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公开(公告)号：US20110237028A1
公开(公告)日：2011-09-29
申请号：US13131427
申请日：2010-02-23
IPC分类号： H01L21/50
CPC分类号： H01L24/92 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/1134 , H01L2224/13017 , H01L2224/13144 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1623 , H01L2224/16238 , H01L2224/27334 , H01L2224/29007 , H01L2224/2919 , H01L2224/32012 , H01L2224/32225 , H01L2224/3224 , H01L2224/73103 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81444 , H01L2224/83192 , H01L2224/83194 , H01L2224/83203 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/364 , H01L2924/381 , H01L2924/00014 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.
摘要翻译： 提供一种制造半导体器件的方法。 该方法包括通过使用绝缘树脂粘合膜（NCF）将半导体芯片通过倒装芯片安装在基板上，并防止NCF的溢出以及在热处理期间凸块和电极之间的绝缘树脂或无机填料的介入 紧迫。 该方法还包括临时固定尺寸的NCF，其尺寸基本上为周边排列布置的半导体芯片的多个凸块所包围的区域的面积的60〜100％，并且具有最小熔体粘度为2×102〜 1×105Pa·s，与由凸块相对应的多个基板的电极所围成的区域，使半导体芯片和基板彼此对准，使凸块和与其对应的电极相互对置。
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公开(公告)号：US09368374B2
公开(公告)日：2016-06-14
申请号：US13131427
申请日：2010-02-23
CPC分类号： H01L24/92 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/1134 , H01L2224/13017 , H01L2224/13144 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1623 , H01L2224/16238 , H01L2224/27334 , H01L2224/29007 , H01L2224/2919 , H01L2224/32012 , H01L2224/32225 , H01L2224/3224 , H01L2224/73103 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81444 , H01L2224/83192 , H01L2224/83194 , H01L2224/83203 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/364 , H01L2924/381 , H01L2924/00014 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.
摘要翻译： 提供一种制造半导体器件的方法。 该方法包括通过使用绝缘树脂粘合膜（NCF）将半导体芯片通过倒装芯片安装在基板上，并防止NCF的溢出以及在热处理期间凸块和电极之间的绝缘树脂或无机填料的介入 紧迫。 该方法还包括临时固定尺寸的NCF，其尺寸基本上为周边排列布置的半导体芯片的多个凸块所包围的区域的面积的60〜100％，并且具有最小熔体粘度为2×102〜 1×105Pa·s，与由凸块相对应的多个基板的电极所围成的区域，使半导体芯片和基板彼此对准，使凸块和与其对应的电极相互对置。
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公开(公告)号：US20100308476A1
公开(公告)日：2010-12-09
申请号：US12734695
申请日：2008-10-30
申请人： Yasuhiro Suga , Kazunori Hamazaki
发明人： Yasuhiro Suga , Kazunori Hamazaki
CPC分类号： H01L21/565 , H01L23/3121 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled.
摘要翻译： 半导体芯片通过其间具有热固性粘合剂膜而临时固定在电路板上。 密封树脂膜设置有脱模膜和热固性密封树脂层，其被层压在脱模膜上并且具有半导体芯片的厚度的0.5至2倍的膜厚度。 密封树脂膜布置在半导体芯片上，使得热固性密封树脂层面向半导体芯片。 通过使用橡胶硬度为5-100的橡胶头，将电路板一侧的热量施加到从脱模膜一侧向密封树脂膜施加压力，以将半导体芯片接合在电路板上。 在用树脂密封半导体芯片之后，剥离脱模膜。
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公开(公告)号：US08409932B2
公开(公告)日：2013-04-02
申请号：US12734695
申请日：2008-10-30
申请人： Yasuhiro Suga , Kazunori Hamazaki
发明人： Yasuhiro Suga , Kazunori Hamazaki
IPC分类号： H01L21/00
CPC分类号： H01L21/565 , H01L23/3121 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled.
摘要翻译： 半导体芯片通过其间具有热固性粘合剂膜而临时固定在电路板上。 密封树脂膜设置有脱模膜和热固性密封树脂层，其被层压在脱模膜上并且具有半导体芯片的厚度的0.5至2倍的膜厚度。 密封树脂膜布置在半导体芯片上，使得热固性密封树脂层面向半导体芯片。 通过使用橡胶硬度为5-100的橡胶头，将电路板一侧的热量施加到从脱模膜一侧向密封树脂膜施加压力，以将半导体芯片接合在电路板上。 在用树脂密封半导体芯片之后，剥离脱模膜。
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公开(公告)号：US08419888B2
公开(公告)日：2013-04-16
申请号：US12747130
申请日：2008-11-13
申请人： Kazunori Hamazaki
发明人： Kazunori Hamazaki
IPC分类号： B29C65/00 , B29C65/48 , B32B37/00 , H05K13/04 , C08J5/00 , G01R31/26 , H01L21/66 , H01L21/00
CPC分类号： H01L24/75 , H01L21/67005 , H01L24/83 , H01L24/90 , H01L24/95 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/2919 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/7598 , H01L2224/83101 , H01L2224/838 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , Y10T156/1089 , H01L2924/00 , H01L2224/0401
摘要： An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a non-conductive adhesive agent having a low minimum melt viscosity and having no conductive particle where a thin electronic component having a thickness smaller than or equal to 200 μm is mounted on a wiring board. In the mounting apparatus, a non-conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 μm is placed on the non-conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.
摘要翻译： 一种电子部件安装装置能够显着降低使用具有低最小熔融粘度并且不具有导电性粒子的非导电性粘合剂在热压接的情况下翘曲的电子部件的翘曲量，其中薄的电子部件具有厚度 小于或等于200μm的电极安装在布线板上。 在安装装置中，将具有低于或等于1.0×10 3 Pa·s的最小熔体粘度的非导电粘合剂膜放置在放置在基底上的布线板上，并且将具有小于或等于 将200μm放置在非导电粘合膜上。 在安装装置中，IC芯片由具有由橡胶硬度低于或等于60的弹性体制成的压接部分的热压接头加压，使得IC芯片通过热压接合到布线板上。
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公开(公告)号：US20100288416A1
公开(公告)日：2010-11-18
申请号：US12747129
申请日：2008-11-13
申请人： Kazunori Hamazaki
发明人： Kazunori Hamazaki
IPC分类号： B29C65/02
CPC分类号： H01L24/75 , H01L21/67005 , H01L24/29 , H01L24/83 , H01L2224/13144 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/75316 , H01L2224/83101 , H01L2224/83856 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H05K3/323 , H05K2201/0133 , H05K2201/10674 , H05K2203/0278 , Y10T156/10 , Y10T156/1089 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/0401
摘要： An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a conductive adhesive agent having conductive particles and a low minimum melt viscosity where a thin electronic component having a thickness smaller than or equal to 200 μm is mounted on a wiring board. In the mounting apparatus, an anisotropic conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 μm is placed on the anisotropic conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.
摘要翻译： 电子部件安装装置能够显着降低使用导电性粒子的导电性粘合剂和低熔融粘度的热压接时的翘曲翘曲量，其中薄的电子部件的厚度小于或等于 至200μm安装在布线板上。 在安装装置中，将具有低于或等于1.0×10 3 Pa·s的最小熔体粘度的各向异性导电粘合剂膜放置在放置在基座上的布线板上，并且具有小于或等于200的厚度的IC芯片 μm放置在各向异性导电粘合膜上。 在安装装置中，IC芯片由具有由橡胶硬度低于或等于60的弹性体制成的压接部分的热压接头加压，使得IC芯片通过热压接合到布线板上。
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公开(公告)号：US08486212B2
公开(公告)日：2013-07-16
申请号：US12747129
申请日：2008-11-13
申请人： Kazunori Hamazaki
发明人： Kazunori Hamazaki
IPC分类号： B29C65/00
CPC分类号： H01L24/75 , H01L21/67005 , H01L24/29 , H01L24/83 , H01L2224/13144 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/75316 , H01L2224/83101 , H01L2224/83856 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H05K3/323 , H05K2201/0133 , H05K2201/10674 , H05K2203/0278 , Y10T156/10 , Y10T156/1089 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/0401
摘要： An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a conductive adhesive agent having conductive particles and a low minimum melt viscosity where a thin electronic component having a thickness smaller than or equal to 200 μm is mounted on a wiring board. In the mounting apparatus, an anisotropic conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 μm is placed on the anisotropic conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.
摘要翻译： 电子部件安装装置能够显着降低使用导电性粒子的导电性粘合剂和低熔融粘度的热压接时的翘曲翘曲量，其中薄的电子部件的厚度小于或等于 至200微米安装在接线板上。 在安装装置中，将具有低于或等于1.0×10 3 Pa·s的最小熔体粘度的各向异性导电粘合剂膜放置在放置在基座上的布线板上，并且具有小于或等于200的厚度的IC芯片 将妈妈放在各向异性导电粘合膜上。 在安装装置中，IC芯片由具有由橡胶硬度低于或等于60的弹性体制成的压接部分的热压接头加压，使得IC芯片通过热压接合到布线板上。
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公开(公告)号：US20110017397A1
公开(公告)日：2011-01-27
申请号：US12747130
申请日：2008-11-13
申请人： Kazunori Hamazaki
发明人： Kazunori Hamazaki
IPC分类号： B32B37/04
CPC分类号： H01L24/75 , H01L21/67005 , H01L24/83 , H01L24/90 , H01L24/95 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/2919 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/7598 , H01L2224/83101 , H01L2224/838 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , Y10T156/1089 , H01L2924/00 , H01L2224/0401
摘要： An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a non-conductive adhesive agent having a low minimum melt viscosity and having no conductive particle where a thin electronic component having a thickness smaller than or equal to 200 μm is mounted on a wiring board. In the mounting apparatus, a non-conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 μm is placed on the non-conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.
摘要翻译： 一种电子部件安装装置能够显着降低使用具有低最小熔融粘度并且不具有导电性粒子的非导电性粘合剂在热压接的情况下翘曲的电子部件的翘曲量，其中薄的电子部件具有厚度 小于或等于200μm的电极安装在布线板上。 在安装装置中，将具有低于或等于1.0×10 3 Pa·s的最小熔体粘度的非导电粘合剂膜放置在放置在基底上的布线板上，并且将具有小于或等于 将200μm放置在非导电粘合膜上。 在安装装置中，IC芯片由具有由橡胶硬度低于或等于60的弹性体制成的压接部分的热压接头加压，使得IC芯片通过热压接合到布线板上。
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