公开(公告)号：US20130213561A1

公开(公告)日：2013-08-22

申请号：US13797521

申请日：2013-03-12

申请人： Jun UTSUMI ,  Takayuki Goto ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

发明人： Jun UTSUMI ,  Takayuki Goto ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

IPC分类号： H01L21/20

CPC分类号： H01L21/2007 ,  C03C27/06 ,  H01L24/28 ,  H01L24/31 ,  H01L24/75 ,  H01L24/83 ,  H01L31/0203 ,  H01L33/0079 ,  H01L2224/83099 ,  H01L2224/8385 ,  H01L2224/83894 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3512 ,  H01L2924/00

摘要： A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.

摘要翻译： 一种器件设置有：主要包含二氧化硅的第一衬底; 主要含有硅，化合物半导体，二氧化硅或氟化物的第二衬底; 以及布置在所述第一基板和所述第二基板之间的接合功能中间层。 通过室温接合将第一衬底接合到第二衬底，其中第一衬底的溅射的第一表面经由接合功能中间层与第二衬底的溅射的第二表面接触。 这里，接合功能中间层的材料选自氧化物，氟化物或氮化物的光学透明材料，该材料不同于第一衬底的主要成分并且不同于第二衬底的主要成分。

公开(公告)号：US20100000663A1

公开(公告)日：2010-01-07

申请号：US12438346

申请日：2007-09-06

申请人： Takayuki Goto ,  Jun Utsumi ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

发明人： Takayuki Goto ,  Jun Utsumi ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

IPC分类号： C23C14/34 ,  B32B37/00

CPC分类号： H01L21/2007 ,  B23K20/02 ,  B23K20/16 ,  B23K20/24 ,  B23K2101/36 ,  C23C14/16 ,  C23C14/3464 ,  C23C14/46

摘要： A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.

摘要翻译： 一种经由中间构件将多个基板室温接合的方法包括：通过物理地溅射多个靶材，在所述基板的待结合面上形成中间部件; 并通过离子束激活待结合的表面。 在这种情况下，优选由多种材料构成的靶物质溅射。 由于中间构件的材料从从基板的待粘合表面排列在各个方向上的多个靶溅射，所以中间构件可以均匀地形成在待粘合的表面上。 此外，由于中间构件由多种材料组成，所以当中间构件由单一材料构成时难以粘合的基板的室温结合可以在不加热和过度压制基板的情况下进行 粘接。

公开(公告)号：US08608048B2

公开(公告)日：2013-12-17

申请号：US13102778

申请日：2011-05-06

申请人： Takayuki Goto ,  Jun Utsumi ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

发明人： Takayuki Goto ,  Jun Utsumi ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

IPC分类号： B23K20/00 ,  B23K20/08 ,  B23K37/00

CPC分类号： H01L21/2007 ,  B23K20/02 ,  B23K20/16 ,  B23K20/24 ,  B23K2101/36 ,  C23C14/16 ,  C23C14/3464 ,  C23C14/46

摘要： A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.

摘要翻译： 一种经由中间构件将多个基板室温接合的方法包括：通过物理地溅射多个靶材，在所述基板的待结合面上形成中间部件; 并通过离子束激活待结合的表面。 在这种情况下，优选由多种材料构成的靶物质溅射。 由于中间构件的材料从从基板的待粘合表面排列在各个方向上的多个靶溅射，所以中间构件可以均匀地形成在待粘合的表面上。 此外，由于中间构件由多种材料组成，所以当中间构件由单一材料构成时难以粘合的基板的室温结合可以在不加热和过度压制基板的情况下进行 粘接。

公开(公告)号：US08936998B2

公开(公告)日：2015-01-20

申请号：US13797521

申请日：2013-03-12

申请人： Jun Utsumi ,  Takayuki Goto ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

发明人： Jun Utsumi ,  Takayuki Goto ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

IPC分类号： H01L21/30 ,  H01L21/302 ,  H01L21/324 ,  H01L21/20 ,  H01L23/00 ,  H01L31/0203

CPC分类号： H01L21/2007 ,  C03C27/06 ,  H01L24/28 ,  H01L24/31 ,  H01L24/75 ,  H01L24/83 ,  H01L31/0203 ,  H01L33/0079 ,  H01L2224/83099 ,  H01L2224/8385 ,  H01L2224/83894 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3512 ,  H01L2924/00

摘要： A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.

摘要翻译： 一种器件设置有：主要包含二氧化硅的第一衬底; 主要含有硅，化合物半导体，二氧化硅或氟化物的第二衬底; 以及布置在所述第一基板和所述第二基板之间的接合功能中间层。 通过室温接合将第一衬底接合到第二衬底，其中第一衬底的溅射的第一表面经由接合功能中间层与第二衬底的溅射的第二表面接触。 这里，接合功能中间层的材料选自氧化物，氟化物或氮化物的光学透明材料，该材料不同于第一衬底的主要成分并且不同于第二衬底的主要成分。

公开(公告)号：US20110214816A1

公开(公告)日：2011-09-08

申请号：US13102778

申请日：2011-05-06

申请人： Takayuki Goto ,  Jun Utsumi ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

发明人： Takayuki Goto ,  Jun Utsumi ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

IPC分类号： B29C65/14

CPC分类号： H01L21/2007 ,  B23K20/02 ,  B23K20/16 ,  B23K20/24 ,  B23K2101/36 ,  C23C14/16 ,  C23C14/3464 ,  C23C14/46

摘要： A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.

摘要翻译： 一种经由中间构件将多个基板室温接合的方法包括：通过物理地溅射多个靶材，在所述基板的待结合面上形成中间部件; 并通过离子束激活待结合的表面。 在这种情况下，优选由多种材料构成的靶物质溅射。 由于中间构件的材料从从基板的待粘合表面排列在各个方向上的多个靶溅射，所以中间构件可以均匀地形成在待粘合的表面上。 此外，由于中间构件由多种材料组成，所以当中间构件由单一材料构成时难以粘合的基板的室温结合可以在不加热和过度压制基板的情况下进行 粘接。

公开(公告)号：US20100276723A1

公开(公告)日：2010-11-04

申请号：US12741916

申请日：2008-10-14

申请人： Jun Utsumi ,  Takayuki Goto ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

发明人： Jun Utsumi ,  Takayuki Goto ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

IPC分类号： H01L33/48 ,  H01L31/02 ,  B32B38/00

CPC分类号： H01L21/2007 ,  C03C27/06 ,  H01L24/28 ,  H01L24/31 ,  H01L24/75 ,  H01L24/83 ,  H01L31/0203 ,  H01L33/0079 ,  H01L2224/83099 ,  H01L2224/8385 ,  H01L2224/83894 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3512 ,  H01L2924/00

摘要： A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.

摘要翻译： 一种器件设置有：主要包含二氧化硅的第一衬底; 主要含有硅，化合物半导体，二氧化硅或氟化物的第二衬底; 以及布置在所述第一基板和所述第二基板之间的接合功能中间层。 通过室温接合将第一衬底接合到第二衬底，其中第一衬底的溅射的第一表面经由接合功能中间层与第二衬底的溅射的第二表面接触。 这里，接合功能中间层的材料选自氧化物，氟化物或氮化物的光学透明材料，该材料不同于第一衬底的主要成分并且不同于第二衬底的主要成分。

公开(公告)号：US08602289B2

公开(公告)日：2013-12-10

申请号：US12438346

申请日：2007-09-06

申请人： Takayuki Goto ,  Jun Utsumi ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

发明人： Takayuki Goto ,  Jun Utsumi ,  Kensuke Ide ,  Hideki Takagi ,  Masahiro Funayama

IPC分类号： B23K20/12 ,  B23K31/02 ,  B23K1/20 ,  C23C14/00

CPC分类号： H01L21/2007 ,  B23K20/02 ,  B23K20/16 ,  B23K20/24 ,  B23K2101/36 ,  C23C14/16 ,  C23C14/3464 ,  C23C14/46

摘要： A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. Preferably, the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.

摘要翻译： 一种经由中间构件将多个基板室温接合的方法包括：通过物理地溅射多个靶材，在所述基板的待结合面上形成中间部件; 并通过离子束激活待结合的表面。 优选地，物理地溅射由多种类型的材料构成的靶。 由于中间构件的材料从从基板的待粘合表面排列在各个方向上的多个靶溅射，所以中间构件可以均匀地形成在待粘合的表面上。 此外，由于中间构件由多种材料组成，所以当中间构件由单一材料构成时难以粘合的基板的室温结合可以在不加热和过度压制基板的情况下进行 粘接。

公开(公告)号：US20100092786A1

公开(公告)日：2010-04-15

申请号：US12302873

申请日：2007-05-30

申请人： Jun Utsumi ,  Takayuki Goto ,  Kensuke Ide ,  Masahiro Funayama ,  Hideki Takagi

发明人： Jun Utsumi ,  Takayuki Goto ,  Kensuke Ide ,  Masahiro Funayama ,  Hideki Takagi

IPC分类号： B32B17/06 ,  B32B15/04 ,  B32B38/00 ,  B32B43/00

CPC分类号： B32B38/0008 ,  B23K20/02 ,  B23K20/22 ,  B32B37/14 ,  B32B2457/00 ,  B81C3/001 ,  B81C2203/032 ,  C23C14/14 ,  C23C14/3414 ,  C23C14/58 ,  Y10T428/31678

摘要： An inter-substrate material layer is formed between a first substrate and a second substrate to generate a bonding strength. A plurality of metal elements are present in the inter-substrate material layer. An interface element existence ratio of the plurality of metal elements is 0.07 or above. A device can be obtained in which substrates difficult to bond (for example, SiO2 substrates) are bonded at room-temperature to have practical bonding strength.

摘要翻译： 在第一基板和第二基板之间形成基板间材料层以产生粘结强度。 多个金属元素存在于基板间材料层中。 多个金属元素的界面元素存在比为0.07以上。 可以获得在室温下难以接合的基板（例如，SiO 2基板）结合以具有实际的接合强度的装置。

公开(公告)号：US09005390B2

公开(公告)日：2015-04-14

申请号：US13530714

申请日：2012-06-22

申请人： Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Satoshi Tawara ,  Jun Utsumi ,  Yoichiro Tsumura ,  Kensuke Ide ,  Takenori Suzuki

发明人： Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Satoshi Tawara ,  Jun Utsumi ,  Yoichiro Tsumura ,  Kensuke Ide ,  Takenori Suzuki

IPC分类号： B29C65/00 ,  B32B37/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/673 ,  H01L21/68 ,  H01L21/683

CPC分类号： H01L21/67778 ,  H01L21/67092 ,  H01L21/6732 ,  H01L21/67748 ,  H01L21/68 ,  H01L21/683 ,  Y10T156/1744

摘要： A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.

摘要翻译： 室温接合装置包括角度调节装置，支撑保持第一基板的第一样品台，以便能够改变第一样品台的方向; 第一驱动装置，其沿第一方向驱动第一级; 第二驱动装置，驱动在不与第一方向平行的第二方向上保持第二基板的第二样品台; 以及当所述第二基板和所述第一基板接触时，在所述第一方向上支撑所述第二样品台的托架支撑台。 该装置可以施加超过第二驱动装置的耐受负载的负载在第一和第二基板上。 此外，该装置使用角度调节装置来改变与第二基板平行的第一基板的方向，并将较大的负载均匀地施加在接合表面上。

公开(公告)号：US08985175B2

公开(公告)日：2015-03-24

申请号：US12811177

申请日：2008-09-29

申请人： Masato Kinouchi ,  Takayuki Goto ,  Satoshi Tawara ,  Takeshi Tsuno ,  Jun Utsumi ,  Kensuke Ide ,  Takenori Suzuki

发明人： Masato Kinouchi ,  Takayuki Goto ,  Satoshi Tawara ,  Takeshi Tsuno ,  Jun Utsumi ,  Kensuke Ide ,  Takenori Suzuki

IPC分类号： B32B37/10 ,  B23K20/02

CPC分类号： B32B37/1009 ,  B23K20/02 ,  B32B37/10 ,  B32B2309/68 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/67092 ,  H01L21/67253

摘要： A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus cleans first and second substrates in the chamber when said pressure is at a predetermined degree of vacuum. The pressure controller controls both of the evacuation apparatus and the gas supply apparatus so that the pressure is regulated to a target pressure. The pressing mechanism presses and bonds the first and second substrates when the pressure is set to said target pressure.

摘要翻译： 室温粘合机设置有排气装置，气体供给装置，压力计，清洁装置，压力控制器和按压机构。 抽空装置从室抽出气体。 气体供给装置将引入气体供给到室内。 压力表测量室内的压力。 当所述压力处于预定的真空度时，清洁器装置清洗腔室中的第一和第二基板。 压力控制器控制排气装置和气体供给装置，使得压力被调节到目标压力。 当压力设定为所述目标压力时，按压机构按压并结合第一和​​第二基板。