ORGANIC MOLECULAR MEMORY
    1.
    发明申请
    ORGANIC MOLECULAR MEMORY 有权
    有机分子记忆

    公开(公告)号:US20160087202A1

    公开(公告)日:2016-03-24

    申请号:US14842052

    申请日:2015-09-01

    IPC分类号: H01L45/00

    摘要: An organic molecular memory in an embodiment includes a first conductive layer; a second conductive layer; and an organic molecular layer provided between the first conductive layer and the second conductive layer, the organic molecular layer including an organic molecule having an oligophenylene ethynylene backbone, the oligophenylene ethynylene backbone including three or more benzene rings, and the oligophenylene ethynylene backbone including two fluorine atoms added in ortho positions or meta positions of one of the benzene rings other than benzene rings at both ends.

    摘要翻译: 实施方案中的有机分子存储器包括第一导电层; 第二导电层; 以及设置在所述第一导电层和所述第二导电层之间的有机分子层,所述有机分子层包含具有低亚乙烯基亚乙炔主链的有机分子,所述低亚苯基亚乙炔主链包含三个以上的苯环,所述低聚亚乙炔主链包括两个氟 在两个苯环之外的苯环之一的邻位置或间位加成原子。

    METHOD FOR MANUFACTURING MEMORY DEVICE AND METHOD FOR MANUFACTURING METAL WIRING
    3.
    发明申请
    METHOD FOR MANUFACTURING MEMORY DEVICE AND METHOD FOR MANUFACTURING METAL WIRING 有权
    用于制造存储器件的方法和用于制造金属布线的方法

    公开(公告)号:US20160087206A1

    公开(公告)日:2016-03-24

    申请号:US14842234

    申请日:2015-09-01

    IPC分类号: H01L45/00

    摘要: A method for manufacturing a memory device of an embodiment includes: forming on a substrate a block copolymer layer which contains a first polymer and a second polymer having lower surface energy than that of the first polymer; performing thermal treatment on the block copolymer layer, to separate the block copolymer layer such that a first phase containing the first polymer and extending in the first direction and a second phase containing the second polymer and extending in the first direction are alternately arrayed; selectively forming on the first phase a first metal wiring layer extending in the first direction; forming on the first metal wiring layer a memory layer where resistance changes by application of a voltage; and forming on the memory layer a second metal wiring layer which extends in a second direction intersecting in the first direction.

    摘要翻译: 一种实施方式的存储器件的制造方法包括:在基板上形成嵌段共聚物层,该嵌段共聚物层含有比第一聚合物低的表面能的第一聚合物和第二聚合物; 对嵌段共聚物层进行热处理,以分离嵌段共聚物层,使得包含第一聚合物并在第一方向上延伸的第一相和含有第二聚合物并且沿第一方向延伸的第二相交替排列; 在第一相上选择性地形成沿第一方向延伸的第一金属布线层; 在第一金属布线层上形成通过施加电压而电阻变化的存储层; 以及在所述存储层上形成沿与所述第一方向相交的第二方向延伸的第二金属布线层。

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体发光器件及其制造方法

    公开(公告)号:US20150311393A1

    公开(公告)日:2015-10-29

    申请号:US14741789

    申请日:2015-06-17

    摘要: According to one embodiment, a semiconductor light emitting device includes a structure, a first electrode layer, and a second electrode layer. The structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The first electrode layer is provided on the first semiconductor layer side of the structure. The first electrode layer is made of metal and contains a portion contacting the first semiconductor layer. The second electrode layer is provided on the second semiconductor layer side of the structure. The second electrode layer has a metal portion with a thickness of not less than 10 nanometers and not more than 50 nanometers, and a plurality of openings piercing the metal portion, each of the openings having an equivalent circle diameter of not less than 10 nanometers and not more than 5 micrometers.

    摘要翻译: 根据一个实施例,半导体发光器件包括结构,第一电极层和第二电极层。 该结构包括第一半导体层,第二半导体层和设置在第一半导体层和第二半导体层之间的发光层。 第一电极层设置在该结构的第一半导体层一侧。 第一电极层由金属制成并且包含接触第一半导体层的部分。 第二电极层设置在该结构的第二半导体层一侧。 第二电极层具有厚度不小于10纳米且不大于50纳米的金属部分,并且穿过金属部分的多个开口,每个开口的当量圆直径不小于10纳米, 不超过5微米。

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    10.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体发光器件及其制造方法

    公开(公告)号:US20140349421A1

    公开(公告)日:2014-11-27

    申请号:US14455540

    申请日:2014-08-08

    IPC分类号: H01L33/40

    摘要: According to one embodiment, a semiconductor light emitting device includes a structure including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The device also includes an electrode layer provided on the second semiconductor layer side of the structure. The electrode layer includes a metal portion with a thickness of not less than 10 nanometers and not more than 100 nanometers. A plurality of openings pierces the metal portion, each of the openings having an equivalent circle diameter of not less than 10 nanometers and not more than 5 micrometers. The device includes an inorganic film providing on the metal portion and inner surfaces of the openings, the inorganic film having transmittivity with respect to light emitted from the light emitting layer.

    摘要翻译: 根据一个实施例,半导体发光器件包括包括第一导电类型的第一半导体层,第二导电类型的第二半导体层和设置在第一半导体层和第二半导体层之间的发光层的结构。 该器件还包括设置在该结构的第二半导体层侧上的电极层。 电极层包括厚度不小于10纳米且不大于100纳米的金属部分。 多个开口刺穿金属部分,每个开口具有不小于10纳米且不大于5微米的等效圆直径。 所述装置包括在所述金属部分和所述开口的内表面上提供的无机膜,所述无机膜相对于从所述发光层发射的光具有透射率。