公开(公告)号：US07061103B2

公开(公告)日：2006-06-13

申请号：US10707684

申请日：2004-01-05

申请人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

发明人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

IPC分类号： H01L23/22 ,  H01L23/34

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is flip-chip bonded and electrically connected to the carrier or another chip. There is a flip-chip bonding gap between the chip and the carrier or other chips. A heat sink is positioned on the uppermost chip. The encapsulating material layer fills the flip-chip bonding gap as well as a gap between the uppermost chip and the heat sink. A part of the surface of the heat sink away from the upper-most chip is exposed. Furthermore, the encapsulating material layer is formed in a simultaneous molding process. For example, the chip is separated from the heat sink by a distance between 0.03˜0.2 mm, and the encapsulating material has a thermal conductivity greater than 1.2 W/m.K.

摘要翻译： 公开了一种芯片封装结构。 芯片封装结构基本上包括载体，一个或多个芯片，散热器和封装材料层。 芯片中的至少一个被倒装芯片结合并电连接到载体或另一个芯片。 在芯片和载体或其他芯片之间存在倒装芯片接合间隙。 散热器位于最上面的芯片上。 封装材料层填充倒装芯片接合间隙以及最上面的芯片和散热器之间的间隙。 离开最上面的芯片的散热器表面的一部分被暴露。 此外，封装材料层以同时成型工艺形成。 例如，将芯片与散热器隔开0.03〜0.2mm的距离，封装材料的导热率大于1.2W / m·K。

公开(公告)号：US20050087852A1

公开(公告)日：2005-04-28

申请号：US10707683

申请日：2004-01-05

申请人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro FUKUI ,  Tomoaki NEMOTO

发明人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro FUKUI ,  Tomoaki NEMOTO

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L21/48 ,  H01L23/02

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure and a process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. To fabricate the chip package, a carrier and a plurality of chips are provided. Each chip has at least an active surface with a plurality of bumps thereon. The chips and the carrier are electrically connected. An encapsulating material layer that fills the bonding gap between the chips and the carriers and covers the chips and carrier is formed. The encapsulating material layer between the chips and the carrier has a first thickness and the encapsulating material layer over the chips has a second thickness. The second thickness has a value between half to twice the first thickness.

摘要翻译： 公开了一种芯片封装结构及其制造方法。 芯片封装结构主要包括载体，芯片和封装材料层。 为了制造芯片封装，提供了载体和多个芯片。 每个芯片至少具有在其上具有多个凸块的活性表面。 芯片和载体电连接。 形成填充芯片和载体之间的接合间隙并覆盖芯片和载体的封装材料层。 芯片和载体之间的封装材料层具有第一厚度，并且芯片上的封装材料层具有第二厚度。 第二厚度具有在第一厚度的一半到两倍之间的值。

公开(公告)号：US07230331B2

公开(公告)日：2007-06-12

申请号：US10707683

申请日：2004-01-05

申请人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

发明人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

IPC分类号： H01L23/22 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure and a process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. To fabricate the chip package, a carrier and a plurality of chips are provided. Each chip has at least an active surface with a plurality of bumps thereon. The chips and the carrier are electrically connected. An encapsulating material layer that fills the bonding gap between the chips and the carriers and covers the chips and carrier is formed. The encapsulating material layer between the chips and the carrier has a first thickness and the encapsulating material layer over the chips has a second thickness. The second thickness has a value between half to twice the first thickness.

摘要翻译： 公开了一种芯片封装结构及其制造方法。 芯片封装结构主要包括载体，芯片和封装材料层。 为了制造芯片封装，提供了载体和多个芯片。 每个芯片至少具有在其上具有多个凸块的活性表面。 芯片和载体电连接。 形成填充芯片和载体之间的接合间隙并覆盖芯片和载体的封装材料层。 芯片和载体之间的封装材料层具有第一厚度，并且芯片上的封装材料层具有第二厚度。 第二厚度具有在第一厚度的一半到两倍之间的值。

公开(公告)号：US07057277B2

公开(公告)日：2006-06-06

申请号：US10707686

申请日：2004-01-05

申请人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

发明人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

IPC分类号： H01L23/34

CPC分类号： H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/48237 ,  H01L2224/0401 ,  H01L2924/00012

摘要： A chip package structure is disclosed. The chip package structure essentially comprises a carrier, one or more chips, a heat sink and an encapsulating material layer. At least one of the chips is bonded and electrically connected to the carrier or another chip using a flip-chip bonding technique. A flip-chip bonding gap is set up between the chip and he carrier or other chips. The heat sink is set up over the top chip. The heat sink has an area bigger than the chip. The encapsulating material layer fills up the flip-chip bonding gap and covers the carrier as well as the heat sink. The encapsulating material layer is formed in a simultaneous molding process and has a thermal conductivity more than 1.2 W/m.K. Furthermore, a plurality of standoff components may be selectively positioned on the heat sink.

摘要翻译： 公开了一种芯片封装结构。 芯片封装结构基本上包括载体，一个或多个芯片，散热器和封装材料层。 使用倒装芯片接合技术将至少一个芯片接合并电连接到载体或另一个芯片。 在芯片和载体或其他芯片之间建立了倒装芯片接合间隙。 散热器设置在顶级芯片上。 散热器的面积大于芯片。 封装材料层填充倒装芯片接合间隙并覆盖载体以及散热器。 封装材料层在同时成型工艺中形成并具有大于1.2W / m·K的导热系数。 此外，多个间隔部件可以选择性地定位在散热器上。

公开(公告)号：US20070072339A1

公开(公告)日：2007-03-29

申请号：US11309106

申请日：2006-06-23

申请人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

发明人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

IPC分类号： H01L21/00

CPC分类号： H01L23/4334 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A process for fabricating a chip package structure is disclosed. To fabricate the chip package structure, a carrier and a plurality of chips are provided. Each chip has an active surface and at least one of the active surfaces has a plurality of bumps thereon. The chips and the carrier are electrically connected together. Thereafter, a heat sink is attached to the back of the chips and then at least one heat-resistant buffering film is formed over part of the heat sink surface. An encapsulating material layer is formed over the carrier and filling bonding gaps between the chips and the carrier. The encapsulating material within the bonding gaps has a thickness. The maximum diameter of particles constituting the encapsulating material layer is less than half of the said thickness.

摘要翻译： 公开了一种用于制造芯片封装结构的工艺。 为了制造芯片封装结构，提供了载体和多个芯片。 每个芯片具有活性表面，并且活性表面中的至少一个在其上具有多个凸块。 芯片和载体电连接在一起。 此后，将散热器附接到芯片的背面，然后在散热器表面的一部分上形成至少一个耐热缓冲膜。 在载体上形成封装材料层，并填充芯片和载体之间的接合间隙。 接合间隙内的封装材料具有厚度。 构成封装材料层的颗粒的最大直径小于所述厚度的一半。

公开(公告)号：US20060261499A1

公开(公告)日：2006-11-23

申请号：US11462369

申请日：2006-08-04

申请人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

发明人： Kai-Chi Chen ,  Shu-Chen Huang ,  Hsun-Tien Li ,  Tzong-Ming Lee ,  Taro Fukui ,  Tomoaki Nemoto

IPC分类号： H01L23/28

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure and a process for fabricating the same is disclosed. The chip package structure mainly comprises a carrier, a chip and an encapsulating material layer. To fabricate the chip package, a carrier and a plurality of chips are provided. Each chip has at least an active surface with a plurality of bumps thereon. The chips and the carrier are electrically connected. An encapsulating material layer that fills the bonding gap between the chips and the carriers and covers the chips and carrier is formed. The encapsulating material layer between the chips and the carrier has a first thickness and the encapsulating material layer over the chips has a second thickness. The second thickness has a value between half to twice the first thickness.

摘要翻译： 公开了一种芯片封装结构及其制造方法。 芯片封装结构主要包括载体，芯片和封装材料层。 为了制造芯片封装，提供了载体和多个芯片。 每个芯片至少具有在其上具有多个凸块的活性表面。 芯片和载体电连接。 形成填充芯片和载体之间的接合间隙并覆盖芯片和载体的封装材料层。 芯片和载体之间的封装材料层具有第一厚度，并且芯片上的封装材料层具有第二厚度。 第二厚度具有在第一厚度的一半到两倍之间的值。

公开(公告)号：US06627684B2

公开(公告)日：2003-09-30

申请号：US10025346

申请日：2001-12-18

申请人： Tzong-Ming Lee ,  Hsun-Tien Li ,  Kai-Chi Chen ,  Mei-Ling Chen

发明人： Tzong-Ming Lee ,  Hsun-Tien Li ,  Kai-Chi Chen ,  Mei-Ling Chen

IPC分类号： C08K310

CPC分类号： H05K3/4673 ,  C08G59/504 ,  C08K5/17 ,  C08L63/00 ,  H05K2201/0209 ,  H05K2203/066 ,  C08L2666/08

摘要： The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.

公开(公告)号：US08323553B2

公开(公告)日：2012-12-04

申请号：US12362080

申请日：2009-01-29

申请人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

发明人： Tzong-Ming Lee ,  Ruoh-Huey Uang ,  Kuo-Chan Chiou ,  Yu-Ming Wang ,  Yi-Ting Cheng

IPC分类号： B05D3/06 ,  B29C35/08 ,  B29C59/16

CPC分类号： H05K3/102 ,  B82Y10/00 ,  H05K3/381 ,  H05K2201/0129 ,  H05K2201/0257 ,  H05K2203/107 ,  H05K2203/128

摘要： A method for manufacturing a substrate with surface substrates by employing photothermal effect is described. Nanoparticles on the surface of the substrate excited by a beam convert light energy to thermal energy. The surface structure on the substrate is formed through the thermal energy generated by the excited nanoparticles. The substrate with plural pores is thus formed.

摘要翻译： 描述了通过使用光热效应制造具有表面基板的基板的方法。 由光束激发的衬底表面上的纳米颗粒将光能转换成热能。 通过激发的纳米粒子产生的热能形成衬底上的表面结构。 由此形成具有多个孔的基板。

公开(公告)号：US20070161729A1

公开(公告)日：2007-07-12

申请号：US11415610

申请日：2006-05-01

申请人： Kuo-Chan Chiou ,  Tzong-Ming Lee

发明人： Kuo-Chan Chiou ,  Tzong-Ming Lee

IPC分类号： C08K5/07 ,  C08K3/04

CPC分类号： C09K19/38 ,  B82Y30/00 ,  C08K3/04 ,  C08K2201/011 ,  C09K19/52

摘要： A composition for a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. The CNT-LC thermal composite structure is formed by using carbon nanotube with high thermal conductivity and liquid crystal polymer with the well-ordered structure. The thermal interface material thereby has a high thermal conductivity. The added amount of carbon nanotube is less than the added amount of metal or ceramic powders in the prior art for improving the dispersion process. The CNT-LC thermal composite structure and the phase change resin are compatible without phase separation. The thermal interface material has a phase change temperature about 45˜75° C. Any holes, gaps and dents on the surface of device are filled at the normal operating temperature of device to reduce the thermal resistance of the entire device.

摘要翻译： 提供了用于热界面材料的组合物。 解决了常规热界面材料中低热导率和高热阻的缺点。 CNT-LC热复合结构通过使用具有高导热性的碳纳米管和具有良好结构的液晶聚合物形成。 因此，热界面材料具有高导热性。 碳纳米管的添加量小于现有技术中用于改善分散过程的金属或陶瓷粉末的添加量。 CNT-LC热复合结构和相变树脂在不相分离的情况下是相容的。 热界面材料的相变温度约为45〜75°C。器件表面的任何孔，间隙和凹痕都会在器件的正常工作温度下填充，以降低整个器件的热阻。

公开(公告)号：US20070148469A1

公开(公告)日：2007-06-28

申请号：US11374697

申请日：2006-03-13

申请人： Feng-Po Tseng ,  Kuo-Chan Chiou ,  Tzong-Ming Lee ,  Syh-Yuh Cheng ,  Chih-Wei Hsu

发明人： Feng-Po Tseng ,  Kuo-Chan Chiou ,  Tzong-Ming Lee ,  Syh-Yuh Cheng ,  Chih-Wei Hsu

IPC分类号： B32B27/38 ,  B32B27/04 ,  C08L63/00 ,  B32B37/00

CPC分类号： C08G59/38 ,  C08L63/00 ,  G01L19/147 ,  Y10T428/31511

摘要： An encapsulation composition for pressure signal transmission including a flexible and low modulus epoxy resin as a substance in combination with plastic balls with pressure signal transmission properties as filler is provided. Therefore, the pressure signal is transmitted by utilizing the property of easy deformation of the flexible epoxy resin under pressure. And the effect of signal transmission is enhanced by the contact between plastic balls. The encapsulation composition is used in a sensor for transmitting pressure signals. The encapsulation composition is hydrophobic, so an electronic device of the sensor can be protected against moisture or water to extend its lifetime. Compared with traditional sensors using liquid for transmitting pressure signal, this sensor using solid encapsulation composition has advantages such as easy production and processing.

摘要翻译： 提供一种用于压力信号传输的包封组合物，其包括柔性和低模量环氧树脂作为与具有作为填料的压力信号传输性能的塑料球组合的物质。 因此，通过利用柔性环氧树脂在压力下容易变形的性质来传递压力信号。 并且通过塑料球之间的接触增强了信号传输的效果。 封装组合物用于传输压力信号的传感器中。 封装组合物是疏水性的，因此可以防止传感器的电子设备防止水分或水分延长其使用寿命。 与使用液体传输压力信号的传统传感器相比，采用固体封装组合的传感器具有生产加工容易等优点。