公开(公告)号：US07235888B2

公开(公告)日：2007-06-26

申请号：US11032290

申请日：2005-01-10

申请人： Kazuhito Hosokawa ,  Takuji Okeyui ,  Hirofumi Fujii ,  Yasuhiko Yamamoto

发明人： Kazuhito Hosokawa ,  Takuji Okeyui ,  Hirofumi Fujii ,  Yasuhiko Yamamoto

IPC分类号： H01L29/40 ,  H01L21/48

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20305 ,  H01L2924/00012

摘要： A series of semiconductor devices includes: (i) a plurality of semiconductor elements having electrodes; (ii) a plurality of electrically conductive parts formed around and electrically connected to each of the semiconductor elements; and (iii) a sealing resin in which the plurality of semiconductor elements and the plurality of electrically conductive parts are sealed and an electrode-free side of each semiconductor element and an unwired side of each electrically conductive part are formed on a single flat surface of a removable substrate.

摘要翻译： 一系列半导体器件包括：（i）具有电极的多个半导体元件; （ii）形成在每个所述半导体元件周围并电连接的多个导电部件; 和（iii）密封树脂，其中多个半导体元件和多个导电部件被密封，并且每个导电部件的每个半导体元件的无电极侧和未端部侧形成在单个平坦表面上 可拆卸基板。

公开(公告)号：US20050133824A1

公开(公告)日：2005-06-23

申请号：US11032290

申请日：2005-01-10

申请人： Kazuhito Hosokawa ,  Takuji Okeyui ,  Hirofumi Fujii ,  Yashuhiko Yamamoto

发明人： Kazuhito Hosokawa ,  Takuji Okeyui ,  Hirofumi Fujii ,  Yashuhiko Yamamoto

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L29/739 ,  H01L31/0328 ,  H01L31/0336 ,  H01L31/072 ,  H01L31/109

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20305 ,  H01L2924/00012

摘要： A series of semiconductor devices includes: (i) a plurality of semiconductor elements having electrodes; (ii) a plurality of electrically conductive parts formed around and electrically connected to each of the semiconductor elements; and (iii) a sealing resin in which the plurality of semiconductor elements and the plurality of electrically conductive parts are sealed and an electrode-free side of each semiconductor element and an unwired side of each electrically conductive part are formed on a single flat surface of a removable substrate.

摘要翻译： 一系列半导体器件包括：（i）具有电极的多个半导体元件; （ii）形成在每个所述半导体元件周围并电连接的多个导电部件; 和（iii）密封树脂，其中多个半导体元件和多个导电部件被密封，并且每个导电部件的每个半导体元件的无电极侧和未端部侧形成在单个平坦表面上 可拆卸基板。

公开(公告)号：US06858473B2

公开(公告)日：2005-02-22

申请号：US10611290

申请日：2003-07-01

申请人： Kazuhito Hosokawa ,  Takuji Okeyui ,  Hirofumi Fujii ,  Yasuhik Yamamoto

发明人： Kazuhito Hosokawa ,  Takuji Okeyui ,  Hirofumi Fujii ,  Yasuhik Yamamoto

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L21/44

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20305 ,  H01L2924/00012

摘要： A method for manufacturing a semiconductor device includes the steps of: (1) forming a plurality of electrically conductive parts on portions of an adhesive layer of an adhesive sheet, the adhesive sheet having a base layer and the adhesive layer; (2) attaching at least one semiconductor element having electrodes to the adhesive layer, wherein an electrode-free side of the semiconductor element is attached to the adhesive layer; (3) electrically connecting a wire between each of the electrically conductive parts and each of the electrodes of the semiconductor element; (4) sealing the semiconductor element in a sealing resin to form a semiconductor device on the adhesive sheet; and (5) separating the adhesive sheet from the semiconductor device. This method enables the production of thin semiconductor devices with a surface mount type.

摘要翻译： 一种制造半导体器件的方法包括以下步骤：（1）在粘合片的粘合剂层的部分上形成多个导电部分，所述粘合片具有基底层和粘合剂层; （2）将具有电极的至少一个半导体元件附接到所述粘合剂层，其中所述半导体元件的无电极侧附着到所述粘合剂层; （3）电连接每个导电部件与半导体元件的每个电极之间的导线; （4）将半导体元件密封在密封树脂中以在粘合片上形成半导体器件; 和（5）从半导体器件分离粘合片。 该方法能够生产具有表面贴装型的薄半导体器件。

公开(公告)号：US08728705B2

公开(公告)日：2014-05-20

申请号：US12788837

申请日：2010-05-27

申请人： Katsutoshi Hirashima ,  Hirofumi Fujii ,  Yasushi Tamura ,  Ryouji Suezaki

发明人： Katsutoshi Hirashima ,  Hirofumi Fujii ,  Yasushi Tamura ,  Ryouji Suezaki

IPC分类号： G03F7/038 ,  G03F7/38

CPC分类号： G03F7/0387 ,  G03F7/0045 ,  G03F7/38 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/287 ,  H05K3/4092 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/0969 ,  H05K2203/056 ,  H05K2203/1476 ,  Y10S430/107

摘要： A negative photosensitive material is provided which has a lower linear expansion coefficient and a lower hygroscopic expansion coefficient and is excellent in gradational patternability and PI etchability in patterning. The negative photosensitive material comprises: (A) a polyimide precursor having a structural unit represented by the following general formula (1) and a structural unit represented by the following general formula (2), the structural unit represented by the general formula (2) being present in the polyimide precursor in a proportion of less than 30 mol % based on the overall amount of the polyimide precursor; and (B) at least one of a pyridine derivative represented by the following general formula (3) and a pyridine derivative represented by the following general formula (4): wherein R1, R2, R3, R4 and R5, which may be the same or different, are each a C1 to C4 alkyl group, and Ar is an aryl group having a nitro group at its ortho position, wherein R1, R2, R4 and R5, which may be the same or different, are each a C1 to C4 alkyl group, and Ar is an aryl group having a nitro group at its ortho position.

摘要翻译： 提供具有较低线性膨胀系数和较低吸湿膨胀系数的负型感光材料，并且在图案化中具有优异的梯度图案性和PI可蚀刻性。 负型感光材料包括：（A）具有由以下通式（1）表示的结构单元和由以下通式（2）表示的结构单元的聚酰亚胺前体，由通式（2）表示的结构单元， 以聚酰亚胺前体的总量小于30mol％的比例存在于聚酰亚胺前体中; 和（B）由以下通式（3）表示的吡啶衍生物和由以下通式（4）表示的吡啶衍生物中的至少一种：其中R1，R2，R3，R4和R5可以相同 或不同的，各自为C1〜C4烷基，Ar为其邻位具有硝基的芳基，其中R1，R2，R4和R5可以相同或不同，分别为C1〜C4 烷基，Ar是在其邻位具有硝基的芳基。

公开(公告)号：US08639045B2

公开(公告)日：2014-01-28

申请号：US13393983

申请日：2010-03-02

申请人： Sumio Yokomitsu ,  Hirofumi Fujii ,  Takeshi Fujimatsu ,  Takeshi Watanabe ,  Yuichi Matsumoto ,  Michio Miwa ,  Masataka Sugiura ,  Mikio Morioka

发明人： Sumio Yokomitsu ,  Hirofumi Fujii ,  Takeshi Fujimatsu ,  Takeshi Watanabe ,  Yuichi Matsumoto ,  Michio Miwa ,  Masataka Sugiura ,  Mikio Morioka

IPC分类号： G06K9/36 ,  G06K9/46

CPC分类号： H04N1/415 ,  H04N1/4172 ,  H04N5/23238 ,  H04N19/115 ,  H04N19/124 ,  H04N19/17

摘要： An image processing device comprises a region dividing unit which divides a captured image obtained by a camera unit into a plurality of regions, and an image compressing unit which compresses each of region images obtained by the division by the region dividing unit while changing the compression rate according to the distance from a predetermined point in the captured image to each of the region images and the distance from the camera unit to a target included in each of the regions. For example, the image compressing unit compresses the region image having a larger angle from the optical axis at a larger compression rate, thereby achieving compression in which the amount of data in low-quality regions is greatly reduced and the quality of high-quality regions is maintained.

摘要翻译： 一种图像处理装置，包括：区域分割单元，其将由相机单元获得的拍摄图像分割成多个区域;以及图像压缩单元，其压缩通过区域划分单元进行的划分而获得的每个区域图像，同时改变压缩率 根据从拍摄图像中的预定点到每个区域图像的距离以及从相机单元到包括在每个区域中的目标的距离。 例如，图像压缩单元以较大的压缩率从光轴压缩具有较大角度的区域图像，从而实现低质量区域中的数据量大大降低的压缩，并且高质量区域的质量 被维护。

公开(公告)号：US20130057546A1

公开(公告)日：2013-03-07

申请号：US13697635

申请日：2011-05-16

申请人： Takeshi Watanabe ,  Sumio Yokomitsu ,  Hirofumi Fujii ,  Takeshi Fujimatsu ,  Yuichi Matsumoto ,  Michio Miwa ,  Masataka Sugiura ,  Mikio Morioka

发明人： Takeshi Watanabe ,  Sumio Yokomitsu ,  Hirofumi Fujii ,  Takeshi Fujimatsu ,  Yuichi Matsumoto ,  Michio Miwa ,  Masataka Sugiura ,  Mikio Morioka

IPC分类号： G06T15/00 ,  G09G5/00

CPC分类号： H04N5/23238 ,  G03B15/10 ,  G06T3/4038

摘要： A panoramic image display device divides a panoramic expansion image into at least two panoramic images and displays the panoramic images. The panoramic expansion image display device including: a clipping reference position setting unit that sets a clipping reference position for the panoramic expansion image; an object detection unit that detects an object as a display target from the panoramic expansion image; a clipping position determination unit that determines a clipping position of the panoramic image according to a relationship between a detected object position and the clipping reference position; and a display image generation unit that displays the panoramic image clipped from the panoramic expansion image at the clipping position.

摘要翻译： 全景图像显示装置将全景扩展图像划分为至少两个全景图像并显示全景图像。 全景展开图像显示装置包括：剪切基准位置设定单元，设定全景展开图像的限幅基准位置; 物体检测单元，其从全景展开图像检测作为显示目标的物体; 剪辑位置确定单元，根据检测到的对象位置和剪辑基准位置之间的关系确定全景图像的剪切位置; 以及显示图像生成单元，其显示在所述剪辑位置从全景展开图像剪切的全景图像。

公开(公告)号：US08244684B2

公开(公告)日：2012-08-14

申请号：US12274782

申请日：2008-11-20

申请人： Yutaka Ando ,  Osamu Kawaguchi ,  Nobuhiro Tsukamoto ,  Tomotaka Kasamatsu ,  Hirofumi Fujii ,  Hiromasa Yamagishi ,  Hikaru Futami ,  Masato Shibuya

发明人： Yutaka Ando ,  Osamu Kawaguchi ,  Nobuhiro Tsukamoto ,  Tomotaka Kasamatsu ,  Hirofumi Fujii ,  Hiromasa Yamagishi ,  Hikaru Futami ,  Masato Shibuya

IPC分类号： G06F17/00

CPC分类号： G16H50/70 ,  G06F19/00 ,  G06F19/321 ,  G16H15/00

摘要： Specified types of words are extracted from a plurality of radiology reports archived in an archive configured to archive a plurality of radiology reports. The words extracted from a single radiology report are stored in combination. In response to an input operation using an operating part of inputting the specified types of words, combinations including the specified types of words as one part are searched. A list of the specified types of words included as the other part in the searched combinations is generated. In response to an input operation using the operating part of selecting any word from the word list, a list of radiology reports including the inputted word and the selected word is generated. In response to an input operation using the operating part of selecting any report from the radiology report list, the selected radiology report is outputted from the archive to a display.

摘要翻译： 从存档在归档多个放射学报告的归档中的多个放射学报告中提取指定类型的单词。 从单个放射学报告中提取的单词组合存储。 响应于使用输入指定类型的单词的操作部分的输入操作，搜索包括指定类型的单词作为一个部分的组合。 生成包含在搜索组合中作为其他部分的指定类型的单词的列表。 响应于使用操作部分选择来自单词列表的任何单词的输入操作，生成包括所输入的单词和所选择的单词的放射学报告的列表。 响应于使用从放射学报告列表选择任何报告的操作部分的输入操作，所选择的放射学报告从存档输出到显示器。

公开(公告)号：US20100319151A1

公开(公告)日：2010-12-23

申请号：US12851797

申请日：2010-08-06

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： A47L25/00

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US07575812B2

公开(公告)日：2009-08-18

申请号：US11252800

申请日：2005-10-19

申请人： Yoshio Terada ,  Hirofumi Fujii ,  Makoto Namikawa ,  Daisuke Uenda ,  Yasuhiro Amano

发明人： Yoshio Terada ,  Hirofumi Fujii ,  Makoto Namikawa ,  Daisuke Uenda ,  Yasuhiro Amano

IPC分类号： B32B27/06 ,  B32B7/12 ,  B08B7/00

CPC分类号： B32B27/28 ,  B32B27/06 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/31 ,  B32B2307/54 ,  B32B2432/00 ,  Y10T428/28 ,  Y10T428/2896 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

摘要翻译： 本发明提供了一种基板处理设备的清洁基板，其包括在20℃至150℃下具有储能模量（1Hz）的耐热树脂的清洁层，为5×10 7 Pa至1×10 9 Pa 底物的至少一个面; 以及适合用作清洁层的耐热树脂的聚酰亚胺树脂，并且可用于可能涉及由于硅氧烷污染而产生严重缺点的环境，例如用于HDD应用和一些半导体应用。

公开(公告)号：US20090179066A1

公开(公告)日：2009-07-16

申请号：US12357498

申请日：2009-01-22

申请人： Hirofumi Fujii ,  Mitsuo Nishimura

发明人： Hirofumi Fujii ,  Mitsuo Nishimura

IPC分类号： B23K31/02 ,  B23K31/12

CPC分类号： G03F7/70841

摘要： A method of forming a container having a lid and a container body which define an inside space, and a material containing an organic compound provided in the inside space. The method includes forming a groove and a communication member for communicating the groove with an outside space, in at least one of the lid and the container body, providing the material in the inside space, welding the lid and the container body to each other, and exhausting the organic compound vaporized by welding heat to the outside space through the groove and the communication member.

摘要翻译： 一种形成具有限定内部空间的盖和容器主体的容器的方法，以及包含设置在内部空间中的有机化合物的材料的方法。 该方法包括形成沟槽和连通构件，用于使槽与外部空间连通，在盖和容器主体中的至少一个中，在内部空间内提供材料，将盖和容器主体彼此焊接， 并且通过沟槽和连通构件将通过焊接热量蒸发的有机化合物排出到外部空间。