HYBRID PHOTORESIST COMPOSITION AND PATTERN FORMING METHOD USING THEREOF
    2.
    发明申请
    HYBRID PHOTORESIST COMPOSITION AND PATTERN FORMING METHOD USING THEREOF 有权
    混合光电组合物和使用其的图案形成方法

    公开(公告)号:US20130122421A1

    公开(公告)日:2013-05-16

    申请号:US13293672

    申请日:2011-11-10

    IPC分类号: G03F7/20 G03F7/027 G03F7/004

    摘要: The present invention relates to a hybrid photoresist composition for improved resolution and a pattern forming method using the photoresist composition. The photoresist composition includes a radiation sensitive acid generator, a crosslinking agent and a polymer having a hydrophobic monomer unit and a hydrophilic monomer unit containing a hydroxyl group. At least some of the hydroxyl groups are protected with an acid labile moiety having a low activation energy. The photoresist is capable of producing a hybrid response to a single exposure. The patterning forming method utilizes the hybrid response to form a patterned structure in the photoresist layer. The photoresist composition and the pattern forming method of the present invention are useful for printing small features with precise image control, particularly spaces of small dimensions.

    摘要翻译: 本发明涉及一种用于改进分辨率的混合光致抗蚀剂组合物和使用光致抗蚀剂组合物的图案形成方法。 光致抗蚀剂组合物包括辐射敏感酸产生剂,交联剂和具有疏水性单体单元的聚合物和含有羟基的亲水性单体单元。 至少一些羟基被具有低活化能的酸不稳定部分保护。 光致抗蚀剂能够产生对单次曝光的混合响应。 图案形成方法利用混合响应在光致抗蚀剂层中形成图案化结构。 本发明的光致抗蚀剂组合物和图案形成方法可用于打印具有精确图像控制的特征,特别是小尺寸的空间。

    Method of multiple patterning to form semiconductor devices
    3.
    发明授权
    Method of multiple patterning to form semiconductor devices 有权
    多重图形化形成半导体器件的方法

    公开(公告)号:US08871596B2

    公开(公告)日:2014-10-28

    申请号:US13555240

    申请日:2012-07-23

    IPC分类号: H01L21/31

    摘要: A method of forming different structures of a semiconductor device using a single mask and a hybrid photoresist. The method includes: applying a first photoresist layer on a semiconductor substrate; patterning the first photoresist layer using a photomask to form a first patterned photoresist layer; using the first patterned photoresist layer to form a first structure of a semiconductor device; removing the first patterned photoresist layer; applying a second photoresist layer on the semiconductor substrate; patterning the second photoresist layer using the photomask to form a second patterned photoresist layer; using the second patterned photoresist layer to form a second structure of a semiconductor device; removing the second patterned photoresist layer; and wherein either the first or the second photoresist layer is a hybrid photoresist layer comprising a hybrid photoresist.

    摘要翻译: 使用单个掩模和混合光致抗蚀剂形成半导体器件的不同结构的方法。 该方法包括:在半导体衬底上施加第一光致抗蚀剂层; 使用光掩模图案化第一光致抗蚀剂层以形成第一图案化光致抗蚀剂层; 使用所述第一图案化的光致抗蚀剂层形成半导体器件的第一结构; 去除第一图案化光致抗蚀剂层; 在所述半导体衬底上施加第二光致抗蚀剂层; 使用光掩模图案化第二光致抗蚀剂层以形成第二图案化光致抗蚀剂层; 使用所述第二图案化的光致抗蚀剂层形成半导体器件的第二结构; 去除第二图案化光致抗蚀剂层; 并且其中所述第一或第二光致抗蚀剂层是包含混合光致抗蚀剂的混合光致抗蚀剂层。

    Developable bottom antireflective coating compositions for negative resists
    4.
    发明授权
    Developable bottom antireflective coating compositions for negative resists 有权
    用于负性抗蚀剂的可开发的底部抗反射涂料组合物

    公开(公告)号:US08715907B2

    公开(公告)日:2014-05-06

    申请号:US13206796

    申请日:2011-08-10

    IPC分类号: G03F7/09 G03F7/11 G03F7/30

    摘要: A negative developable bottom antireflective coating (NDBARC) material includes a polymer containing an aliphatic alcohol moiety, an aromatic moiety, and a carboxylic acid moiety. The NDBARC composition is insoluble in a typical resist solvent such as propylene glycol methyl ether acetate (PGMEA) after coating and baking. The NDBARC material also includes a photoacid generator, and optionally a crosslinking compound. In the NDBARC material, the carboxylic acid provides the developer solubility, while the alcohol alone, the carboxylic acid alone, or their combination provides the PGMEA resistance. The NDBARC material has resistance to the resist solvent, and thus, intermixing does not occur between NDBARC and resist during resist coating over NDBARC. After exposure and bake, the lithographically exposed portions of both the negative photoresist and the NDBARC layer become insoluble in developer due to the chemically amplified crosslinking of the polymers in negative resist and NDBARC layer in the lithographically exposed portions.

    摘要翻译: 负显影底部抗反射涂层(NDBARC)材料包括含有脂族醇部分,芳族部分和羧酸部分的聚合物。 NDBARC组合物在涂布和烘烤后不溶于典型的抗蚀剂溶剂如丙二醇甲基醚乙酸酯(PGMEA)。 NDBARC材料还包括光致酸发生剂和任选的交联化合物。 在NDBARC材料中,羧酸提供了显影剂的溶解度,而单独的醇,单独的羧酸或它们的组合提供了PGMEA的抗性。 NDBARC材料对抗蚀剂溶剂具有抗性,因此在NDBARC的抗蚀涂层期间,NDBARC和抗蚀剂之间不会发生混合。 在曝光和烘烤之后,由于在光刻曝光部分中的负光刻胶和NDBARC层中的聚合物的化学扩展交联,负光致抗蚀剂和NDBARC层的光刻曝光部分变得不溶于显影剂。

    DEVELOPABLE BOTTOM ANTIREFLECTIVE COATING COMPOSITION AND PATTERN FORMING METHOD USING THEREOF
    5.
    发明申请
    DEVELOPABLE BOTTOM ANTIREFLECTIVE COATING COMPOSITION AND PATTERN FORMING METHOD USING THEREOF 有权
    可开发的底部抗反射涂料组合物及其使用的图案形成方法

    公开(公告)号:US20140004712A1

    公开(公告)日:2014-01-02

    申请号:US13537177

    申请日:2012-06-29

    IPC分类号: G03F7/20 H01L21/265 C09K3/00

    摘要: The present invention relates to a developable bottom antireflective coating (BARC) composition and a pattern forming method using the BARC composition. The BARC composition includes a first polymer having a first carboxylic acid moiety, a hydroxy-containing alicyclic moiety, and a first chromophore moiety; a second polymer having a second carboxylic acid moiety, a hydroxy-containing acyclic moiety, and a second chromophore moiety; a crosslinking agent; and a radiation sensitive acid generator. The first and second chromophore moieties each absorb light at a wavelength from 100 nm to 400 nm. In the patterning forming method, a photoresist layer is formed over a BARC layer of the BARC composition. After exposure, unexposed regions of the photoresist layer and the BARC layer are selectively removed by a developer to form a patterned structure in the photoresist layer. The BARC composition and the pattern forming method are especially useful for implanting levels.

    摘要翻译: 本发明涉及一种可显影底部抗反射涂层(BARC)组合物和使用该BARC组合物的图案形成方法。 BARC组合物包括具有第一羧酸部分,含羟基脂环族部分和第一发色团部分的第一聚合物; 具有第二羧酸部分的第二聚合物,含羟基的无环部分和第二发色团部分; 交联剂; 和辐射敏感酸发生器。 第一和第二发色团部分各自吸收波长从100nm到400nm的光。 在图案形成方法中,在BARC组合物的BARC层上形成光致抗蚀剂层。 曝光后,通过显影剂选择性地除去光致抗蚀剂层和BARC层的未曝光区域,以在光致抗蚀剂层中形成图案化结构。 BARC组合物和图案形成方法对于植入水平特别有用。

    METHOD OF MULTIPLE PATTERNING TO FORM SEMICONDUCTOR DEVICES
    6.
    发明申请
    METHOD OF MULTIPLE PATTERNING TO FORM SEMICONDUCTOR DEVICES 有权
    多种图案形成半导体器件的方法

    公开(公告)号:US20140024191A1

    公开(公告)日:2014-01-23

    申请号:US13555240

    申请日:2012-07-23

    IPC分类号: H01L21/31 H01L21/336

    摘要: A method of forming different structures of a semiconductor device using a single mask and a hybrid photoresist. The method includes: applying a first photoresist layer on a semiconductor substrate; patterning the first photoresist layer using a photomask to form a first patterned photoresist layer; using the first patterned photoresist layer to form a first structure of a semiconductor device; removing the first patterned photoresist layer; applying a second photoresist layer on the semiconductor substrate; patterning the second photoresist layer using the photomask to form a second patterned photoresist layer; using the second patterned photoresist layer to form a second structure of a semiconductor device; removing the second patterned photoresist layer; and wherein either the first or the second photoresist layer is a hybrid photoresist layer comprising a hybrid photoresist.

    摘要翻译: 使用单个掩模和混合光致抗蚀剂形成半导体器件的不同结构的方法。 该方法包括:在半导体衬底上施加第一光致抗蚀剂层; 使用光掩模图案化第一光致抗蚀剂层以形成第一图案化光致抗蚀剂层; 使用所述第一图案化的光致抗蚀剂层形成半导体器件的第一结构; 去除第一图案化光致抗蚀剂层; 在所述半导体衬底上施加第二光致抗蚀剂层; 使用光掩模图案化第二光致抗蚀剂层以形成第二图案化光致抗蚀剂层; 使用所述第二图案化的光致抗蚀剂层形成半导体器件的第二结构; 去除第二图案化光致抗蚀剂层; 并且其中所述第一或第二光致抗蚀剂层是包含混合光致抗蚀剂的混合光致抗蚀剂层。

    Optimization of space width for hybrid photoresist
    10.
    发明授权
    Optimization of space width for hybrid photoresist 失效
    混合光刻胶的空间宽度优化

    公开(公告)号:US06200726B1

    公开(公告)日:2001-03-13

    申请号:US09170756

    申请日:1998-10-13

    IPC分类号: G03C173

    摘要: A photo resist composition contains at least one photoacid generator (PAG), wherein at least two photoacids are produced upon exposure of the photo resist to actinic energy and wherein the photo resist is capable of producing a hybrid response. The function of providing generation of two photoacids in a hybrid resist is to optimize the use of hybrid resist by varying the hybrid space width. The at least two photoacids may differ in their effectiveness at catalyzing at least one mechanism of the hybrid response. In particular, one photoacid may be a weaker acid and another may be a stronger acid, wherein there exists a difference of at least four orders of magnitude between the acid dissociation constant (Ka) of the weaker acid and the stronger acid. A method for optimizing space width in a hybrid photo resist includes the steps of: 1) selecting a desired space width; 2) selecting at least one photoacid generator (PAG), wherein at least two photoacids will be produced upon exposure to actinic energy in relative proportions sufficient to produce the desired space width in the hybrid photo resist; and 3) forming a hybrid photo resist composition comprising the at least one PAG. The step of selecting at least one PAG may include first determining the space width produced alone by each photoacid in a group of candidate photoacids and then selecting the photoacids and corresponding at least one PAG that will produce the desired space width.

    摘要翻译: 光致抗蚀剂组合物含有至少一种光致酸发生剂(PAG),其中当光致抗蚀剂暴露于光化能时,产生至少两种光酸,并且其中光致抗蚀剂能产生杂化响应。 在混合抗蚀剂中提供两种光酸的产生的功能是通过改变混合空间宽度来优化混合抗蚀剂的使用。 至少两种光酸在催化至少一种混合反应机制方面的有效性可能不同。 特别地,一种光致酸可以是较弱的酸,而另一种可能是较强的酸,其中在较弱酸的酸解离常数(Ka)和较强酸之间存在至少四个数量级的差异。 一种用于优化混合光刻胶中的空间宽度的方法包括以下步骤:1)选择期望的空间宽度; 2)选择至少一种光致酸产生剂(PAG),其中当以相对比例暴露于足以产生混合光致抗蚀剂中所需空间宽度的光化能时,将产生至少两种光酸; 和3)形成包含所述至少一种PAG的混合光刻胶组合物。 选择至少一个PAG的步骤可以包括首先确定由一组候选光酸中的每个光酸酸单独产生的空间宽度,然后选择将产生所需空间宽度的光酸和相应的至少一个PAG。