公开(公告)号：US5041283A

公开(公告)日：1991-08-20

申请号：US404409

申请日：1989-09-08

申请人： Katsumi Kita ,  Tetsuo Uno ,  Shinichi Masuda ,  Kazuyuki Yahagi ,  Kazuhiro Tashiro

发明人： Katsumi Kita ,  Tetsuo Uno ,  Shinichi Masuda ,  Kazuyuki Yahagi ,  Kazuhiro Tashiro

IPC分类号： C07C29/38 ,  A61K8/00 ,  A61K8/34 ,  A61Q5/00 ,  A61Q19/00 ,  C07C27/00 ,  C07C31/22 ,  C07C67/00

CPC分类号： A61K8/345 ,  A61Q19/00 ,  C07C31/22 ,  A61Q1/02 ,  A61Q1/06 ,  A61Q19/10 ,  A61Q5/00 ,  A61Q5/06 ,  A61Q5/12

摘要： A cosmetic composition comprising a long-chain alkyltrimethylol is disclosed. The alkyltrimethylol is represeneted by the formula (I): ##STR1## wherein R is a linear or branched, saturated or unsaturated alkyl group having 8-22 carbon atoms. The composition is applied to various types of cosmetic and exhibits superior extendibility when applied, imparts a non-sticky, fresh feeling upon use, and provides an excellent moisture-retaining effect.

公开(公告)号：US5374421A

公开(公告)日：1994-12-20

申请号：US978192

申请日：1992-11-18

申请人： Kazuhiro Tashiro ,  Kazuyuki Yahagi

发明人： Kazuhiro Tashiro ,  Kazuyuki Yahagi

IPC分类号： A61K8/00 ,  A61K8/34 ,  A61K8/41 ,  A61K8/89 ,  A61K8/891 ,  A61K8/893 ,  A61K8/92 ,  A61Q5/00 ,  A61Q5/02 ,  A61Q5/12 ,  C08L83/04 ,  A61K7/09

CPC分类号： A61K8/345 ,  A61K8/342 ,  A61K8/416 ,  A61K8/893 ,  A61Q5/02 ,  A61Q5/12

摘要： A composition for hair treatment such as hair rinse, shampoo, or hair conditioner, contains (a) 0.1-10 wt. % of a modified silicone polymer having at least one alkoxy group in the molecule and a melting point of not lower than 30.degree. C., (b) 0.1-20 wt. % of a cationic surface active agent, (c) 0.1-30 wt. % of an oily or fatty material, (d) 0.1-90 wt. % of an organic liquid which is compatible with water and of which molecule has at least one hydroxy group, and (e) water.

摘要翻译： 用于毛发处理的组合物如洗发剂，洗发剂或护发素包含（a）0.1-10重量％ ％的分子中具有至少一个烷氧基并且熔点不低于30℃的改性硅氧烷聚合物，（b）0.1-20重量％ ％的阳离子表面活性剂，（c）0.1-30重量％ ％的油性或脂肪材料，（d）0.1-90重量％ ％的与水相容的分子和至少一个羟基的有机液体，和（e）水。

公开(公告)号：US5714136A

公开(公告)日：1998-02-03

申请号：US384802

申请日：1995-02-06

申请人： Kazuyuki Yahagi ,  Kazuhiro Tashiro ,  Takashi Koyama ,  Yoshiyuki Eshita ,  Tsuyoshi Ohtomo ,  Fumiko Sazanami ,  Jun Kamegai

发明人： Kazuyuki Yahagi ,  Kazuhiro Tashiro ,  Takashi Koyama ,  Yoshiyuki Eshita ,  Tsuyoshi Ohtomo ,  Fumiko Sazanami ,  Jun Kamegai

IPC分类号： A61K8/31 ,  A61K8/34 ,  A61K8/37 ,  A61K8/41 ,  A61K8/60 ,  A61Q5/12 ,  C11D3/20 ,  A61K7/07 ,  A61K7/08

CPC分类号： A61K8/416 ,  A61K8/31 ,  A61K8/342 ,  A61K8/375 ,  A61K8/604 ,  A61Q5/02 ,  A61Q5/12 ,  A61K2800/412 ,  A61K2800/596 ,  A61Q5/006

摘要： A hair cosmetic is disclosed which comprises the following components (A), (B) and (C): (A) a cationic surfactant; (B) a fat and/or an oil; and (C) an alkyl saccharide surfactant represented by the following formula (1): R.sup.1 --O--(R.sup.2 O).sub.m --G.sub.n (1) wherein the weight ratio of (A)/(C) is from 1 to 20. A hair cosmetic which further comprises fine particles of an average particle size of 100 .mu.m or below as the component (D) is also disclosed. The hair cosmetic of the present invention gives a good smoothness, a good elasticity and an oil-free feel to the hair without imparting any sticky feel or dry and loose feel thereto.

摘要翻译： 公开了一种头发化妆品，其包含以下组分（A），（B）和（C）：（A）阳离子表面活性剂; （B）脂肪和/或油; （C）由下式（1）表示的烷基糖表面活性剂：（A）/（C）的重量比为1〜20的R1-O-（R2O）m -Gn（1） 还公开了还含有平均粒径为100μm以下的微粒作为成分（D）的化妆品。 本发明的毛发化妆品赋予毛发良好的光滑度，良好的弹性和无油感，而不会产生任何粘性或干燥和松散的感觉。

公开(公告)号：US08671557B2

公开(公告)日：2014-03-18

申请号：US13242647

申请日：2011-09-23

申请人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

发明人： Daisuke Koizumi ,  Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Naoyuki Watanabe

IPC分类号： B23P19/00

CPC分类号： B25B27/14 ,  H05K7/1061 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53943

摘要： A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.

摘要翻译： 托盘与附接到托盘上的电子部件连接工具组合地提供，并且包括附接凹陷部分，该附件凹陷部分包括内壁并且附接有电子部件，其中，附接凹陷部分的内壁的形成基本上不 取决于电子部件的外部形状，以及形成在安装凹部的内壁中的标准部分，并与电子部件安装工具的第一结构部分接合，以将电子部件安装工具的位置对准到标准 当使用电子部件安装工具将电子部件的位置与托盘的第一位置对准时，标准部件具有基本上不依赖于电子部件的外形的形状。

公开(公告)号：US08164181B2

公开(公告)日：2012-04-24

申请号：US12872131

申请日：2010-08-31

申请人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

发明人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

IPC分类号： H01L23/12

CPC分类号： H01L21/67333 ,  H01L21/50 ,  H01L22/20 ,  H01L23/04 ,  H01L23/544 ,  H01L25/0655 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/1616 ,  H01L2924/166 ,  Y10T29/49826 ,  H01L2924/00

摘要： A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

摘要翻译： 公开了一种半导体器件封装结构，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。

公开(公告)号：US20110254574A1

公开(公告)日：2011-10-20

申请号：US13168719

申请日：2011-06-24

申请人： Kazuhiro Tashiro

发明人： Kazuhiro Tashiro

IPC分类号： G01R31/308 ,  G01R31/00 ,  G01N21/00 ,  G01R31/26

CPC分类号： G01R31/2887 ,  G01R31/2891

摘要： A prober includes a probe card provided with a support board and a probe attached to the support board, a stage on which a measurement wafer is mounted, a camera provided over the probe card to observe an electrode pad of a first semiconductor chip formed on the measurement wafer, and a stage moving unit for moving the position of the stage relative to the probe card.

摘要翻译： 探针包括设置有支撑板的探针卡和附接到支撑板的探针，安装有测量晶片的台，设置在探针卡上方的照相机，以观察形成在第一半导体芯片上的第一半导体芯片的电极焊盘 测量晶片和用于相对于探针卡移动台的位置的台移动单元。

公开(公告)号：US20080203558A1

公开(公告)日：2008-08-28

申请号：US12081961

申请日：2008-04-24

申请人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

发明人： Kazuhiro Tashiro ,  Keisuke Fukuda ,  Naohito Kohashi ,  Shigeyuki Maruyama

IPC分类号： H01L23/12 ,  H01L21/00

CPC分类号： H01L21/67333 ,  H01L21/50 ,  H01L22/20 ,  H01L23/04 ,  H01L23/544 ,  H01L25/0655 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16153 ,  H01L2924/1616 ,  H01L2924/166 ,  Y10T29/49826 ,  H01L2924/00

摘要： A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

摘要翻译： 公开了一种用于保护半导体器件的方法，其可以提高半导体器件的性能测试的可靠性，并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件，所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后，突出部分位于半导体器件中的自由区域中，并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。

公开(公告)号：US07161370B2

公开(公告)日：2007-01-09

申请号：US11046883

申请日：2005-02-01

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

IPC分类号： G01R31/26

CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。

公开(公告)号：US20060097356A1

公开(公告)日：2006-05-11

申请号：US11062488

申请日：2005-02-23

申请人： Shigeru Fujii ,  Yoshikazu Arisaka ,  Hitoshi Izuru ,  Kazuhiro Tashiro ,  Shigeyuki Maruyama

发明人： Shigeru Fujii ,  Yoshikazu Arisaka ,  Hitoshi Izuru ,  Kazuhiro Tashiro ,  Shigeyuki Maruyama

IPC分类号： H01L23/544

CPC分类号： H01L21/78 ,  H01L23/544 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor substrate eliminates a restriction caused by a width of scribe lines so as to increase a number of semiconductor elements formed on the semiconductor substrate. A plurality of semiconductor element areas are formed by forming a plurality of unit exposed and printed areas, each of which contains the semiconductor element areas. A first scribe line extends between the semiconductor element areas formed within the unit exposed and printed area. A second scribe line extends between the unit exposed and printed areas. A width of the first scribe line is different from a width of the second scribe line.

摘要翻译： 半导体衬底消除了由划线的宽度引起的限制，从而增加形成在半导体衬底上的半导体元件的数量。 多个半导体元件区域通过形成多个单位曝光和印刷区域而形成，每个单元暴露和印刷区域都包含半导体元件区域。 第一刻划线在形成在单元曝光和印刷区域内的半导体元件区域之间延伸。 第二划线在单元曝光和打印区域之间延伸。 第一划线的宽度与第二划线的宽度不同。

公开(公告)号：US06767219B2

公开(公告)日：2004-07-27

申请号：US10292839

申请日：2002-11-13

申请人： Shigeyuki Maruyama ,  Naoyuki Watanabe ,  Kazuhiro Tashiro ,  Naohito Kohashi ,  Osamu Igawa ,  Tetsuya Fujisawa

发明人： Shigeyuki Maruyama ,  Naoyuki Watanabe ,  Kazuhiro Tashiro ,  Naohito Kohashi ,  Osamu Igawa ,  Tetsuya Fujisawa

IPC分类号： H01R1200

CPC分类号： G01R1/0675 ,  G01R3/00 ,  H05K7/1069

摘要： A contactor has a contactor substrate and a plurality of contact electrodes formed on the contactor substrate. Each contact electrode is formed by a metal wire bent between one end joined to the contactor substrate and the other end. An inclined plane is formed by a cutting surface. A fracture surface formed by a tension fracture is formed at the apex portion of the contact electrode.

摘要翻译： 接触器具有接触器基板和形成在接触器基板上的多个接触电极。 每个接触电极由在连接到接触器基板的一端和另一端之间弯曲的金属线形成。 倾斜平面由切割面形成。 在接触电极的顶点处形成由张力断裂形成的断裂面。