公开(公告)号：US20110138615A1

公开(公告)日：2011-06-16

申请号：US12753697

申请日：2010-04-02

申请人： Keung Jin Sohn ,  Chang Gun Oh ,  Tae Eun Chang

发明人： Keung Jin Sohn ,  Chang Gun Oh ,  Tae Eun Chang

IPC分类号： H05K3/00 ,  B23P17/04 ,  B23P19/00

CPC分类号： H05K3/0097 ,  H05K3/4682 ,  H05K2201/0215 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/104 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53265

摘要： Disclosed herein is a carrier for manufacturing a printed circuit board, including: a magnetic sheet; and a metal layer attached to at least one side of the magnetic sheet by magnetic properties of the magnetic sheet. The carrier is advantageous in that its structure can be simplified without performing a vacuum or releasing process at the time of the attachment and separation of the carrier, thus reducing process cost and process time and maintaining the size of a printed circuit board.

摘要翻译： 本文公开了一种用于制造印刷电路板的载体，包括：磁性片; 以及通过磁性片的磁性能而附着在磁性片的至少一侧的金属层。 载体的优点在于，可以简化其结构，而不会在载体的附着和分离时执行真空或释放过程，从而降低工艺成本和加工时间并保持印刷电路板的尺寸。

公开(公告)号：US20110139858A1

公开(公告)日：2011-06-16

申请号：US12721544

申请日：2010-03-10

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

IPC分类号： B23K31/02 ,  B32B15/01

CPC分类号： H05K3/4644 ,  H05K3/0097 ,  H05K2203/1536 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/12986

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

摘要翻译： 这里公开了一种用于制造基板的载体，包括：两个绝缘层，每个绝缘层的一侧上设置有第一金属层，在另一侧上设置有第二金属层; 以及第三金属层，其具有比所述第一金属层低的熔点，并且形成在分别形成在所述两个绝缘层上的所述两个第一金属层之间，使得所述两个第一金属层彼此附接。 载体的优点在于，可以通过加热第三金属层来分离载体，使得在分离载体时基板的尺寸不变，从而保持基板和制造设备之间的相容性。

公开(公告)号：US08344261B2

公开(公告)日：2013-01-01

申请号：US12805586

申请日：2010-08-06

申请人： Suk Won Lee ,  Keung Jin Sohn ,  Chang Gun Oh

发明人： Suk Won Lee ,  Keung Jin Sohn ,  Chang Gun Oh

IPC分类号： H05K1/09 ,  H05K1/11

CPC分类号： H05K3/007 ,  H05K3/0097 ,  H05K3/428 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/12569 ,  Y10T428/12583 ,  Y10T428/2839

摘要： Disclosed are a carrier substrate including an insulating base material with a copper foil layer formed on at least one surface thereof, a metal layer formed on the copper layer and having a length shorter than that of the copper foil layer, and an insulating layer formed on the metal layer, a fabrication method thereof, a printed circuit board (PCB) using the same, and a fabrication method thereof. Because there is no land at the via and core in the substrate, because a circuit pattern connected with the via can be formed to be finer, so the circuit pattern can be highly integrated and the substrate can become thinner. Thus, a printed circuit board (PCB) having a smaller size and reduced number of layers can be fabricated.

摘要翻译： 公开了一种载体基板，其包括在其至少一个表面上形成有铜箔层的绝缘基材，在铜层上形成的长度短于铜箔层的金属层，以及形成在 金属层，其制造方法，使用其的印刷电路板（PCB）及其制造方法。 由于在基板中的通孔和芯部没有焊盘，因为可以形成与通孔连接的电路图案更细，所以电路图案可以高度集成，并且基板可以变薄。 因此，可以制造具有更小尺寸和更少层数的印刷电路板（PCB）。

公开(公告)号：US08156635B2

公开(公告)日：2012-04-17

申请号：US12720567

申请日：2010-03-09

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

IPC分类号： B23P19/00

CPC分类号： H05K3/0097 ,  B32B15/20 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/047 ,  H05K2203/1105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/5313 ,  Y10T428/12493 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

摘要翻译： 本文公开了一种用于制造衬底的载体，包括：绝缘层，其包括在其一侧或两侧形成的第一金属层; 形成在所述第一金属层的一侧上的第二金属层; 以及形成在所述第二金属层的一侧上的第三金属层，其中所述第二金属层具有比所述第一金属层或所述第三金属层低的熔点。 载体的优点在于可以通过加热将载置层与载体分离，从而不需要布线过程，结果是当构建层与载体分离时，基底的尺寸不变化 从而重新使用载体并保持基板和制造设备之间的兼容性。

公开(公告)号：US20110155429A1

公开(公告)日：2011-06-30

申请号：US12805586

申请日：2010-08-06

申请人： Suk Won Lee ,  Keung Jin Sohn ,  Chang Gun Oh

发明人： Suk Won Lee ,  Keung Jin Sohn ,  Chang Gun Oh

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K3/10

CPC分类号： H05K3/007 ,  H05K3/0097 ,  H05K3/428 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/12569 ,  Y10T428/12583 ,  Y10T428/2839

摘要： Disclosed are a carrier substrate including an insulating base material with a copper foil layer formed on at least one surface thereof, a metal layer formed on the cooper layer and having a length shorter than that of the copper foil layer, and an insulating layer formed on the metal layer, a fabrication method thereof, a printed circuit board (PCB) using the same, and a fabrication method thereof. Because there is no land at the via and core in the substrate, because a circuit pattern connected with the via can be formed to be finer, so the circuit pattern can be highly integrated and the substrate can become thinner. Thus, a printed circuit board (PCB) having a smaller size and reduced number of layers can be fabricated.

摘要翻译： 公开了一种载体基板，其包括在其至少一个表面上形成有铜箔层的绝缘基材，在铜层上形成的长度短于铜箔层的金属层，以及形成在 金属层，其制造方法，使用其的印刷电路板（PCB）及其制造方法。 由于在基板中的通孔和芯部没有焊盘，因为可以形成与通孔连接的电路图案更细，所以电路图案可以高度集成，并且基板可以变薄。 因此，可以制造具有更小尺寸和更少层数的印刷电路板（PCB）。

公开(公告)号：US08720049B2

公开(公告)日：2014-05-13

申请号：US13009789

申请日：2011-01-19

申请人： Tae Kyun Bae ,  Chang Gun Oh ,  Ho Sik Park

发明人： Tae Kyun Bae ,  Chang Gun Oh ,  Ho Sik Park

IPC分类号： H05K3/20

CPC分类号： H05K3/4647 ,  H05K1/0366 ,  H05K2201/0195 ,  H05K2203/1189 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/51

摘要： Disclosed herein is a method for fabricating a printed circuit board, including: stacking a second insulating layer including a reinforcement on an outer surface of a first insulating layer having a post via formed thereon; polishing an upper surface of the second insulating layer to expose an upper side of the post via; stacking a film member on the second insulating layer to cover the post via and compress the second insulating layer; polishing an upper surface of the film member to expose an upper side of the post via; and forming a circuit layer connected to the post via on the upper surface of the film member.

摘要翻译： 这里公开了一种制造印刷电路板的方法，包括：在其上形成有具有柱经的第一绝缘层的外表面上堆叠包括增强材料的第二绝缘层; 抛光所述第二绝缘层的上表面以暴露所述柱通孔的上侧; 在第二绝缘层上堆叠膜构件以覆盖柱经和压缩第二绝缘层; 抛光膜构件的上表面以暴露柱通孔的上侧; 以及在所述膜构件的上表面上形成连接到所述柱通孔的电路层。

公开(公告)号：US06541527B1

公开(公告)日：2003-04-01

申请号：US09483912

申请日：2000-01-18

申请人： Son Ki Ihm ,  Chang Gun Oh ,  Jou Hyeon Ahn ,  Jin Eun Jang

发明人： Son Ki Ihm ,  Chang Gun Oh ,  Jou Hyeon Ahn ,  Jin Eun Jang

IPC分类号： C08J936

CPC分类号： C08J9/20

摘要： The present invention relates to a process for preparing post-crosslinked polymer bead with increased surface area and pore volume, and suitable pore size, allowing the separation of organic compounds by post-crosslinking gel-type copolymer bead whose crosslinking degree is low and initial surface area is small, or macroporous-type copolymer bead whose crosslinking degree is high and initial surface area is intermediate in the presence of a Friedel-Crafts catalyst, and polymer beads produced thereby. Though the surface area and pore volume of polymer beads may be varied depending on physical properties of copolymer beads and Friedel-Crafts reaction conditions, the present invention provides polymer beads with larger surface area than that of commercially available polymeric adsorbents produced by the conventional method employing a porogen only. Further, the polymer beads may be used as polymeric adsorbent and catalyst carrier, since they exhibit a high adsorption capacity for organic compounds in an aqueous solution, and chemically modified ones may be employed as polymer carrier, ion-exchange resin, and chelate resin.

摘要翻译： 本发明涉及一种制备具有增加的表面积和孔体积以及合适孔径的后交联聚合物珠粒的方法，允许通过后交联凝胶型共聚物珠粒分离有机化合物，其交联度低，初始表面 面积小，或者在Friedel-Crafts催化剂存在下交联度高，初期表面积中等的大孔型共聚物珠粒，以及由此产生的聚合物珠粒。 虽然聚合物珠粒的表面积和孔体积可以根据共聚物珠粒和Friedel-Crafts反应条件的物理性质而变化，但是本发明提供了具有比通过常规方法采用的市售聚合物吸附剂更大的表面积的聚合物珠粒 只有造孔剂。 此外，聚合物珠可以用作聚合物吸附剂和催化剂载体，因为它们在水溶液中表现出对有机化合物的高吸附能力，并且化学改性的聚合物珠可以用作聚合物载体，离子交换树脂和螯合树脂。

公开(公告)号：US20120011716A1

公开(公告)日：2012-01-19

申请号：US13137695

申请日：2011-09-02

申请人： Han Kim ,  Mi Sun Hwang ,  Suk Won Lee ,  Chang Gun Oh

发明人： Han Kim ,  Mi Sun Hwang ,  Suk Won Lee ,  Chang Gun Oh

IPC分类号： H05K3/42

CPC分类号： H05K3/462 ,  H05K1/0265 ,  H05K1/0366 ,  H05K3/025 ,  H05K3/108 ,  H05K3/4623 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09736 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A method of manufacturing a printed circuit board including: preparing a first double-sided substrate including a first insulating layer, a first lower copper layer, a second circuit layer including a first lower land, and a first via; preparing a second double-sided substrate including a second insulating layer, a third lower copper layer, a fourth circuit layer including a second lower land, and a second via; disposing a third insulating layer between the second circuit layer and the fourth circuit layer such that the first lower land and the second lower land are electrically connected to each other though a conductive bump; and forming a first circuit layer including a first circuit pattern connected to the first via on the first lower copper layer and forming a third circuit layer including a third circuit pattern connected to the second via on the third lower copper layer.

摘要翻译： 一种制造印刷电路板的方法，包括：制备包括第一绝缘层，第一下铜层，包括第一下焊盘的第二电路层和第一通孔的第一双面基板; 制备包括第二绝缘层，第三下铜层，包括第二下焊盘的第四电路层和第二通孔的第二双面基板; 在所述第二电路层和所述第四电路层之间设置第三绝缘层，使得所述第一下焊盘和所述第二下焊盘通过导电凸块彼此电连接; 以及形成第一电路层，所述第一电路层包括在所述第一下铜层上连接到所述第一通孔的第一电路图案，并形成第三电路层，所述第三电路层包括在所述第三下铜层上连接到所述第二通孔的第三电路图案。

公开(公告)号：US20090288872A1

公开(公告)日：2009-11-26

申请号：US12219078

申请日：2008-07-15

申请人： Han Kim ,  Mi Sun Hwang ,  Suk Won Lee ,  Chang Gun Oh

发明人： Han Kim ,  Mi Sun Hwang ,  Suk Won Lee ,  Chang Gun Oh

IPC分类号： H05K1/02 ,  H05K3/36

CPC分类号： H05K3/462 ,  H05K1/0265 ,  H05K1/0366 ,  H05K3/025 ,  H05K3/108 ,  H05K3/4623 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09736 ,  Y10T29/49126 ,  Y10T29/49165

摘要： Disclosed herein is a printed circuit board including an outmost fine circuit pattern. In the board, an end of a via, which has the minimum diameter, is connected to the outmost circuit layer of a substrate. The end surface, having the minimum diameter, is positioned at the outmost layer, so that the outmost circuit layer of the substrate, which needs to have a relatively high density in order to mount chips, compared to other circuit layers, can be more finely formed.

摘要翻译： 这里公开了包括最外部的精细电路图案的印刷电路板。 在板中，具有最小直径的通孔的端部连接到基板的最外层电路层。 具有最小直径的端面位于最外层，使得与其它电路层相比，为了安装芯片而需要具有相对较高密度的衬底的最外层电路层可以更细 形成。

公开(公告)号：US08356405B2

公开(公告)日：2013-01-22

申请号：US12972244

申请日：2010-12-17

申请人： Chang Gun Oh ,  Ho Sik Park ,  Tae Kyun Bae

发明人： Chang Gun Oh ,  Ho Sik Park ,  Tae Kyun Bae

IPC分类号： H05K3/36

CPC分类号： H05K3/4682 ,  H05K3/0097 ,  H05K3/4647 ,  H05K2203/1536 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： Disclosed herein is a method of manufacturing a printed circuit board, including: providing a carrier including an insulation layer, first metal foils formed on both sides of the insulation layer, adhesive layers respectively formed on the first metal foils and made of a thermoplastic resin, and second metal foils respectively formed on the adhesive layers; applying resists having openings for forming metal posts onto both sides of the carrier; forming metal plating layers for forming the metal posts in the openings; grinding surfaces of the resists; removing the resist and forming insulation layers on both sides of the carrier; and grinding surfaces of the insulation layers. The method is advantageous in that both sides of a carrier are simultaneously layered, it is possible to prevent a substrate from warping during the process of manufacturing the printed circuit board.

摘要翻译： 本发明公开了一种制造印刷电路板的方法，包括：提供包括绝缘层的载体，形成在绝缘层两侧的第一金属箔，分别形成在第一金属箔上并由热塑性树脂制成的粘合层， 和分别形成在粘合剂层上的第二金属箔; 在载体的两侧上施加具有用于形成金属柱的开口的抗蚀剂; 形成用于在所述开口中形成所述金属柱的金属镀层; 研磨抗蚀剂表面; 去除抗蚀剂并在载体的两侧形成绝缘层; 并研磨绝缘层的表面。 该方法的优点在于，载体的两侧同时层叠，可以防止在制造印刷电路板的过程中基板翘曲。