PLASMA DISINFECTION DEVICE
    1.
    发明申请

    公开(公告)号:US20220299221A1

    公开(公告)日:2022-09-22

    申请号:US17465139

    申请日:2021-09-02

    IPC分类号: F24F8/20 F24F8/95 F24F13/30

    摘要: A plasma disinfection device of an embodiment includes: an electrical dust collector including a plurality of heat exchange fins, a needle electrode which causes a discharge in a gas flow flowing between the plurality of heat exchange fins, and a direct-current power supply electrically connected to the needle electrode; and a plasma generator including a dielectric provided on each of facing surfaces of the plurality of heat exchange fins, a discharge electrode provided to be exposed on a surface of the dielectric and arranged to cross a direction of flow of the gas flow, and an alternating-current power supply electrically connected to the discharge electrode.

    PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
    2.
    发明申请
    PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD 审中-公开
    等离子体加工设备和等离子体处理方法

    公开(公告)号:US20160027619A1

    公开(公告)日:2016-01-28

    申请号:US14804913

    申请日:2015-07-21

    IPC分类号: H01J37/32 C23C16/50

    摘要: A plasma processing apparatus of an embodiment includes a chamber, an introducing part, a substrate electrode, a high-frequency power source, a low-frequency power source, and a switching mechanism. The introducing part introduces a process gas into the chamber. The substrate electrode is disposed in the chamber, a substrate is directly or indirectly mounted on the substrate electrode, and the substrate electrode includes a first and a second electrode elements alternately arranged. The high-frequency power source outputs a high-frequency voltage of 40 MHz or more for ionizing the process gas to generate plasma. The low-frequency power source outputs a low-frequency voltage of 20 MHz or less for introducing ions from the plasma. The switching mechanism applies the low-frequency voltage alternately to the first and the second electrode elements.

    摘要翻译: 实施例的等离子体处理装置包括室,引入部,基板电极,高频电源,低频电源和切换机构。 引入部分将工艺气体引入室中。 衬底电极设置在腔室中,衬底直接或间接安装在衬底电极上,并且衬底电极包括交替布置的第一和第二电极元件。 高频电源输出40MHz或更高的高频电压,用于电离工艺气体以产生等离子体。 低频电源输出20MHz以下的低频电压,从等离子体引出离子。 切换机构将低频电压交替地施加到第一和第二电极元件。

    Gas Processing Apparatus
    5.
    发明申请
    Gas Processing Apparatus 审中-公开
    气体处理装置

    公开(公告)号:US20170007958A1

    公开(公告)日:2017-01-12

    申请号:US15204229

    申请日:2016-07-07

    摘要: A gas processing apparatus of an embodiment has stacks, gas flow paths, an AC power supply, and a flow limiter. The stacks are away from each other and in parallel. Each stack includes a dielectric substrate and a first to a third electrode. The first and second electrodes are respectively disposed on the first and second main surfaces of the dielectric substrate. The third electrode is disposed inside the dielectric substrates. The gas flow paths supply a target gas between the stacks, The AC power supply applies an AC voltage across the first and second electrodes and the third electrodes, so as to generate plasma induced flows of the target gas between the dielectric substrates. The flow limiter is disposed on a downstream side of the stacks and limits a flow rate of the target gas.

    摘要翻译: 实施例的气体处理装置具有堆叠,气体流路,AC电源和流量限制器。 堆叠彼此远离并且平行。 每个堆叠包括电介质基板和第一至第三电极。 第一和第二电极分别设置在电介质基板的第一和第二主表面上。 第三电极设置在电介质基板的内部。 气体流动路径在堆叠之间提供目标​​气体.AC电源施加跨越第一和第二电极和第三电极的AC电压,以便在电介质基板之间产生目标气体的等离子体感应流。 流量限制器设置在堆叠的下游侧并限制目标气体的流量。

    Plasma Processing Apparatus and Plasma Processing Method

    公开(公告)号:US20180012768A1

    公开(公告)日:2018-01-11

    申请号:US15440043

    申请日:2017-02-23

    摘要: A plasma processing, apparatus of an embodiment includes a chamber, an introducing part, a first power source, a holder, an electrode, and a second power source. The introducing pat introduces gas into the chamber. The first power source outputs a first voltage for generating ions from the gas. The holder holds a substrate. The electrode is opposite to the ions across the substrate, and has a surface not parallel to the substrate. The second power source applies a second voltage to the electrode. The second voltage has a frequency lower than the frequency of the first voltage and Introduces die ions to the substrate.

    GAS PROCESSING APPARATUS
    8.
    发明申请

    公开(公告)号:US20190282722A1

    公开(公告)日:2019-09-19

    申请号:US16111396

    申请日:2018-08-24

    摘要: A gas processing apparatus of an embodiment includes a gas processing unit, a flow forming unit, an AC power supply, and first and second filters. The gas processing unit includes a plurality of stacks each having a dielectric substrate, a first to a third electrode. The flow forming unit forms a flow of a target gas flowing toward the gas processing unit. The AC power supply applies an AC voltage across the first, second electrodes and the third electrode so as to generate plasma induced flows of the target gas between the dielectric substrates. The first filter is disposed at an upstream of the gas processing unit, and removes ozone. The second filter is disposed at a downstream of the gas processing unit, and removes ozone.