摘要:
A method for fabricating a light-emitting device is provided. The method includes: providing a substrate; forming a sacrificial dielectric layer on the substrate, wherein the sacrificial dielectric layer is a structure containing voids; forming a buffer layer on the sacrificial dielectric layer; forming an epitaxial light-emitting structure on the buffer layer; forming a metal bonding layer on the epitaxial light-emitting structure; bonding the metal bonding layer to a thermally conductive substrate; and wet etching the sacrificial dielectric layer for to remove the substrate.
摘要:
A method for fabricating a light-emitting device is provided. The method includes: providing a substrate; forming a sacrificial dielectric layer on the substrate, wherein the sacrificial dielectric layer is a structure containing voids; forming a buffer layer on the sacrificial dielectric layer; forming an epitaxial light-emitting structure on the buffer layer; forming a metal bonding layer on the epitaxial light-emitting structure; bonding the metal bonding layer to a thermally conductive substrate; and wet etching the sacrificial dielectric layer for to remove the substrate.
摘要:
An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.
摘要:
A carrier structure and a manufacturing method thereof are provided. The carrier structure includes a substrate, an adhesive layer and a circuit board. The substrate has a plurality of adhesive regions. The adhesive layer is disposed on the adhesive regions. A thermal expansion coefficient of the adhesive layer corresponding one of the adhesive regions is greater than that of another adhesive region. The circuit board is disposed on the adhesive layer.
摘要:
A supporting apparatus for assembling a display, includes a supporting bracket. The supporting bracket includes a plate and a restricting arm connected to the plate. The restricting arm includes a connection portion and a restricting portion the restricting. The restricting portion is parallel to the plate to define a restricting space between the restricting portion and the plate. The restricting space receives the display therein. The restricting portion and the plate restricts the display in the restricting space in a first direction which is perpendicular to the plate. A plurality of blocks are movably mounted on the plate. The plurality of blocks restrict the display in the restrict space in a second direction which is parallel to the plate.
摘要:
A carrier structure and a manufacturing method thereof are provided. The carrier structure includes a substrate, an adhesive layer and a circuit board. The substrate has a plurality of adhesive regions. The adhesive layer is disposed on the adhesive regions. A thermal expansion coefficient of the adhesive layer corresponding one of the adhesive regions is greater than that of another adhesive region. The circuit board is disposed on the adhesive layer.
摘要:
A particle (10) of ferromagnetic powder for use in preparation of soft magnetic core components has a core-shell structure. The particle includes a central core (12) and a shell (14) coated on the central core. The central core is made of magnetic material and is used for providing the necessary magnetic property for the magnetic core components made from the ferromagnetic powder. The shell has a higher electrical resistance than the central core so as to reduce an eddy current loss of the magnetic core component. The shell also functions to provide an excellent bonding strength between particles of the powder.
摘要:
A motor stator includes a stator core (500) and a stator coil. The stator core includes a central cylinder (501) and a plurality of posts (503) extending from the central cylinder. Each post is connected with a magnetic pole (505). The post has a smaller height than the central cylinder and the magnetic pole whereby a recess (507) is formed above the post between the central cylinder and the magnetic pole. The stator coil is received in the recess and wound around the post. The stator core is integrally made from ferromagnetic powder by powder metallurgy technique. Each particle of the powder includes an inner core (12) made of magnetic material and an outer shell (14) surrounding the inner core. The shell has a higher electrical resistance than the inner core.
摘要:
A loop-type heat exchange module (10) is disclosed, which includes an evaporator (11), a vapor conduit (12), a condenser (13), a liquid conduit (14), a cooling fan (16), a fastening seat (151) and a fan cover (152). The evaporator contains therein a working fluid. The working fluid evaporates into vapor after absorbing heat in the evaporator, and the generated vapor flows, via the vapor conduit, to the condenser where the vapor releases the heat and is condensed into condensate. The condensate then returns back, via the liquid conduit, to the evaporator to thereby form a heat transfer loop. The cooling fan is applied to produce a forced airflow towards the condenser. The fastening seat is used for fastening the evaporator to have an intimate contact with a heat-generating electronic component. The fan cover extends from one side of the fastening seat and receives the cooling fan and the condenser therein.
摘要:
A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a fan (1) for generating airflow and a heat sink (2). The heat sink has a base (21) and a plurality of fins (22). A chamber (25) is defined with the fins surrounding for receiving the fan. At least one channel (23) is defined in the base for allowing airflow directly blowing on the electronic package under the heat sink.