MEMORY DEVICE
    5.
    发明申请

    公开(公告)号:US20250095737A1

    公开(公告)日:2025-03-20

    申请号:US18789095

    申请日:2024-07-30

    Abstract: According to one embodiment, a memory device includes: a first semiconductor and a first insulator provided at a first position in a first direction intersecting a substrate; a first conductor extending in the first direction and having a first portion facing the first semiconductor without interposing the first insulator and a second portion facing the first insulator without interposing the first semiconductor; and a first charge storage film provided between the first portion and the first semiconductor and not provided between the second portion and the first insulator.

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