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公开(公告)号：US06555905B2
公开(公告)日：2003-04-29
申请号：US09887266
申请日：2001-06-25
IPC分类号： H01L2334
CPC分类号： C10M111/04 , C08G77/12 , C08G77/20 , C08K3/08 , C08K3/22 , C08K5/5419 , C08K2003/0812 , C08K2003/2296 , C08L83/04 , C10M2201/053 , C10M2201/0623 , C10M2207/021 , C10M2227/04 , C10M2229/0435 , C10M2229/0445 , C10N2240/20 , C10N2250/10 , H01L23/3737 , H01L23/4334 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/01019 , H01L2924/01078 , C08L83/00 , C08L2666/28 , C08L2666/54 , C10N2210/03 , C10N2210/02 , C10N2210/07
摘要： A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having at least two Si—H groups, (C) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (D) an organosilane having a long-chain alkyl groups, (E) platinum or a platinum compound, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.
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公开(公告)号：US06255257B1
公开(公告)日：2001-07-03
申请号：US09453469
申请日：1999-12-02
IPC分类号： C10M10750
CPC分类号： C10M169/02 , C10M169/00 , C10M2201/061 , C10M2201/0613 , C10M2201/062 , C10M2201/087 , C10M2201/10 , C10M2229/04 , C10M2229/0405 , C10N2210/02 , C10N2210/03 , C10N2220/021 , C10N2220/082 , C10N2240/00 , C10N2250/10
摘要： A silicone grease composition having high thermal conductivity, comprising (A) 50 to 95 weight % of a mixture of an aluminum nitride powder &agr; having an average particle size of 0.5 to 5 &mgr;m and an aluminum nitride powder &bgr; having an average particle size of 6 to 20 &mgr;m, wherein the aluminum nitride powders &agr; and &bgr; are mixed so that the &agr;/(&agr;+&bgr;) ratio by weight is from 0.1 to 0.9 and the average particle size after mixing is from 1 to 10 &mgr;m, (B) 5 to 15 weight % of organopolysiloxanes having a viscosity of from 50 to 50,000 cs at 25° C. and represented by formula R1aSiO(4−a)/2, wherein R1 represents at least one group selected from saturated or unsaturated univalent hydrocarbon groups containing 1 to 18 carbon atoms and 1.8≦a≦2.2, and (C) 0 to 35 weight % of at least one inorganic compound powder having an average particle size of 0.5 to 100 &mgr;m selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders.
摘要翻译： 一种具有高导热性的硅氧烷润滑脂组合物，其包含（A）50至95重量％的平均粒度为0.5至5μm的氮化铝粉末α和平均粒径为6的氮化铝粉末β的混合物 至20微米，其中将氮化铝粉末α和β混合，使得α/（α+β）重量比为0.1至0.9，混合后的平均粒度为1至10微米，（B）5 至15重量％的有机聚硅氧烷，其在25℃下具有50至50,000cs的粘度并由式R 1a SiO（4-a）/ 2表示，其中R 1表示选自饱和或不饱和的一价烃基中的至少一个基团， 至18个碳原子和1.8 <= a <= 2.2，和（C）0-35重量％的至少一种平均粒度为0.5-100微米的无机化合物粉末，选自氧化锌，氧化铝， 氮化硼和碳化硅粉末。
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3.发明授权Heat-reducing silicone grease composition and semiconductor device using the same 有权减热硅脂组合物及使用其的半导体装置公开(公告)号：US06174841B1
公开(公告)日：2001-01-16
申请号：US09409902
申请日：1999-10-01
IPC分类号： C10M11308
CPC分类号： C10M111/04 , C10M2201/0613 , C10M2201/0623 , C10M2229/0415 , C10M2229/0475 , C10M2229/0525 , C10N2220/082 , C10N2240/20 , C10N2250/10 , H01L23/3737 , H01L2224/32245 , H01L2924/09701 , H01L2924/12044 , C10N2210/04 , C10N2210/03 , C10N2210/02 , H01L2924/00
摘要： A heat-reducing silicone grease composition comprising a mixture of (A) 50-95 weight % of aluminum nitride powder having an average particle size of 0.5-10 &mgr;m and containing no particles 100 &mgr;m or greater in size, (B) 5-50 weight % of liquid silicone having a viscosity of 50-500,000 cs at 25° C. and (C) 0-30 weight % of at least one powder selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders; and a semiconductor device to which the foregoing silicone grease composition is applied.
摘要翻译： 一种减热硅油组合物，其包含（A）50-95重量％的平均粒径为0.5-10μm的氮化铝粉末并且不含粒径为100μm或更大的颗粒的混合物，（B）5-50 在25℃下粘度为50-500,000cs的液体硅氧烷的重量％和（C）0-30重量％的选自氧化锌，氧化铝，氮化硼和碳化硅粉末的至少一种粉末; 以及应用上述硅氧烷润滑脂组合物的半导体装置。
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4.发明授权Aluminum nitride powder and thermally conductive grease composition using the same 有权氮化铝粉末和使用其的导热油脂组合物
公开(公告)号：US6136758A
公开(公告)日：2000-10-24
申请号：US209455
申请日：1998-12-11
IPC分类号： C01B21/072 , C10M113/16 , C10M169/00 , C10M169/02 , C10M107/50
CPC分类号： C10M169/02 , C01B21/0728 , C10M113/16 , C10M169/00 , C10M2201/0613 , C10M2201/0616 , C10M2201/0626 , C10M2227/045 , C10N2210/02 , C10N2210/03 , C10N2250/10 , C10N2260/00
摘要： An aluminum nitride powder having the surface treated with an organosilane represented by formula, R.sup.I.sub.a R.sup.II.sub.b SiY.sub.4-1-b, and/or a partial hydrolysis condensate thereof to acquire excellent moisture-proof, wherein R.sup.I represents a 6-20C alkyl group or a group formed by substituting halogen atom or atoms for part or all of the hydrogen atoms attached to carbon atoms of the 6-20C alkyl group, R.sup.II represents a 1-20C hydrocarbon group or a group formed by substituting halogen atom or atoms for part or all of the hydrogen atoms attached to carbon atoms of the 1-20C hydrocarbon group, Y represents a hydrolyzable group, a is an integer of 1 to 3 and b is an integer of 0 to 2, provided that a+b is an integer of 1 to 3; and a thermally conductive grease composition comprising (A) 50-95 weight % of the aforementioned surface-treated aluminum nitride powder and (B) 5 to 50 weight % of at least one base oil selected from the group consisting of liquid silicones, liquid hydrocarbons and fluorohydrocarbon oils, and further, if desired, (C) 0-30 weight % of a thicknener selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders.
摘要翻译： 具有用式表示的有机硅烷表面处理的氮化铝粉末，RIaRIIbSiY4-1-b和/或其部分水解缩合物，以获得优异的防湿性，其中RI表示6-20C烷基或由 用卤原子或原子取代与6-20C烷基的碳原子连接的部分或全部氢原子，RII表示1-20C的烃基或通过用卤原子或原子取代部分或全部氢 附着于1-20C烃基的碳原子的原子，Y表示可水解基团，a表示1〜3的整数，b表示0〜2的整数，条件是a + b为1〜3的整数。 和导热性润滑脂组合物，其包含（A）50-95重量％的上述表面处理的氮化铝粉末和（B）5至50重量％的至少一种基础油，其选自液体硅酮，液体烃 和氟代烃油，并且如果需要，（C）0-30重量％的选自氧化锌，氧化铝，氮化硼和碳化硅粉末的增稠剂。
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公开(公告)号：US6114429A
公开(公告)日：2000-09-05
申请号：US153334
申请日：1998-09-15
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/46 , C08G77/70
摘要： A thermally conductive silicone composition which comprises (A) 5 to 30 weight % of a liquid silicone, (B) 50 to 94.98 weight % of at least one thickener selected from the group consisting of a zinc oxide powder, an aluminum powder, an aluminum nitride powder, a boron nitride powder and a silicon carbide powder, (C) 0.01 to 10 weight % of an organopolysiloxane having at least one per molecule of hydroxyl group attached directly to a silicon atom, and (D) 0.01 to 10 weight % of an alkoxysilane, thereby retainining satisfactory thermal conductive properties and hardly causing oil bleeding over a long time.
摘要翻译： 一种导热硅氧烷组合物，其包含（A）5至30重量％的液体硅氧烷，（B）50至94.98重量％的至少一种增稠剂，其选自氧化锌粉末，铝粉末，铝 氮化物粉末，氮化硼粉末和碳化硅粉末，（C）0.01〜10重量％的每分子羟基至少一个羟基直接与硅原子连接的有机聚硅氧烷，（D）0.01〜10重量％ 烷氧基硅烷，从而保持令人满意的导热性能，并且长时间难以引起油渗出。
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公开(公告)号：US06372337B1
公开(公告)日：2002-04-16
申请号：US09318736
申请日：1999-05-26
IPC分类号： B32B516
摘要： A grease composition having high thermal conductivity and excellent dispensation suitability, comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 &mgr;m; wherein the aluminum powder is a mixture of fine metallic aluminum powder having an average size of 0.5 to 5 &mgr;m and coarse metallic aluminum powder having an average particle size of 10 to 40 &mgr;m; and a semiconductor device utilizing the aforesaid grease composition.
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公开(公告)号：US09713253B2
公开(公告)日：2017-07-18
申请号：US14006546
申请日：2011-03-29
IPC分类号： B21D39/00 , H05K1/05 , H05K3/02 , H01L23/373 , H01L21/48 , B22D19/00 , B22D19/04 , H05K1/03 , H05K3/00
CPC分类号： H05K1/053 , B22D19/0081 , B22D19/04 , H01L21/481 , H01L21/4871 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/0061 , H05K3/022 , H05K2201/09136 , H05K2201/2009 , H05K2203/128 , Y10T428/12618 , Y10T428/2457 , Y10T428/2462 , Y10T428/24942 , H01L2924/00
摘要： A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.
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公开(公告)号：US08286864B2
公开(公告)日：2012-10-16
申请号：US12919876
申请日：2009-02-25
IPC分类号： G06K5/00
摘要： A light guiding device can be used for a reader/writer device (1) for a noncontact communication medium. The light guiding device includes a light guide plate (10) which includes: a transparent main body part (17) which can transmit light inputted from an LED (9); and a protruding part (18) which is provided so as to protrude from a part of an end surface of the transparent main body part (17). A diffusely reflecting part (19) is provided on a lower surface side of the transparent main body part (17), and a first light emitting part (7) is provided on an upper surface side of the transparent main body part (17). Reflecting parts (21) are provided on an upper surface side and a lower surface side of the protruding part (18), and a second light emitting part (8) is provided at a leading end of the protruding part (18). In the case where the first light emitting part (7) is covered by the noncontact communication medium, the second light emitting part (8) makes it possible to check a light emitting state. Accordingly, the light guiding device is provided, in which the light emitting state of the light emitting part can be easily checked.
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公开(公告)号：USD614973S1
公开(公告)日：2010-05-04
申请号：US29352296
申请日：2009-12-18
申请人： Takayuki Takahashi
设计人： Takayuki Takahashi
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公开(公告)号：USD600142S1
公开(公告)日：2009-09-15
申请号：US29337130
申请日：2009-05-15
申请人： Takayuki Takahashi
设计人： Takayuki Takahashi
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