公开(公告)号：US20110237028A1

公开(公告)日：2011-09-29

申请号：US13131427

申请日：2010-02-23

申请人： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

发明人： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

IPC分类号： H01L21/50

CPC分类号： H01L24/92 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1623 ,  H01L2224/16238 ,  H01L2224/27334 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32012 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/364 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.

摘要翻译： 提供一种制造半导体器件的方法。 该方法包括通过使用绝缘树脂粘合膜（NCF）将半导体芯片通过倒装芯片安装在基板上，并防止NCF的溢出以及在热处理期间凸块和电极之间的绝缘树脂或无机填料的介入 紧迫。 该方法还包括临时固定尺寸的NCF，其尺寸基本上为周边排列布置的半导体芯片的多个凸块所包围的区域的面积的60〜100％，并且具有最小熔体粘度为2×102〜 1×105Pa·s，与由凸块相对应的多个基板的电极所围成的区域，使半导体芯片和基板彼此对准，使凸块和与其对应的电极相互对置。

公开(公告)号：US09368374B2

公开(公告)日：2016-06-14

申请号：US13131427

申请日：2010-02-23

申请人： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

发明人： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

IPC分类号： H01L21/00 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L24/92 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1623 ,  H01L2224/16238 ,  H01L2224/27334 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32012 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/364 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.

摘要翻译： 提供一种制造半导体器件的方法。 该方法包括通过使用绝缘树脂粘合膜（NCF）将半导体芯片通过倒装芯片安装在基板上，并防止NCF的溢出以及在热处理期间凸块和电极之间的绝缘树脂或无机填料的介入 紧迫。 该方法还包括临时固定尺寸的NCF，其尺寸基本上为周边排列布置的半导体芯片的多个凸块所包围的区域的面积的60〜100％，并且具有最小熔体粘度为2×102〜 1×105Pa·s，与由凸块相对应的多个基板的电极所围成的区域，使半导体芯片和基板彼此对准，使凸块和与其对应的电极相互对置。

公开(公告)号：US09630152B2

公开(公告)日：2017-04-25

申请号：US14343216

申请日：2012-09-05

申请人： Daisuke Sato ,  Masayuki Kaneda ,  Takashi Komatsu

发明人： Daisuke Sato ,  Masayuki Kaneda ,  Takashi Komatsu

IPC分类号： B01D39/00 ,  B01D39/14 ,  B01D63/00 ,  H01G9/00 ,  B01D71/72 ,  H01M2/16 ,  B01D69/02 ,  B01D71/38 ,  H01G9/02 ,  H01G11/52 ,  C08J9/28 ,  H01M2/14 ,  B01D61/14

CPC分类号： B01D71/72 ,  B01D61/147 ,  B01D69/02 ,  B01D71/38 ,  B01D2325/02 ,  B01D2325/021 ,  B01D2325/22 ,  B01D2325/30 ,  C08J9/283 ,  C08J2373/00 ,  H01G9/02 ,  H01G11/52 ,  H01M2/145 ,  H01M2/1653 ,  Y02E60/13 ,  Y10T428/2975 ,  Y10T442/626 ,  Y10T442/678

摘要： To provide a polyketone porous film having heat resistance and chemical resistance and useful as a filter for filtration having a high particle collection efficiency and as a battery or capacitor separator having a low permeation resistance to ion and the like.A polyketone porous film comprising from 10 to 100 mass % of a polyketone as a copolymer of carbon monoxide and one or more olefins, wherein the polyketone porous film has a pore formed only by a polyketone, the pore diameter uniformity parameter as a value obtained by dividing the standard deviation of the pore diameter in the pore by an average pore diameter is from 0 to 1.0, and the average through hole diameter of the polyketone porous film is from 0.01 to 50 μm.

公开(公告)号：US09359491B2

公开(公告)日：2016-06-07

申请号：US14361208

申请日：2012-06-26

申请人： Daisuke Sato

发明人： Daisuke Sato

IPC分类号： C08L9/06 ,  C08K3/36 ,  C08L15/00 ,  B60C1/00 ,  C08C19/44

CPC分类号： C08L9/06 ,  B60C1/0016 ,  C08C19/44 ,  C08K3/36 ,  C08K2201/006 ,  C08L15/00 ,  Y02T10/862 ,  C08F236/10 ,  C08F2230/085

摘要： Provided are a rubber composition improving wet-grip performance and its temperature dependence while ensuring good fuel economy, and a pneumatic tire including the composition. The composition includes, per 100% by mass of a rubber component: 5-55% by mass of an aromatic vinyl compound/conjugated diene compound copolymer (A) having an aromatic vinyl compound content of at least 5% by mass but less than 15% by mass and a vinyl bond content in a conjugated diene compound moiety of 10-70 mol %; and 5-75% by mass of an aromatic vinyl compound/conjugated diene compound copolymer (B) having an aromatic vinyl compound content of at least 15% by mass but less than 30% by mass and a vinyl bond content in a conjugated diene compound moiety of 10-70 mol %, and also includes, per 100 parts by mass of the rubber component, 10-150 parts by mass of a silica having a N2SA of 40-400 m2/g.

摘要翻译： 提供了一种在确保良好的燃料经济性的同时提高湿抓地性能和其温度依赖性的橡胶组合物，以及包括该组合物的充气轮胎。 该组合物包含相对于100质量％的橡胶成分：5-55质量％的芳香族乙烯基化合物/共轭二烯化合物共聚物（A），其芳香族乙烯基化合物含量为5质量％以上且小于15 质量％，共轭二烯化合物部分中的乙烯基键含量为10-70mol％; 和5-75质量％的芳香族乙烯基化合物/共轭二烯化合物共聚物（B），其芳香族乙烯基化合物含量为15质量％以上且30质量％以下，共轭二烯化合物中的乙烯基键含量 部分为10-70摩尔％，并且相对于100质量份的橡胶成分，也包含10〜150质量份的N 2 SA为40〜400m 2 / g的二氧化硅。

公开(公告)号：US09206490B2

公开(公告)日：2015-12-08

申请号：US14363750

申请日：2012-12-07

申请人： Takashi Ueno ,  Chikara Ohki ,  Daisuke Sato ,  Kyouhei Kageyama ,  Shougo Shimizu

发明人： Takashi Ueno ,  Chikara Ohki ,  Daisuke Sato ,  Kyouhei Kageyama ,  Shougo Shimizu

IPC分类号： F16C33/62 ,  F16C33/76 ,  F16C33/38 ,  C21D9/36 ,  C21D9/40 ,  C21D1/06 ,  C22C38/00 ,  C22C38/18 ,  F16C33/32 ,  F16C33/64 ,  C22C38/02 ,  C22C38/04 ,  C21D1/18 ,  F16C33/78 ,  F16C33/42 ,  F16C33/80 ,  F16C43/04 ,  F16C19/06 ,  F16C19/30 ,  F16C43/06

CPC分类号： C21D9/36 ,  C21D1/06 ,  C21D1/18 ,  C21D9/40 ,  C21D2211/001 ,  C21D2211/008 ,  C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  C22C38/18 ,  C23C8/32 ,  C23C8/80 ,  F16C19/06 ,  F16C19/30 ,  F16C33/32 ,  F16C33/3875 ,  F16C33/3887 ,  F16C33/427 ,  F16C33/585 ,  F16C33/62 ,  F16C33/64 ,  F16C33/7823 ,  F16C33/7843 ,  F16C33/7893 ,  F16C33/805 ,  F16C43/04 ,  F16C43/065 ,  F16C2202/04 ,  F16C2204/66 ,  F16C2208/36 ,  F16C2208/52 ,  F16C2208/60 ,  F16C2220/04 ,  F16C2223/16 ,  F16C2226/74 ,  F16C2240/06 ,  F16C2240/40 ,  F16C2240/94 ,  F16C2361/65

摘要： An outer ring, an inner ring, and a ball, each of which is a bearing part, are made of a quench-hardened steel containing not less than 0.90 mass % and not more than 1.05 mass % of carbon, not less than 0.15 mass % and not more than 0.35 mass % of silicon, not less than 0.01 mass % and not more than 0.50 mass % of manganese, and not less than 1.30 mass % and not more than 1.65 mass % of chromium with the rest consisting of an impurity. A contact surface thereof with another part has a nitrogen concentration of not less than 0.25 mass %. A remaining austenite amount in the contact surface is not less than 6 volume % and not more than 12 volume %.

摘要翻译： 每个都是轴承部分的外圈，内圈和球均由淬火硬化钢制成，其含有不小于0.90质量％且不大于1.05质量％的碳，不小于0.15质量％ ％以上0.35质量％以下的锰，不低于0.01质量％且不大于0.50质量％的锰，不少于1.30质量％且不超过1.65质量％的铬，其余由杂质构成 。 其另一部分的接触表面的氮浓度不低于0.25质量％。 接触表面中的剩余奥氏体量不小于6体积％且不大于12体积％。

公开(公告)号：US09050630B2

公开(公告)日：2015-06-09

申请号：US14003684

申请日：2012-02-24

申请人： Kazumi Kozawa ,  Kosuke Ando ,  Daisuke Sato

发明人： Kazumi Kozawa ,  Kosuke Ando ,  Daisuke Sato

IPC分类号： B07B7/08 ,  B07B4/08 ,  B07B7/086 ,  B03B9/00 ,  B07B9/00 ,  B07B4/02 ,  B07B11/00 ,  B07B4/00 ,  B07B11/08

CPC分类号： B07B7/08 ,  B03B9/00 ,  B07B4/00 ,  B07B4/02 ,  B07B4/08 ,  B07B7/086 ,  B07B9/00 ,  B07B11/00 ,  B07B11/08

摘要： A powder-classification method includes a mixing step in which a powder and a liquid additive are mixed together, a drying step in which the powder mixed in the mixing step is dried, a loading step in which the powder dried in the drying step is loaded into a fluid classifier, a heating step in which a gas is heated, a supplying step in which the gas heated in the heating step is supplied to the fluid classifier, and a classifying step in which the powder is classified in the fluid classifier based on a grain size of the powder.

摘要翻译： 粉末分级方法包括将粉末和液体添加剂混合在一起的混合步骤，将在混合步骤中混合的粉末干燥的干燥步骤，加载干燥步骤中干燥的粉末的装载步骤 将加热步骤中加热的气体供给至流体分选机的供给步骤，将分散在流体分选机中的分级步骤，基于以下步骤： 粉末的粒度。

公开(公告)号：US08989494B2

公开(公告)日：2015-03-24

申请号：US13488645

申请日：2012-06-05

申请人： Toshinari Itoko ,  Daisuke Sato

发明人： Toshinari Itoko ,  Daisuke Sato

IPC分类号： G06K9/32 ,  G06K9/18 ,  G06K9/03 ,  G06K9/72

CPC分类号： G06K9/72 ,  G06K2209/01

摘要： A method and apparatus for determining a reading order of characters The method includes preparing a list of character information, which is character information extracted from image data by character recognition processing and preparing a list of line information, which is made up of a line box surrounding a set of characters which are continuously aligned in the same direction in image data and an alignment direction of characters in the line box. In response to a request for adding character information to the list of character information, extracting a line box containing a character region of the character to be added, obtaining all character information having the character region contained in the concerned line box from the list of character information and rearranging according to the position with respect to the alignment direction of characters corresponding to the line box to determine a new reading order of characters.

公开(公告)号：US08917041B2

公开(公告)日：2014-12-23

申请号：US13808874

申请日：2011-06-30

申请人： Kenichi Kishimoto ,  Mineaki Isoda ,  Daisuke Sato ,  Ryuta Sasaki

发明人： Kenichi Kishimoto ,  Mineaki Isoda ,  Daisuke Sato ,  Ryuta Sasaki

IPC分类号： H02P23/12

CPC分类号： H02P6/16 ,  H02P6/182 ,  H02P6/188

摘要： A phase-shift detection circuit detects a phase shift in motor driving, using pulse-shaped position detection signal Rd and measurement signal Ms. The position detection signal is based on sensor signal Hs from a position sensor disposed in a motor. The measurement signal is based on the induced voltage from windings. The phase-shift detection circuit includes a level difference calculator and a phase-shift calculator. The level difference calculator calculates a level difference between the level of measurement signal Ms at a rising timing of position detection signal Rd and the level of measurement signal Ms at a falling timing thereof. The phase-shift calculator calculates the amount of phase shifts based on the level difference.

摘要翻译： 相移检测电路使用脉冲状位置检测信号Rd和测量信号Ms来检测电动机驱动中的相移。位置检测信号是基于设置在电动机中的位置传感器的传感器信号Hs。 测量信号基于来自绕组的感应电压。 相移检测电路包括电平差计算器和相移计算器。 电平差计算器计算位置检测信号Rd的上升时刻的测量信号Ms的电平与其下降时刻的测量信号Ms的电平之间的电平差。 相移计算器基于电平差来计算相移量。

公开(公告)号：US20140329931A1

公开(公告)日：2014-11-06

申请号：US14361208

申请日：2012-06-26

申请人： Daisuke Sato

发明人： Daisuke Sato

IPC分类号： C08L9/06

CPC分类号： C08L9/06 ,  B60C1/0016 ,  C08C19/44 ,  C08K3/36 ,  C08K2201/006 ,  C08L15/00 ,  Y02T10/862 ,  C08F236/10 ,  C08F2230/085

摘要： Provided are a rubber composition improving wet-grip performance and its temperature dependence while ensuring good fuel economy, and a pneumatic tire including the composition. The composition includes, per 100% by mass of a rubber component: 5-55% by mass of an aromatic vinyl compound/conjugated diene compound copolymer (A) having an aromatic vinyl compound content of at least 5% by mass but less than 15% by mass and a vinyl bond content in a conjugated diene compound moiety of 10-70 mol %; and 5-75% by mass of an aromatic vinyl compound/conjugated diene compound copolymer (B) having an aromatic vinyl compound content of at least 15% by mass but less than 30% by mass and a vinyl bond content in a conjugated diene compound moiety of 10-70 mol %, and also includes, per 100 parts by mass of the rubber component, 10-150 parts by mass of a silica having a N2SA of 40-400 m2/g.

摘要翻译： 提供了一种在确保良好的燃料经济性的同时提高湿抓地性能和其温度依赖性的橡胶组合物，以及包括该组合物的充气轮胎。 该组合物包含相对于100质量％的橡胶成分：5-55质量％的芳香族乙烯基化合物/共轭二烯化合物共聚物（A），其芳香族乙烯基化合物含量为5质量％以上且小于15 质量％，共轭二烯化合物部分中的乙烯基键含量为10-70mol％; 和5-75质量％的芳香族乙烯基化合物/共轭二烯化合物共聚物（B），其芳香族乙烯基化合物含量为15质量％以上且30质量％以下，共轭二烯化合物中的乙烯基键含量 部分为10-70摩尔％，并且相对于100质量份的橡胶成分，也包含10〜150质量份的N 2 SA为40〜400m 2 / g的二氧化硅。

公开(公告)号：US20140296376A1

公开(公告)日：2014-10-02

申请号：US14354307

申请日：2012-06-26

申请人： Daisuke Sato ,  Kazuya Torita ,  Soh Ishino

发明人： Daisuke Sato ,  Kazuya Torita ,  Soh Ishino

IPC分类号： C08L9/06 ,  C08L9/00 ,  C08L7/00

CPC分类号： C08L9/06 ,  B60C1/00 ,  B60C1/0016 ,  C08C19/22 ,  C08C19/25 ,  C08F230/08 ,  C08F236/04 ,  C08K3/36 ,  C08K5/548 ,  C08L7/00 ,  C08L9/00 ,  C08L15/00 ,  Y02T10/862 ,  C08F212/08 ,  C08F236/10 ,  C08F2230/085

摘要： Provided are: a rubber composition a achieving balanced improvement in processability, fuel economy, rubber strength, abrasion resistance, wet-grip performance, and handling stability, and a pneumatic tire including the composition. Included is a rubber composition including a conjugated diene polymer and a silica having N2SA of 40-400 m2/g, the diene polymer being obtained by polymerizing a monomer component including a conjugated diene compound and a silicon-containing vinyl compound in the presence of a polymerization initiator of formula (I): to produce, a copolymer, and reacting a compound containing nitrogen and/or silicon atoms with an active terminal of the copolymer, wherein the amount of the diene polymer is 1-90% by mass and the amount of a polyisoprene-based rubber is 0-70% by mass, each per 100% by mass of the rubber component, and the amount of the silica is 10-150 parts by mass per 100 parts by mass of the rubber component.

摘要翻译： 提供：橡胶组合物，其可加工性，燃料经济性，橡胶强度，耐磨性，湿抓地性能和操作稳定性的均衡提高，以及包含该组合物的充气轮胎。 包括具有共轭二烯聚合物和N 2 SA为40-400m 2 / g的二氧化硅的橡胶组合物，所述二烯聚合物通过在包含共轭二烯化合物和含硅乙烯基化合物的存在下聚合包含共轭二烯化合物和含硅乙烯基化合物而获得 式（I）的聚合引发剂：制备共聚物，并使含有氮和/或硅原子的化合物与共聚物的活性末端反应，其中二烯聚合物的量为1-90质量％，量 的聚异戊二烯类橡胶为0〜70质量％，相对于100质量％的橡胶成分，每100质量％的橡胶成分，二氧化硅的量为10〜150质量份。