categorized and distinguished as either horizontal slots or vertical slots. Buffer to buffer data flow is reviewed for cases where data flow direction is either Strongly horizontal or strongly vertical. Situations where buffer to buffer data flow is oriented in the same direction as the parent placement slots in which the buffers reside are reported, Additionally, an attempt is made to find a valid placement location for the buffers excluding parent placement areas oriented in the same direction as the data flow.
摘要:
A semiconductor device and method of manufacturing has a substrate having a plurality of metal layers. At least one metal layer is exposed on at least one side surface of the semiconductor device. A die is coupled to the substrate. A mold compound encapsulates the die and a top surface of the substrate. A conductive coating is applied to the mold compound and to at least one metal layer exposed on at least one side surface of the substrate.
摘要:
An interconnect structure (i.e., an interposer) which is mounted and electrically connected to a bottom semiconductor package substrate either prior or subsequent to such bottom substrate being populate with one or more electronic components. Subsequently, a top semiconductor package substrate which may also be populated with one or more electronic components is mounted to the interposer, such that all of the electronic components are disposed between the top and bottom interposers. Thereafter, a suitable mold compound is injected between the top and bottom substrates, the mold compound flowing about the electronic components, between the BGA joints, and at least partially about the interposer, thus helping to lock the interposer in place in the completed semiconductor package.
摘要:
Components are inserted into a cell-based current chin design with multiple levels of nested hierarchy. A selection of components having various silicon densities to insert into the current chip design is received. The components are inserted into the current chip design such that the components do not touch or overlap existing circuits or silicon shapes in the current chip design. The components are inserted such that components having highest silicon densities are placed further away from the existing circuits or silicon shapes than components having lower silicon densities.
摘要:
A method for optimizing scan chains in an integrated circuit that has multiple levels of hierarchy addresses unlimited chains and stumps and separately all other chains and stumps. Unlimited chains and stumps are optimized by dividing an area encompassed by the chains and by a start point and an end point of the stump into a grid comprised of a plurality of grid boxes, and determining a grid box to grid box connectivity route to access all of the grid boxes between the start point and the end point by means of a computer running a routing algorithm. All other chains and stumps are optimized randomly assigning to a stump a chain that can be physically reached by that stump and adding an additional chain to that stump based on the number of latches in the additional chain, its physical location, and the number of latches already assigned.
摘要:
A semiconductor device has a substrate having a plurality of metal layers. A die is coupled to the substrate. A plurality of metal wires is provided. At least one end of each of the metal wires is electrically coupled to at least one metal layer. A mold compound is used to encapsulate the die, a first surface of the substrate, and the plurality of metal wires. A portion of at least one metal wire remains exposed. A conductive coating is applied to the mold compound and to the portion of the at least one metal wire exposed.
摘要:
A semiconductor device has a substrate comprising at least one dielectric layer and at least one metal layer on a first surface of the substrate. A die is attached to the first surface of the substrate. A mold compound is used to encapsulate the die and partially encapsulate the first surface of the substrate. The mold compound has a protrusion proximate to the at least one metal layer. A conductive material covers the mold compound, including the protrusion, and contacts the at least one metal layer.
摘要:
A system and method in which the receiving chip separately latches each half of the data received from the double data rate bus. Each half is launched as soon as it is available; one on the normal chip cycle time and the other is launched from a Master (L1) latch a half cycle into the normal chip cycle time. The first launched half of the data proceeds through the chip along its standard design chip path to be captured by the chips driving interface latch and launched again after one cycle of latency on the chip. The second half of the data proceeds through the chip one half cycle behind the first half, and is latched a half clock cycle later part way through the path into a Slave (L2) latch. On the next edge of the local clock, the data then continues from the L2 latch to the driving double data rate interface. This allows a half cycle set up time for the second half of the data so that it can be launched again, maintaining a one-cycle time on the chip.
摘要:
A method for pre-wiring through multiple levels of metal using flues includes steps of: receiving information comprising flue geometries and flue properties; producing multiple routing patterns of a design for the flues; identifying macro instance terminals to be pre-wired in the design; selecting at least one of the routing patterns for the macro instance terminals in the design to avoid blockage; and instantiating the design such that the flues can be manipulated as vias.