摘要:
A method of measuring a voltage with an electron beam apparatus considers a change in a convergence factor due to a change in an S curve, as well as an error in a secondary electron signal level with a phase of measurement being scanned at random, to accurately measure the voltage. The method measures the voltage of a voltage measuring spot on a sample, prepares an analytic voltage by superimposing a probe voltage having an average of 0 V and no correlation with the measured voltage on the measured voltage, measures a secondary electron signal level with the analytic voltage, computes a convergence factor around a slice level set on the S curve according to a correlation between the secondary electron signal level and the probe voltage and according to an autocorrelation of the probe voltage, and updates the analytic voltage according to the convergence factor, thereby updating the measured voltage.
摘要:
A method of measuring a voltage with an electron beam apparatus considers a change in a convergence factor due to a change in an S curve, as well as an error in a secondary electron signal level with a phase of measurement being scanned at random, to accurately measure the voltage. The method measures the voltage of a voltage measuring spot on a sample, prepares an analytic voltage by superimposing a probe voltage having an average of 0 V and no correlation with the measured voltage on the measured voltage, measures a secondary electron signal level with the analytic voltage, computes a convergence factor around a slice level set on the S curve according to a correlation between the secondary electron signal level and the probe voltage and according to an autocorrelation of the probe voltage, and updates the analytic voltage according to the convergence factor, thereby updating the measured voltage.
摘要:
An Electron Beam Tester which corrects deformation of a secondary electron image produced from scanning a sample with an electron beam. The secondary electron image is stored in a storage unit. Luminance data of the stored image is accumulated to obtain a projected luminance distribution. The projected luminance distribution data is then analyzed by a parallelism evaluation unit to obtain a rotation angle. Then the rotation angle is used to determine maximum parallelism and correct deformation of the secondary electron image by providing deflection control which transforms the deflectors .
摘要:
An electron beam tester scans a sample with an electron beam to provide a secondary electron image, matches wiring patterns of the secondary electron image with wiring patterns prepared from CAD data, measures voltages of the wiring patterns, and corrects deformation of the secondary electron image. The electron beam tester comprises a pattern matching unit, a wiring pattern tester, a secondary electron image corrector, a wiring pattern inspection unit, and a pattern matching processor. The pattern matching unit simply and quickly matches the wiring patterns of the secondary electron image with the wiring patterns prepared from the CAD data. The wiring pattern tester detects slippage between layers of a multilayered semiconductor chip and correctly positions the electron beam on the chip during a pattern matching operation. The secondary electron image corrector accurately and automatically corrects deformation of the secondary electron image. The wiring pattern inspection unit simply and correctly determines a threshold used for preparing a binary image, to correctly carry out a pattern matching operation. The pattern matching processor accurately detects edges out of a blurred image, to correctly carry out a pattern matching operation.
摘要:
An electron beam tester scans a sample with an electron beam to provide a secondary electron image, matches wiring patterns of the secondary electron image with wiring patterns prepared from CAD data, measures voltages of the wiring patterns, and corrects deformation of the secondary electron image. The electron beam tester comprises a pattern matching unit, a wiring pattern tester, a secondary electron image corrector, a wiring pattern inspection unit, and a pattern matching processor. The pattern matching unit simply and quickly matches the wiring patterns of the secondary electron image with the wiring patterns prepared from the CAD data. The wiring pattern tester detects slippage between layers of a multilayered semiconductor chip and correctly positions the electron beam on the chip during a pattern matching operation. The secondary electron image corrector accurately and automatically corrects deformation of the secondary electron image. The wiring pattern inspection unit simply and correctly determines a threshold used for preparing a binary image, to correctly carry out a pattern matching operation. The pattern matching processor accurately detects edges out of a blurred image, to correctly carry out a pattern matching operation.
摘要:
An electron beam apparatus comprises, inside of an objective lens for focussing a primary electron beam e1 and irradiating it on a sample surface, a secondary electron energy analyzer having a retarding mesh electrode for analyzing the energy of a secondary electron e2 emitted from a point on the sample surface at which the primary electron beam e1 is irradiated. The secondary electron energy analyzer comprises a collimation unit for forming one or more electrostatic lenses by a nonuniform electrical field distribution and for having an electrostatic lens collimate the trajectory of a secondary electron e2 for its injection into a retarding grids (mesh electrode). The collimation unit comprises at least three cylindrical electrodes positioned between the sample surface and the retarding grid (mesh electrode) and numbered first, second and third from the one closest to the sample surface. An external power supply module applies an appropriate voltage to each of these cylindrical electrodes for having each duo of neighboring cylindrical electrodes form an electrostatic lens.
摘要:
A probing device includes a minute probe in which at least an end portion is formed by conductive material, a cantilever having one end to which the probe is attached, and another end fixed to a moving member movable relatively to a sample in each direction of X, Y and Z, a unit for moving the moving member relatively to the sample, a transducing unit for generating information of voltage or current by means of light, a connecting unit having a low electric resistance, for connecting the transducing unit and the end portion of the probe, a detecting unit for detecting a change in a physical amount occurring in the cantilever by a force caused between the probe and the sample by a relative proximity of the moving member to the sample, and a voltage measuring unit for measuring a voltage at a measurement point on the sample, which is determined based on an output of the detecting unit, by way of the transducing unit when the probe is contacted with the measurement point. By the constitution, it is possible to realize a voltage measurement with both an enhanced space resolution and an enhanced time resolution. Also, by using the probing device in an integrated circuit testing apparatus or system, it is possible to realize a stable probing to a minute wiring without increasing an electrical load with respect to the minute wiring and thus contribute to an improvement in the precision of a voltage measurement.
摘要:
An image forming apparatus removably having an operation panel having a display unit, an imaging unit and a wireless communication unit communicable with the image forming apparatus. In a status where the operation panel is not mounted on the image forming apparatus, an image indicating an operation method is combined with a video image obtained by the imaging unit and displayed on the display unit, and the combined image is displayed.
摘要:
An image-forming method includes a first image-forming step of forming an image on a fabric with a first ink composition and a second image-forming step of forming an image on the fabric with a second ink composition subsequently to the first image-forming step. The first ink composition contains a first colorant. The second ink composition contains a second colorant. The first colorant has an average particle size less than that of the second colorant.
摘要:
A multivariable transmitter has a microprocessor for executing a computation processing task such as calculating a differential pressure value and static pressure with using a plurality of physical quantity signals. The microprocessor executes a processing for obtaining data from a sensor every computation processing task and executes the computation processing task in a time-division manner.