摘要:
In an AC generator for a vehicle, a housing is formed at one end thereof with an end plate portion, a plurality of axial cooling liquid passages are provided in a body portion of the housing, and a circumferential cooling liquid passage and a radial cooling liquid passage each connecting the axial cooling liquid passages adjacent to each other are provided in an axial end face of the housing and the end plate portion, respectively.
摘要:
In an electric power conversion/inversion apparatus, including, such as an inverter therein, for obtaining reduction in circuit inductance and wiring resistance therein by bringing small as a whole, having good installability and high reliability and efficiency of electric power conversion, as well, semiconductor chips 1 are disposed, being put between a positive input bus bar 14p and a negative input bus bar 14n and plural output bus bars 18 at crossing positions thereof, and are connected electrically and thermally, to the positive input bus bar 14p in a pole direction consistent therewith while to the negative input bus bar 14n in a pole direction consistent therewith, and further to the common output bus bars 18 in pole directions being different from side by side.
摘要:
Provided is a method of manufacturing a resin molded gear, which is to be integrally formed by injection molding, and includes: a tooth portion formed along an outer peripheral surface of a rim; a web extending along an inner peripheral surface of the rim; and a gate portion arranged at a boss, which joins to at least part of the web and is formed on a core portion located at a center axis, the method using a synthetic resin having a melting temperature of Tm° C., the method including: injecting and loading the synthetic resin molten at the melting temperature of Tm° C. into a cavity of a mold for forming the resin molded gear; and setting, when the gate portion is solidified, a thickness center temperature T1 of the web to (Tm−20)° C. or more to (Tm+20)° C. or less and a surface temperature T2 of the tooth portion to (T1−50)° C. or less.
摘要:
A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.
摘要:
Provided is a method of manufacturing a resin molded gear, which is to be integrally formed by injection molding, and includes: a tooth portion formed along an outer peripheral surface of a rim; a web extending along an inner peripheral surface of the rim; and a gate portion arranged at a boss, which joins to at least part of the web and is formed on a core portion located at a center axis, the method using a synthetic resin having a melting temperature of Tm° C., the method including: injecting and loading the synthetic resin molten at the melting temperature of Tm° C. into a cavity of a mold for forming the resin molded gear; and setting, when the gate portion is solidified, a thickness center temperature T1 of the web to (Tm−20)° C. or more to (Tm+20)° C. or less and a surface temperature T2 of the tooth portion to (T1−50)° C. or less.
摘要:
A mask blank manufacturing department manufactures a mask blank by forming a thin film to be a mask pattern on a mask blank transparent substrate. When providing the mask blank to a mask manufacturing department, the mask blank manufacturing department provides optical characteristic information (transmittance variation) of the mask blank transparent substrate and optical characteristic information (transmittance variation and/or phase difference variation) of the mask blank to the mask manufacturing department. The optical characteristic information of the mask blank transparent substrate is provided to the mask blank manufacturing department from a materials processing department that manufactures mask blank transparent substrates.
摘要:
An image reading system includes an information processing apparatus and a scanner connected to the information processing apparatus via a network. Upon receiving input of information that specifies the number of pages to be included in a file through an input unit and a web browser, the information processing apparatus transmits the information through a first communication unit to the scanner. The scanner reads image data through a reading unit, and divides the image data into files based on the information through a data management unit. The scanner transmits the files to the information processing apparatus through a second communication unit. The information processing apparatus displays images of the files on a monitor.
摘要:
In flip chip attach of electronic components, underfill is filled between the component and the substrate to alleviate, for example, thermal stress. In electronic component mounting using copper pillars conducted so far, filler contained in the underfill may cause separation in the process of heating and curing the resin. Disclosed is plating the surfaces of the copper pillars with solder. Mobilization of the filler charged in the underfill due to electric fields produced by local cells that are developed upon contact between dissimilar metals, is suppressed, and occurrence of crack at connection portions is obviated. Thus, connection reliability is increased.
摘要:
A technology for effectively preventing deformation of a light reflector plate fabricated by forming a synthetic resin reflector plate into a three-dimensional shape enabling a thinner light reflector plate, and additionally, reducing processing costs is provided. An adhesive tape for shape-retention is adhered onto a reflector plate which is fabricated by forming predetermined areas of a light-reflecting plastic film or sheet into a three-dimensional shape.
摘要:
A three-dimensional light reflection plate that can successfully prevent deformation of the light reflection plate, reduce initial cost and product cost, and facilitate increase in size and reflectance. The light reflection plate includes a bottom plate in which a plurality of mutually parallel slit holes are formed on a flat, light-reflective plate material and a mountain plate that is rectangular from a planar view of which a width direction cross-sectional shape is a mountain shape and in which insertion sections are formed in both width-direction end sections. The mountain plate is fixed to the bottom plate by the insertion sections of the mountain plate being inserted into the slit holes of the bottom plate.