公开(公告)号：US06992273B2

公开(公告)日：2006-01-31

申请号：US10757989

申请日：2004-01-16

申请人： Ki Yong Yim ,  Sang Bum Sohn ,  Ho Seon Rew ,  Sung Bae Song ,  Jong Hoon Kim ,  Young Min Lee ,  Han Rim Song ,  Myoung Sik Kim

发明人： Ki Yong Yim ,  Sang Bum Sohn ,  Ho Seon Rew ,  Sung Bae Song ,  Jong Hoon Kim ,  Young Min Lee ,  Han Rim Song ,  Myoung Sik Kim

IPC分类号： H05B6/80

CPC分类号： H05B6/6429 ,  F24C15/2028 ,  H05B6/6423

摘要： Disclosed is a combination hood microwave oven, by which a room environment is maintained more pleasant and fresh by proving a microwave oven with an air curtain generating unit for preventing polluted air, which includes hot, smelling, or humid air produced from an oven range on cooking, from diffusing into a room. The present invention includes a cabinet disposed over an oven range, a cooking room having a predetermined cavity within the cabinet for cooking using an electromagnetic wave generated from a magnetron, a hood unit installed within the cabinet to discharge polluted air produced from the oven range on cooking, and an air curtain generating unit installed at a bottom side of the cabinet to prevent the polluted air from diffusing into a room.

摘要翻译： 公开了一种组合罩微波炉，通过用用于防止污染空气的空气幕发生单元的微波炉，通过微波炉保持室内环境更加愉快和新鲜，该空气包括由烘箱范围内产生的热，嗅觉或潮湿空气 烹饪，从扩散到一个房间。 本发明包括一个设置在烤箱范围内的柜体，一个烹调室，在机壳内具有一个预定的空腔，用于使用由磁控管产生的电磁波进行烹饪，一个安装在机柜内的发动机罩，用于将从烘箱范围产生的污染空气排出 烹调和安装在机柜底部的气帘产生单元，以防止污染的空气扩散到房间中。

公开(公告)号：US07098432B2

公开(公告)日：2006-08-29

申请号：US10915649

申请日：2004-08-09

申请人： Ho Seon Rew ,  Sung Bae Song ,  Jong Hoon Kim ,  Sang Bum Sohn

发明人： Ho Seon Rew ,  Sung Bae Song ,  Jong Hoon Kim ,  Sang Bum Sohn

IPC分类号： H05B6/80

CPC分类号： F24C15/2028 ,  H05B6/6423

摘要： A combined microwave oven and hood is provided. The combined microwave oven and hood includes a cavity assembly including a cavity and an electronic equipment room disposed at one side of the cavity, a blower for generating an absorptive power of contaminated air, a filter for filtering the contaminated air absorbed through the blower, and a drawer type air curtain module, which is transferred to a front side of the cavity assembly as operated.

摘要翻译： 提供组合的微波炉和罩。 组合的微波炉和罩包括空腔组件，其包括空腔和设置在空腔一侧的电子设备室，用于产生受污染空气的吸收能力的鼓风机，用于过滤通过鼓风机吸收的污染空气的过滤器，以及 抽屉式气帘模块，其被运送到空腔组件的前侧。

公开(公告)号：US20050253251A1

公开(公告)日：2005-11-17

申请号：US11055079

申请日：2005-02-11

申请人： Kwang Hyup An ,  Moon Kee Chung ,  Jeong Ho Lee ,  Ho Seon Rew ,  Jong Hoon Kim

发明人： Kwang Hyup An ,  Moon Kee Chung ,  Jeong Ho Lee ,  Ho Seon Rew ,  Jong Hoon Kim

IPC分类号： H01L23/36 ,  H01L21/48 ,  H01L23/367 ,  H05K7/20 ,  H01L23/495

CPC分类号： H01L21/4882 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink and a method for processing the surfaces of the heat sink are disclosed. The heat sink and a method for processing the surfaces of the heat sink can improve performance of heat dissipation of the heat sink per volume as a plurality of fine wires based on nanometer or micrometer units are grown on the surfaces of the base and heat-dissipative fins of the heat sink through an oxidation process. Here, the total volume of the heat sink is scarcely increased, but rather their surface area and surface roughness are increased.

摘要翻译： 公开了一种散热器和用于处理散热器表面的方法。 散热器和用于处理散热器表面的方法可以提高散热器每体积的散热性能，因为基于纳米或微米单位的多根细线生长在基底表面上并具有散热性 通过氧化过程散热片的散热片。 这里，散热器的总体积几乎不增加，而是其表面积和表面粗糙度增加。

公开(公告)号：US08847377B2

公开(公告)日：2014-09-30

申请号：US13569600

申请日：2012-08-08

申请人： Jong Hoon Kim ,  Min Suk Suh ,  Seung Taek Yang ,  Seung Hyun Lee ,  Tae Min Kang

发明人： Jong Hoon Kim ,  Min Suk Suh ,  Seung Taek Yang ,  Seung Hyun Lee ,  Tae Min Kang

IPC分类号： H01L23/02 ,  H01L21/683 ,  H01L21/56 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18

CPC分类号： H01L25/0652 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/2105 ,  H01L2224/221 ,  H01L2224/97 ,  H01L2225/06562 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/18161 ,  H01L2224/19 ,  H01L2924/00

摘要： A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads.

摘要翻译： 堆叠的晶片级封装包括具有第一焊盘的第一半导体芯片和具有第二焊盘的第二半导体芯片。 半导体芯片的两个接合焊盘面向相同的方向。 第二半导体芯片与第一半导体芯片平行设置。 第三半导体芯片设置在用作支撑衬底的第一和第二半导体芯片上。 第三半导体芯片具有在附接时在第一和第二半导体芯片之间露出的第三焊盘。 最后，再分布结构电连接到第一，第二和第三键合焊盘。

公开(公告)号：US08804305B2

公开(公告)日：2014-08-12

申请号：US13191890

申请日：2011-07-27

申请人： Hyung Joon Kim ,  Jong Hoon Kim

发明人： Hyung Joon Kim ,  Jong Hoon Kim

IPC分类号： H01G4/06

CPC分类号： H01G4/1227 ,  H01G4/008 ,  H01G4/012 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  Y10T29/435

摘要： Disclosed are a multilayer ceramic condenser and a method for manufacturing the same. There is provided a multilayer ceramic condenser including: a multilayer main body in which a plurality of dielectric layers including a first side, a second side, a third side, and a fourth side are stacked; a first cover layer and a second cover layer forming the plurality of dielectric layers; a first dielectric layer disposed between the first cover layer and the second cover layer and printed with a first inner electrode pattern drawn to the first side; a second dielectric layer alternately stacked with the first dielectric layer and printed with a second inner electrode pattern drawn to the third side; and a first side portion and a second side portion each formed on the second side and the fourth side opposite to each other.

摘要翻译： 公开了一种多层陶瓷电容器及其制造方法。 提供了一种多层陶瓷电容器，包括：多层主体，其中堆叠包括第一侧，第二侧，第三侧和第四侧的多个电介质层; 形成所述多个电介质层的第一覆盖层和第二覆盖层; 第一电介质层，设置在第一覆盖层和第二覆盖层之间，并印刷有第一内部电极图案，其被绘制到第一侧; 第二电介质层，与所述第一电介质层交替堆叠并且印刷有第二内部电极图案，所述第二内部电极图案被绘制到所述第三侧; 以及分别形成在彼此相对的第二侧和第四侧上的第一侧部和第二侧部。

公开(公告)号：US20120114535A1

公开(公告)日：2012-05-10

申请号：US13377377

申请日：2009-06-12

申请人： Jong Hoon Kim ,  Hwangseo Park ,  Han Oh Park

发明人： Jong Hoon Kim ,  Hwangseo Park ,  Han Oh Park

IPC分类号： B01L3/00 ,  C07D403/06 ,  C07D405/12 ,  C07D405/06

CPC分类号： C07D403/06 ,  C07D231/38 ,  C07D403/12 ,  C07D405/06

摘要： Provided are an RNase activity inhibitory compound to effectively control the activity of the RNase promoting degradation of extracted RNAs and, in addition, a sample storage container including the same. The RNase activity inhibitory compound and the sample storage container according to the present invention may be effectively used to store RNAs during RNA extraction or the extracted RNAs.

摘要翻译： 提供了一种RNase活性抑制化合物，用于有效控制RNA酶的活性，促进提取的RNA的降解，另外还含有包含其的样品储存容器。 根据本发明的RNA酶活性抑制化合物和样品储存容器可以有效地用于在RNA提取期间或所提取的RNA中存储RNA。

公开(公告)号：US08026586B2

公开(公告)日：2011-09-27

申请号：US12647640

申请日：2009-12-28

申请人： Jong Hoon Kim

发明人： Jong Hoon Kim

IPC分类号： H01L23/02

CPC分类号： H01L23/13 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor package comprises a substrate having bond fingers on an upper surface thereof and ball lands on a lower surface thereof; at least two chip modules stacked on the upper surface of the substrate, each of the at least two chip modules including a plurality of semiconductor chips having first connection members and stacked in a manner such that the first connection members of the semiconductor chips are connected to one another, the chip modules being stacked in a zigzag pattern such that connection parts of the chip modules project sideward; and second connection members electrically connecting the connection parts of the respective chip modules to the bond fingers of the substrate.

摘要翻译： 半导体封装包括在其上表面上具有键合指状物的衬底，并且在其下表面上具有焊盘; 至少两个芯片模块堆叠在所述基板的上表面上，所述至少两个芯片模块中的每一个包括多个半导体芯片，所述多个半导体芯片具有第一连接构件，并且以使得所述半导体芯片的所述第一连接构件连接到 另一方面，芯片模块以锯齿形图案堆叠，使得芯片模块的连接部分向​​侧面投射; 以及第二连接构件，其将各个芯片模块的连接部分电连接到基板的键​​合指状物。

公开(公告)号：US07745439B2

公开(公告)日：2010-06-29

申请号：US10599913

申请日：2005-04-12

申请人： Hyae Gyeong Cheon ,  Sung-Eun Yoo ,  Sung Soo Kim ,  Sung-Don Yang ,  Kwang-Rok Kim ,  Sang Dal Rhee ,  Jin Hee Ahn ,  Seung Kyu Kang ,  Won Hoon Jung ,  Sung Dae Park ,  Nam Gee Kim ,  Sun Mee Kim ,  Kil Woong Mo ,  Jae Mok Lee ,  Hye Jung Kang ,  Koun Ho Lee ,  Jong Hoon Kim ,  Jeong-Hyung Lee ,  Seung Jun Kim

发明人： Hyae Gyeong Cheon ,  Sung-Eun Yoo ,  Sung Soo Kim ,  Sung-Don Yang ,  Kwang-Rok Kim ,  Sang Dal Rhee ,  Jin Hee Ahn ,  Seung Kyu Kang ,  Won Hoon Jung ,  Sung Dae Park ,  Nam Gee Kim ,  Sun Mee Kim ,  Kil Woong Mo ,  Jae Mok Lee ,  Hye Jung Kang ,  Koun Ho Lee ,  Jong Hoon Kim ,  Jeong-Hyung Lee ,  Seung Jun Kim

IPC分类号： A61K31/216 ,  A61K31/4402 ,  A61K31/5375 ,  C07C69/753 ,  C07D211/70 ,  C07D265/32

CPC分类号： C07D295/088 ,  C07C65/26 ,  C07C69/757 ,  C07C229/50 ,  C07C233/52 ,  C07C255/47 ,  C07C2601/14 ,  C07C2602/08 ,  C07D295/155

摘要： The inventive indene derivatives of formula (I) are capable of selectively modulating the activities of peroxisome proliferator activated receptors (PPARs), causing no adverse side effects, and thus, they are useful for the treatment and prevention of disorders modulated by PPARs, i.e., metabolic syndromes such as diabetes, obesity, arteriosclerosis, hyperlipidemia, hyperinsulinism and hypertension, inflammatory diseases such as osteoporosis, liver cirrhosis and asthma, and cancer.

摘要翻译： 式（I）的本发明的茚衍生物能够选择性调节过氧化物酶体增殖物激活受体（PPAR）的活性，不引起副作用，因此它们可用于治疗和预防由PPARs调节的病症， 糖尿病，肥胖，动脉硬化，高脂血症，高胰岛素血症和高血压等代谢综合征，骨质疏松症，肝硬化和哮喘等炎性疾病和癌症。

公开(公告)号：US07495340B2

公开(公告)日：2009-02-24

申请号：US11646698

申请日：2006-12-28

申请人： Jong Hoon Kim

发明人： Jong Hoon Kim

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/528 ,  H01L27/0207 ,  H01L27/115 ,  H01L2924/0002 ,  H01L2924/00

摘要： A metal layer structure of a semiconductor memory device is disclosed. The metal layer structure includes: a first metal layer to be connected to a contact plug; and a plurality of a second metal layers that are formed in parallel at a second spaced distance around the first metal layer, wherein a spaced distance of the second metal layers nearest the first metal layer maintains the second spaced distance which is wider than a first spaced distance of the second metal layers around the contact plug, and the spaced distance of the second metal layer next to the first metal layer maintains a third spaced distance, which is narrower than the second spaced distance, and the spaced distance between adjacent second metal layers gradually decreases to eventually be equal to the first spaced distance, for the second metal layers farthest from the first metal layer. Accordingly, an alignment margin can be ensured without requiring more area, and the contact plug can be connected to the next metal layer, even if an alignment error is produced.

摘要翻译： 公开了一种半导体存储器件的金属层结构。 金属层结构包括：要连接到接触插塞的第一金属层; 以及多个第二金属层，所述多个第二金属层以围绕所述第一金属层的第二间隔距离平行地形成，其中所述第二金属层与所述第一金属层最近的间隔距离保持第二间隔距离， 第二金属层围绕接触塞的距离以及与第一金属层相邻的第二金属层的间隔距离保持比第二间隔距离窄的第三间隔距离，并且相邻的第二金属层之间的间隔距离 对于距离第一金属层最远的第二金属层，逐渐减小以最终等于第一间隔距离。 因此，即使产生对准误差，也可以确保对准余量而不需要更多的面积，并且可以将接触插塞连接到下一个金属层。

公开(公告)号：US07473700B2

公开(公告)日：2009-01-06

申请号：US10536408

申请日：2003-11-26

申请人： Il Hwan Cho ,  Dong Hyun Ko ,  Myeong Yun Chae ,  In Ki Min ,  Young Hoon Kim ,  Kyu Jeong Yeon ,  Jong Hoon Kim ,  Sung Hak Jung ,  Sang Wook Park ,  Il Hwan Kim ,  Hyung Chul Ryu ,  Ji Young Noh ,  Hyun Jung Park ,  Jie Eun Park ,  Young Mee Chung

发明人： Il Hwan Cho ,  Dong Hyun Ko ,  Myeong Yun Chae ,  In Ki Min ,  Young Hoon Kim ,  Kyu Jeong Yeon ,  Jong Hoon Kim ,  Sung Hak Jung ,  Sang Wook Park ,  Il Hwan Kim ,  Hyung Chul Ryu ,  Ji Young Noh ,  Hyun Jung Park ,  Jie Eun Park ,  Young Mee Chung

IPC分类号： A61K31/41 ,  C07D249/08

CPC分类号： C07D249/12 ,  C07D249/10

摘要： A 1,2,4-triazole derivative of formula 1 or a non-toxic salt thereof, a preparation method thereof, and a pharmaceutical composition containing the derivative or the salt as an active ingredient are provided.

摘要翻译： 提供式1的1,2,4-三唑衍生物或其无毒盐，其制备方法和含有该衍生物或盐作为有效成分的药物组合物。