公开(公告)号：US20130334906A1

公开(公告)日：2013-12-19

申请号：US14001922

申请日：2011-05-20

申请人： Isao Sonoda ,  Yoshihito Asao ,  Mamoru Watanabe ,  Katsuhiko Omae ,  Tetsushi Watanabe

发明人： Isao Sonoda ,  Yoshihito Asao ,  Mamoru Watanabe ,  Katsuhiko Omae ,  Tetsushi Watanabe

IPC分类号： H02K5/22 ,  H02K7/116

CPC分类号： H02K5/225 ,  H02K7/116 ,  H02K7/1166 ,  H02K11/30 ,  H02K11/33

摘要： To obtain a drive unit integrated rotating electrical machine that makes it easier to connect power circuits and achieves not only excellent vibration resistance but also excellent heat releasing properties.Means for SolutionA drive unit integrated rotating electrical machine has a motor, a drive unit driving the motor under control and provided with power switching elements and conductors passing a current to the power switching elements, and a heat sink cooling the drive unit, which are combined into one unit. The drive unit integrated rotating electrical machine is characterized in that: the power switching elements are molded and formed into mold modules in a state in which terminals thereof are exposed; the conductors are insert-molded in a frame in a state in which terminals thereof are exposed; and the exposed terminals of the mold modules are connected to the exposed terminals of the insert-molded conductors and the mold modules are firmly fixed to the heat sink.

摘要翻译： 为了获得驱动单元集成旋转电机，能够更容易地连接电源电路，不仅具有优异的耐振动性，而且具有优异的散热特性。 解决方案的方案驱动单元集成旋转电机具有电动机，驱动单元驱动电动机控制并且设置有电力开关元件和将电流传递到电力开关元件的导体以及冷却驱动单元的散热器 组合成一个单位。 驱动单元集成旋转电机的特征在于：功率开关元件在其端子被暴露的状态下模制并形成模具模块; 导体在其端子露出的状态下嵌入成型在框架中; 并且模块模块的裸露端子连接到嵌入成型导体的裸露端子，并且模块模块牢固地固定到散热器。

公开(公告)号：US09129931B2

公开(公告)日：2015-09-08

申请号：US13989932

申请日：2011-04-27

申请人： Katsuhiko Omae ,  Mamoru Watanabe ,  Tetsushi Watanabe ,  Yoshihito Asao

发明人： Katsuhiko Omae ,  Mamoru Watanabe ,  Tetsushi Watanabe ,  Yoshihito Asao

IPC分类号： H01L23/34 ,  H01L23/367 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/367 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/371 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/73263 ,  H01L2224/8314 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84138 ,  H01L2224/84801 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A power semiconductor module includes: a plurality of first metal plates arranged in the same planar state; a power semiconductor chip mounted on the first metal plate; and an overbridge-shaped second metal plate which is composed of bridge frame sections and leg sections that support the bridge frame sections, the leg sections being for appropriately performing solder bonding between electrodes of the power semiconductor chips and between the electrode of the power semiconductor chip and the first metal plate, the power semiconductor module being configured by a resin package in which these members are sealed with electrically insulating resin. In the power semiconductor module, the solder bonding section of the leg section is formed in a planar shape by bending process and is provided at a position lower than the bridge frame section.

摘要翻译： 功率半导体模块包括：布置成相同平面状态的多个第一金属板; 安装在所述第一金属板上的功率半导体芯片; 以及跨桥状的第二金属板，其由支撑桥框架部的桥架部和支腿部构成，所述腿部用于适当地进行功率半导体芯片的电极之间和功率半导体芯片的电极之间的焊接 和第一金属板，功率半导体模块由树脂封装构成，其中这些构件用电绝缘树脂密封。 在功率半导体模块中，脚部的焊接部通过弯曲加工形成为平面状，并且设置在比桥框部低的位置。

公开(公告)号：US09888613B2

公开(公告)日：2018-02-06

申请号：US13817236

申请日：2011-04-25

申请人： Katsuhiko Omae ,  Yoshihito Asao

发明人： Katsuhiko Omae ,  Yoshihito Asao

IPC分类号： H02K7/20 ,  H05K7/20 ,  B62D5/04 ,  H02K5/22 ,  H02K7/116 ,  H02M7/00 ,  H01L23/00 ,  H02K11/33 ,  H02P29/68 ,  H01L23/48 ,  H01L23/498 ,  H02M7/797 ,  H02K9/22 ,  H02K11/02

CPC分类号： H05K7/2039 ,  B62D5/0406 ,  B62D5/0409 ,  H01L24/34 ,  H01L24/37 ,  H01L2224/37599 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H02K5/225 ,  H02K7/1166 ,  H02K9/22 ,  H02K11/024 ,  H02K11/33 ,  H02K2213/12 ,  H02M7/003 ,  H02M7/797 ,  H02P29/68 ,  H01L2224/37099

摘要： An object is to release heat efficiently to heat-resistance abilities of individual components by enhancing a heat-radiation performance of power circuit components forming a power module (100) and by enhancing a heat generation balance. The power circuit components formed of power switching elements (107 and 108) forming a bridge circuit and a motor relay switching element (109) are mounted on conductive members (102) while a heat generation balance is maintained. Then, the conductive members (102) are disposed on a heat-releasing heat sink (30) by abutment, and the power circuit components and the heat sink (30) are integrally molded using mold resin (101).

公开(公告)号：USD664565S1

公开(公告)日：2012-07-31

申请号：US29389203

申请日：2011-04-07

申请人： Isao Sonoda ,  Yoshihito Asao ,  Katsuhiko Omae ,  Satoru Akutsu ,  Mamoru Watanabe

设计人： Isao Sonoda ,  Yoshihito Asao ,  Katsuhiko Omae ,  Satoru Akutsu ,  Mamoru Watanabe

公开(公告)号：US20130241047A1

公开(公告)日：2013-09-19

申请号：US13989932

申请日：2011-04-27

申请人： Katsuhiko Omae ,  Mamoru Watanabe ,  Tetsushi Watanabe ,  Yoshihito Asao

发明人： Katsuhiko Omae ,  Mamoru Watanabe ,  Tetsushi Watanabe ,  Yoshihito Asao

IPC分类号： H01L23/367

CPC分类号： H01L23/367 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/371 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40245 ,  H01L2224/73263 ,  H01L2224/8314 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84138 ,  H01L2224/84801 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A power semiconductor module includes: a plurality of first metal plates arranged in the same planar state; a power semiconductor chip mounted on the first metal plate; and an overbridge-shaped second metal plate which is composed of bridge frame sections and leg sections that support the bridge frame sections, the leg sections being for appropriately performing solder bonding between electrodes of the power semiconductor chips and between the electrode of the power semiconductor chip and the first metal plate, the power semiconductor module being configured by a resin package in which these members are sealed with electrically insulating resin. In the power semiconductor module, the solder bonding section of the leg section is formed in a planar shape by bending process and is provided at a position lower than the bridge frame section.

摘要翻译： 功率半导体模块包括：布置成相同平面状态的多个第一金属板; 安装在所述第一金属板上的功率半导体芯片; 以及跨桥状的第二金属板，其由支撑桥框架部的桥架部和支腿部构成，所述腿部用于适当地进行功率半导体芯片的电极之间和功率半导体芯片的电极之间的焊接 和第一金属板，功率半导体模块由树脂封装构成，其中这些构件用电绝缘树脂密封。 在功率半导体模块中，脚部的焊接部通过弯曲加工形成为平面状，并且设置在比桥框部低的位置。

公开(公告)号：US20130141871A1

公开(公告)日：2013-06-06

申请号：US13817236

申请日：2011-04-25

申请人： Katsuhiko Omae ,  Yoshihito Asao

发明人： Katsuhiko Omae ,  Yoshihito Asao

IPC分类号： H05K7/20

CPC分类号： H05K7/2039 ,  B62D5/0406 ,  B62D5/0409 ,  H01L24/34 ,  H01L24/37 ,  H01L2224/37599 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H02K5/225 ,  H02K7/1166 ,  H02K9/22 ,  H02K11/024 ,  H02K11/33 ,  H02K2213/12 ,  H02M7/003 ,  H02M7/797 ,  H02P29/68 ,  H01L2224/37099

摘要： An object is to release heat efficiently to heat-resistance abilities of individual components by enhancing a heat-radiation performance of power circuit components forming a power module (100) and by enhancing a heat generation balance. The power circuit components formed of power switching elements (107 and 108) forming a bridge circuit and a motor relay switching element (109) are mounted on conductive members (102) while a heat generation balance is maintained. Then, the conductive members (102) are disposed on a heat-releasing heat sink (30) by abutment, and the power circuit components and the heat sink (30) are integrally molded using mold resin (101).

摘要翻译： 目的是通过增强形成功率模块（100）的电力电路部件的散热性能，并且通过提高发热平衡来有效地将热量释放到单个部件的耐热能力。 形成桥接电路的电源开关元件（107,108）和马达继电器开关元件（109）构成的电力电路部件安装在导电部件（102）上，同时保持发热平衡。 然后，通过邻接将导电构件（102）设置在散热器（30）上，并且使用模制树脂（101）将电力电路部件和散热器（30）一体地模制。

公开(公告)号：US09577488B2

公开(公告)日：2017-02-21

申请号：US14001922

申请日：2011-05-20

申请人： Isao Sonoda ,  Yoshihito Asao ,  Mamoru Watanabe ,  Katsuhiko Omae ,  Tetsushi Watanabe

发明人： Isao Sonoda ,  Yoshihito Asao ,  Mamoru Watanabe ,  Katsuhiko Omae ,  Tetsushi Watanabe

IPC分类号： H02K11/04 ,  H02K5/22 ,  H02K7/116

CPC分类号： H02K5/225 ,  H02K7/116 ,  H02K7/1166 ,  H02K11/30 ,  H02K11/33

摘要： ProblemTo obtain a drive unit integrated rotating electrical machine that makes it easier to connect power circuits and achieves not only excellent vibration resistance but also excellent heat releasing properties.Means for SolutionA drive unit integrated rotating electrical machine has a motor, a drive unit driving the motor under control and provided with power switching elements and conductors passing a current to the power switching elements, and a heat sink cooling the drive unit, which are combined into one unit. The drive unit integrated rotating electrical machine is characterized in that: the power switching elements are molded and formed into mold modules in a state in which terminals thereof are exposed; the conductors are insert-molded in a frame in a state in which terminals thereof are exposed; and the exposed terminals of the mold modules are connected to the exposed terminals of the insert-molded conductors and the mold modules are firmly fixed to the heat sink.

摘要翻译： 驱动单元集成旋转电机具有电机，驱动单元驱动电动机控制并设置有电力开关元件和将电流传递到电力开关元件的导体以及冷却驱动单元的散热器，其组合成一个 单元。 驱动单元集成旋转电机的特征在于：功率开关元件在其端子被暴露的状态下模制并形成模具模块; 导体在其端子露出的状态下嵌入成型在框架中; 并且模块模块的裸露端子连接到嵌入成型导体的裸露端子，并且模块模块牢固地固定到散热器。

公开(公告)号：US09123693B2

公开(公告)日：2015-09-01

申请号：US13983727

申请日：2011-04-07

申请人： Daisuke Tanaka ,  Yoshihito Asao ,  Katsuhiko Omae ,  Tetsushi Watanabe

发明人： Daisuke Tanaka ,  Yoshihito Asao ,  Katsuhiko Omae ,  Tetsushi Watanabe

IPC分类号： H01L23/42 ,  B62D5/04 ,  H02K11/00 ,  H01L23/00 ,  H02K9/22 ,  H01L23/36 ,  H01L23/373 ,  H01L23/31 ,  H02K3/52 ,  H02K5/08 ,  H02K5/22 ,  H02K7/116

CPC分类号： H01L23/42 ,  B62D5/04 ,  B62D5/0406 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3737 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40247 ,  H01L2224/83801 ,  H01L2924/07802 ,  H01L2924/1301 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H02K3/522 ,  H02K5/08 ,  H02K5/225 ,  H02K7/1166 ,  H02K9/22 ,  H02K11/33 ,  H05K2201/10924 ,  H05K2201/10931 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： There is provided a mold module and an electric power steering apparatus in which the temperature distribution in electronic components such as semiconductor chips utilized in an electronic relay and an inverter circuit unit is equalized and hence the heat radiation performance can be improved. In a mold module according to the present invention, a plurality of terminals for forming wiring leads and a plurality of electronic components mounted on the respective terminals are molded with a molding resin; at least part of the plurality of terminals are exposed at the rear side of the molding resin; an electric power steering apparatus according to the present invention utilizes the mold module.

摘要翻译： 提供了一种模具模块和电动助力转向装置，其中在电子继电器和逆变器电路单元中使用的诸如半导体芯片的电子部件中的温度分布相等，因此可以提高散热性能。 在根据本发明的模具模块中，用模塑树脂模制用于形成布线引线的多个端子和安装在各个端子上的多个电子部件; 所述多个端子的至少一部分在所述模制树脂的后侧露出; 根据本发明的电动助力转向装置利用模具模块。

公开(公告)号：US20140151146A1

公开(公告)日：2014-06-05

申请号：US13983727

申请日：2011-04-07

申请人： Daisuke Tanaka ,  Yoshihito Asao ,  Katsuhiko Omae ,  Tetsushi Watanabe

发明人： Daisuke Tanaka ,  Yoshihito Asao ,  Katsuhiko Omae ,  Tetsushi Watanabe

IPC分类号： H01L23/42 ,  B62D5/04

CPC分类号： H01L23/42 ,  B62D5/04 ,  B62D5/0406 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3737 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40247 ,  H01L2224/83801 ,  H01L2924/07802 ,  H01L2924/1301 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H02K3/522 ,  H02K5/08 ,  H02K5/225 ,  H02K7/1166 ,  H02K9/22 ,  H02K11/33 ,  H05K2201/10924 ,  H05K2201/10931 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： There is provided a mold module and an electric power steering apparatus in which the temperature distribution in electronic components such as semiconductor chips utilized in an electronic relay and an inverter circuit unit is equalized and hence the heat radiation performance can be improved. In a mold module according to the present invention, a plurality of terminals for forming wiring leads and a plurality of electronic components mounted on the respective terminals are molded with a molding resin; at least part of the plurality of terminals are exposed at the rear side of the molding resin; an electric power steering apparatus according to the present invention utilizes the mold module.

摘要翻译： 提供了一种模具模块和电动助力转向装置，其中在电子继电器和逆变器电路单元中使用的诸如半导体芯片的电子部件中的温度分布相等，因此可以提高散热性能。 在根据本发明的模具模块中，用模塑树脂模制用于形成布线引线的多个端子和安装在各个端子上的多个电子部件; 所述多个端子的至少一部分在所述模制树脂的后侧露出; 根据本发明的电动助力转向装置利用模具模块。

公开(公告)号：US10177612B2

公开(公告)日：2019-01-08

申请号：US14234512

申请日：2011-10-06

申请人： Yoshihito Asao ,  Isao Sonoda ,  Kohei Ushio ,  Satoru Akutsu

发明人： Yoshihito Asao ,  Isao Sonoda ,  Kohei Ushio ,  Satoru Akutsu

IPC分类号： H02K1/18 ,  H02K5/02 ,  H02K5/06

摘要： A material of the stator core is different from a material of the housings, in a state where one end portion in the axis direction of the stator core is contacted to the first housing, and the other end portion in the axis direction of the stator core is contacted to the second housing; and a neighboring portion of a contact portion, at which the first housing is contacted to the stator core, and another neighboring portion of a contact portion, at which the second housing is contacted to the stator core, are connected by a connecting component in the axis direction, of which material is the same as a material of the stator core, whereby the first housing and the second housing are connected each other; and the first housing and the second housing face each other in a state where a gap intervenes between both housings.