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公开(公告)号：US07999193B2
公开(公告)日：2011-08-16
申请号：US12247471
申请日：2008-10-08
IPC分类号： H05K1/11
CPC分类号： H05K3/445 , H05K1/056 , H05K3/4046 , H05K3/4602 , H05K3/4608 , H05K2201/0323 , H05K2201/09827 , H05K2201/10234 , H05K2201/10416 , Y10T29/49124
摘要： There is provided a wiring substrate. The wiring substrate includes: a core substrate formed of a conductive material and having a through hole therein; an insulating layer formed on first and second surfaces of the core substrate; wiring patterns formed on the first and second surfaces via the insulating layer; and a via formed in the through hole and electrically connected to the wiring patterns. The via includes: a conductor ball and a conductor portion. The conductor ball has a conductive surface and an insulating member covering the conductive surface. A portion of the conductive surface is exposed from the insulating member. The conductor portion is electrically connected to the exposed conductive surface and the wiring patterns. At least one of the insulating member and the insulating layer is interposed between the via and the core substrate.
摘要翻译： 提供了布线基板。 布线基板包括：由导电材料形成并在其中具有通孔的芯基板; 绝缘层，形成在所述芯基板的第一和第二表面上; 通过绝缘层在第一和第二表面上形成的布线图案; 以及形成在通孔中并且电连接到布线图案的通孔。 通孔包括：导体球和导体部分。 导体球具有导电表面和覆盖导电表面的绝缘构件。 导电表面的一部分从绝缘构件露出。 导体部分电连接到暴露的导电表面和布线图案。 绝缘构件和绝缘层中的至少一个介于通路和芯基板之间。
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公开(公告)号：US08161636B2
公开(公告)日：2012-04-24
申请号：US12272048
申请日：2008-11-17
IPC分类号： H01K3/10
CPC分类号： H05K1/0366 , H05K3/445 , H05K3/4641 , H05K2201/0278 , H05K2201/029 , H05K2201/0323 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as the thermal expansion coefficient of the circuit board. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs which include first fibers that conduct electricity and second fibers that do not conduct electricity, which have the second fibers disposed at positions where plated through holes will pass through, and which are impregnated with resin; a step of forming through holes at positions in the core portion where the second fibers are disposed; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the first fibers and thereby produce a core substrate.
摘要翻译： 电路板具有以细间距布置的电镀通孔，并满足与电路板的热膨胀系数等特性相关的要求。 一种制造电路板的方法包括：通过热压接预浸料形成芯部的步骤，该预浸料包括导电的第一纤维和不导电的第二纤维，其中第二纤维布置在镀通孔的位置 通过，并用树脂浸渍; 在设置有第二纤维的芯部中的位置形成通孔的工序; 以及在通孔的内表面上形成导电层的步骤，在不干扰第一纤维的位置处形成电镀通孔，从而制造芯基板。
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公开(公告)号：US20090095520A1
公开(公告)日：2009-04-16
申请号：US12247471
申请日：2008-10-08
CPC分类号： H05K3/445 , H05K1/056 , H05K3/4046 , H05K3/4602 , H05K3/4608 , H05K2201/0323 , H05K2201/09827 , H05K2201/10234 , H05K2201/10416 , Y10T29/49124
摘要： There is provided a wiring substrate. The wiring substrate includes: a core substrate formed of a conductive material and having a through hole therein; an insulating layer formed on first and second surfaces of the core substrate; wiring patterns formed on the first and second surfaces via the insulating layer; and a via formed in the through hole and electrically connected to the wiring patterns. The via includes: a conductor ball and a conductor portion. The conductor ball has a conductive surface and an insulating member covering the conductive surface. A portion of the conductive surface is exposed from the insulating member. The conductor portion is electrically connected to the exposed conductive surface and the wiring patterns. At least one of the insulating member and the insulating layer is interposed between the via and the core substrate.
摘要翻译： 提供了布线基板。 布线基板包括：由导电材料形成并在其中具有通孔的芯基板; 绝缘层，形成在所述芯基板的第一和第二表面上; 通过绝缘层在第一和第二表面上形成的布线图案; 以及形成在通孔中并且电连接到布线图案的通孔。 通孔包括：导体球和导体部分。 导体球具有导电表面和覆盖导电表面的绝缘构件。 导电表面的一部分从绝缘构件露出。 导体部分电连接到暴露的导电表面和布线图案。 绝缘构件和绝缘层中的至少一个介于通路和芯基板之间。
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公开(公告)号：US08186053B2
公开(公告)日：2012-05-29
申请号：US12271519
申请日：2008-11-14
CPC分类号： H01L23/49822 , H01L23/145 , H01L23/49816 , H01L23/49827 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K1/056 , H05K3/426 , H05K3/445 , H05K3/4608 , H05K2201/0281 , H05K2201/0323 , H05K2201/0347 , H05K2201/0959 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/12035 , H01L2224/0401
摘要： A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as strength and thermal expansion coefficient. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding prepregs formed by disposing carbon fibers so as to produce openings at positions where plated through holes will pass through and impregnating the carbon fibers with resin; a step of forming through holes that pass inside the openings at positions of the openings in the core portion; and a step of forming a conductive layer on inner surfaces of the through holes to form plated through holes at positions that do not interfere with the carbon fibers and thereby produce a core substrate.
摘要翻译： 电路板具有以细间距布置的电镀通孔，并且满足与强度和热膨胀系数等特性有关的要求。 一种电路板的制造方法，其特征在于，包括：通过热压缩形成芯部的步骤，通过设置碳纤维形成的预浸料，以在电镀通孔穿过的位置处产生开口，并用树脂浸渍碳纤维; 在芯部的开口部的位置形成贯通孔内的通孔的工序; 以及在通孔的内表面上形成导电层的步骤，在不干扰碳纤维的位置处形成电镀通孔，从而制造芯基板。
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公开(公告)号：US07257295B2
公开(公告)日：2007-08-14
申请号：US10946029
申请日：2004-09-20
申请人： Kishio Yokouchi
发明人： Kishio Yokouchi
IPC分类号： G02B6/26
CPC分类号： G02B6/24
摘要： Optical couplers having attachment features are disclosed. A typical coupler according to the present invention couples an optical signal from an optical fiber to a channel waveguide by overlapping the cores of the optical fiber and channel waveguide along a portion of their waveguide lengths, with a spacing distance between the cores of not more than 20 microns for single-mode light coupling, and not more than 100 microns for multi-mode light coupling. This is in contrast to a prior art coupler, which seeks to position the ends of the two cores in a facing relationship. In embodiments according to the present invention, attachment films may be disposed in the overlapping regions to provide advantageous coupling arrangements and new types of opto-electric devices.
摘要翻译： 公开了具有连接特征的光耦合器。 根据本发明的典型耦合器将光信号从光纤耦合到通道波导，通过沿其波导长度的一部分重叠光纤和通道波导的芯，其间的间距距离不大于 单模光耦合为20微米，多模光耦合不超过100微米。 这与现有技术的耦合器相反，该耦合器试图将两个芯的端部定位成面对的关系。 在根据本发明的实施例中，附着膜可以设置在重叠区域中以提供有利的耦合布置和新型的光电装置。
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6.发明授权公开(公告)号：US07209621B2
公开(公告)日：2007-04-24
申请号：US10888308
申请日：2004-07-09
申请人： Alexei Glebov , Michael G. Lee , Kishio Yokouchi
发明人： Alexei Glebov , Michael G. Lee , Kishio Yokouchi
IPC分类号： G02B6/10
摘要： Optical apparatuses providing optical interconnections among a plurality N of electronic components. One exemplary apparatus comprises a slab waveguide having a core layer that enables light beams to propagate in a plurality of directions, a plurality of N reception ports, and a plurality of N transmission ports, each reception port and each transmission port serving a respective electronic component, and each being optically coupled to the core layer of the slab waveguide. Each transmission port is configured to receive a plurality of light beams from its assigned electronic component and to transmit each received light beam onto the slab waveguide in a direction toward a reception port. Each reception port is configured to receive from the slab waveguide a plurality of light beams transmitted to it from at least two different transmission ports. Light beams within the slab waveguide are permitted to cross paths. Other exemplary embodiments are disclosed.
摘要翻译： 在多个N个电子部件之间提供光学互连的光学装置。 一个示例性装置包括具有能够使光束在多个方向上传播的核心层的平板波导，多个N个接收端口和多个N个传输端口，每个接收端口和每个传输端口服务于相应的电子部件 ，并且每个光学耦合到平板波导的芯层。 每个传输端口被配置为从其分配的电子部件接收多个光束，并且在朝向接收端口的方向上将每个接收的光束发射到平板波导上。 每个接收端口被配置为从平板波导接收从至少两个不同传输端口传输到其的多个光束。 平板波导内的光束被允许交叉路径。 公开了其它示例性实施例。
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7.发明申请Optical backplanes with integrated optical couplers and methods of making the same 有权具有集成光耦合器的光背板及其制造方法公开(公告)号：US20060210213A1
公开(公告)日：2006-09-21
申请号：US11080042
申请日：2005-03-15
申请人： Lidu Huang , Kishio Yokouchi
发明人： Lidu Huang , Kishio Yokouchi
IPC分类号： G02B6/12
CPC分类号： G02B6/43 , G02B6/4206
摘要： Optical backplanes providing integrated optical couplers to external optical fibers are disclosed, along with methods for making the same. An exemplary optical backplane has a first cladding layer disposed over the top surface of a substrate, and at least a first core body disposed over the first cladding layer, with the first core body having a first end and a second end. A material layer is disposed above the first cladding layer and the first end of the first core body, with the material layer having a top surface and a bottom surface. A focusing element is formed at the top surface of the material layer, with the focusing element being located above the first end of the first core body.
摘要翻译： 公开了向外部光纤提供集成光耦合器的光学背板及其制造方法。 示例性的光背板具有设置在基板的顶表面上的第一包层，以及设置在第一包层上方的至少第一芯体，第一芯体具有第一端和第二端。 材料层设置在第一包层和第一芯体的第一端之上，其中材料层具有顶表面和底表面。 聚焦元件形成在材料层的顶表面处，聚焦元件位于第一芯体的第一端之上。
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公开(公告)号：US20060062520A1
公开(公告)日：2006-03-23
申请号：US10946029
申请日：2004-09-20
申请人： Kishio Yokouchi
发明人： Kishio Yokouchi
IPC分类号： G02B6/26
CPC分类号： G02B6/24
摘要： Optical couplers having attachment features are disclosed. A typical coupler according to the present invention couples an optical signal from an optical fiber to a channel waveguide by overlapping the cores of the optical fiber and channel waveguide along a portion of their waveguide lengths, with a spacing distance between the cores of not more than 20 microns for single-mode light coupling, and not more than 100 microns for multi-mode light coupling. This is in contrast to a prior art coupler, which seeks to position the ends of the two cores in a facing relationship. In embodiments according to the present invention, attachment films may be disposed in the overlapping regions to provide advantageous coupling arrangements and new types of opto-electric devices.
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公开(公告)号：US06996303B2
公开(公告)日：2006-02-07
申请号：US10799026
申请日：2004-03-12
申请人： Alexei Glebov , Kishio Yokouchi
发明人： Alexei Glebov , Kishio Yokouchi
IPC分类号： G02B6/12
CPC分类号： G02B6/1221 , G02B6/3688 , G02B6/43
摘要： A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.
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公开(公告)号：US20050201707A1
公开(公告)日：2005-09-15
申请号：US10799026
申请日：2004-03-12
申请人： Alexei Glebov , Kishio Yokouchi
发明人： Alexei Glebov , Kishio Yokouchi
CPC分类号： G02B6/1221 , G02B6/3688 , G02B6/43
摘要： A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.
摘要翻译： 公开了适用于用于互连光电路板的光背板中的柔性光连接器以及制造光连接器的方法。 柔性光连接器包括两层或多层上的多个波导，提供允许光电路板之间的光通信的多个光路。 光连接器可以与背板分开制造，然后安装在背板上。 本发明的背板还可以具有用于可移除地保持和定位光电路板的安装结构，并且可以可选地包括用于在电路板之间提供电互连的电迹线。
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