公开(公告)号：US06902102B2

公开(公告)日：2005-06-07

申请号：US10339643

申请日：2003-01-10

申请人： Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

发明人： Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

IPC分类号： B23K35/26 ,  B23K1/08 ,  B23K1/20 ,  B23K3/06 ,  B23K35/36 ,  B23K35/363 ,  B23K101/42 ,  C22C13/00 ,  H05K3/34

CPC分类号： H05K3/3415 ,  B23K1/085 ,  B23K1/20 ,  B23K3/0653 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3618 ,  H01L2924/0002 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3484 ,  H05K2201/10909 ,  H05K2203/044 ,  H05K2203/047 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

摘要翻译： 在包含形成在电子部件的表面上的钯或钯合金层的电子部件的焊接方法中，还包括焊接引线端子到包括焊接区域和电镀通孔的印刷线路板上，焊锡层含有锡 并且通过HAL处理在所述焊盘通孔的表面上形成作为主要部件的锌。 引线端子插入并安装在通孔中。 印刷电路板与含有锡和锌的焊料的喷射流作为主要成分接触，从而向焊盘和通孔提供焊料。

公开(公告)号：US07490403B2

公开(公告)日：2009-02-17

申请号：US11633517

申请日：2006-12-05

申请人： Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

发明人： Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

IPC分类号： H05K3/34 ,  B23K31/00

CPC分类号： H05K3/3415 ,  B23K1/085 ,  B23K1/20 ,  B23K3/0653 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3618 ,  H01L2924/0002 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3484 ,  H05K2201/10909 ,  H05K2203/044 ,  H05K2203/047 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

摘要翻译： 在包含形成在电子部件的表面上的钯或钯合金层的电子部件的焊接方法中，还包括焊接引线端子到包括焊接区域和电镀通孔的印刷线路板上，焊锡层含有锡 并且通过HAL处理在所述焊盘通孔的表面上形成作为主要部件的锌。 引线端子插入并安装在通孔中。 印刷电路板与含有锡和锌的焊料的喷射流作为主要成分接触，从而向焊盘和通孔提供焊料。

公开(公告)号：US07176388B2

公开(公告)日：2007-02-13

申请号：US10991401

申请日：2004-11-19

申请人： Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

发明人： Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

IPC分类号： H05K5/00

CPC分类号： H05K3/3415 ,  B23K1/085 ,  B23K1/20 ,  B23K3/0653 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3618 ,  H01L2924/0002 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3484 ,  H05K2201/10909 ,  H05K2203/044 ,  H05K2203/047 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

摘要翻译： 在包含形成在电子部件的表面上的钯或钯合金层的电子部件的焊接方法中，还包括焊接引线端子到包括焊接区域和电镀通孔的印刷电路板上的焊锡层， 并且通过HAL处理在所述焊盘通孔的表面上形成作为主要部件的锌。 引线端子插入并安装在通孔中。 印刷电路板与含有锡和锌的焊料的喷射流作为主要成分接触，从而向焊盘和通孔提供焊料。

公开(公告)号：US20070107214A1

公开(公告)日：2007-05-17

申请号：US11633517

申请日：2006-12-05

申请人： Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

发明人： Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

IPC分类号： H01K3/10 ,  H05K3/34 ,  B23K31/02

CPC分类号： H05K3/3415 ,  B23K1/085 ,  B23K1/20 ,  B23K3/0653 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3618 ,  H01L2924/0002 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3484 ,  H05K2201/10909 ,  H05K2203/044 ,  H05K2203/047 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

摘要翻译： 在包含形成在电子部件的表面上的钯或钯合金层的电子部件的焊接方法中，还包括焊接引线端子到包括焊接区域和电镀通孔的印刷线路板上，焊锡层含有锡 并且通过HAL处理在所述焊盘通孔的表面上形成作为主要部件的锌。 引线端子插入并安装在通孔中。 印刷电路板与含有锡和锌的焊料的喷射流作为主要成分接触，从而向焊盘和通孔提供焊料。

公开(公告)号：US20050067189A1

公开(公告)日：2005-03-31

申请号：US10991401

申请日：2004-11-19

申请人： Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

发明人： Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

IPC分类号： B23K35/26 ,  B23K1/08 ,  B23K1/20 ,  B23K3/06 ,  B23K35/36 ,  B23K35/363 ,  B23K101/42 ,  C22C13/00 ,  H05K3/34 ,  H05K1/18 ,  H01L23/488 ,  H01L23/495

CPC分类号： H05K3/3415 ,  B23K1/085 ,  B23K1/20 ,  B23K3/0653 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3618 ,  H01L2924/0002 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3484 ,  H05K2201/10909 ,  H05K2203/044 ,  H05K2203/047 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

公开(公告)号：US20070102490A1

公开(公告)日：2007-05-10

申请号：US11612873

申请日：2006-12-19

申请人： Yuki Momokawa ,  Eiichi Kono ,  Masaru Saitou ,  Kazuhiko Tanabe

发明人： Yuki Momokawa ,  Eiichi Kono ,  Masaru Saitou ,  Kazuhiko Tanabe

IPC分类号： A47J36/02

CPC分类号： H05K3/3426 ,  H05K1/0201 ,  H05K1/09 ,  H05K1/114 ,  H05K3/0094 ,  H05K3/3415 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3494 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09263 ,  H05K2201/09572 ,  H05K2201/09727 ,  H05K2201/10909 ,  H05K2201/2054 ,  H05K2203/0191 ,  H05K2203/047 ,  H05K2203/081 ,  H05K2203/1105 ,  H05K2203/1121 ,  H05K2203/1394 ,  H05K2203/304 ,  Y02P70/613 ,  Y10T29/49144

摘要： A through hole 2 in a circuit board 1 and to be joined to a lead 5 in a surface mounting component 6 is prepared from a material such as nickel, and palladium having a thermal conductivity equal to or less than 100 W/m.K, the circuit board 1 involving a alloy layer composed of at least a member selected from elements of solder 8, a pad 7, and the lead 5 in a solder joined site of the lead 5 and the pad 7, whereby a quantity of heat transmitted to the joined site via the through hole 2 is reduced at the time when wave-soldering is applied to the back of the circuit board 1 after the surface mounting component 6 was mounted, so that the joined site is maintained at a temperature equal to or less than a melting point of the alloy layer, and hence, exfoliation in an interface of the joined site is prevented, and reliability in the joint of the lead 5 and the pad 7 is elevated.

摘要翻译： 电路板1中的通孔2并且与表面安装部件6中的引线5接合，由诸如镍的材料和热导率等于或小于100W / mK的钯制成，电路 板1，其包括在引线5和焊盘7的焊料接合部位中至少由焊料8，焊盘7和引线5的元件组成的合金层，由此传递到接合部 在安装表面安装部件6之后，当在电路板1的背面上施加波峰焊时，通过通孔2的位置被减小，使得接合部位保持在等于或小于 合金层的熔点，因此防止了接合部位的界面的剥离，引线5和焊盘7的接头的可靠性提高。