Photosensitive resin composition and dry film comprising the same
    7.
    发明授权
    Photosensitive resin composition and dry film comprising the same 有权
    感光树脂组合物及其干膜

    公开(公告)号:US08354219B2

    公开(公告)日:2013-01-15

    申请号:US13191027

    申请日:2011-07-26

    IPC分类号: G03F7/038

    CPC分类号: G03F7/037

    摘要: The present invention relates to a photosensitive resin composition which is developable with an alkaline aqueous solution and does not need a high temperature for curing and the like, and has all the properties suitable for use in a cover film of a printed circuit board or a laminated body for a semiconductor, and a dry film comprising the same. The photosensitive resin composition comprises (A) a polyamic acid comprising a polymer of at least one diamine compound and at least one acid dianhydride; (B) a photopolymerizable compound having at least one polymerizable ethylenic unsaturated bond in its molecule; and (C) a photoinitiator.

    摘要翻译: 本发明涉及一种可用碱性水溶液显影而不需要高温固化等的感光性树脂组合物,并且具有适用于印刷电路板的覆盖膜或叠层的全部性能 半导体用主体以及包含该半导体的干膜。 感光性树脂组合物包含(A)包含至少一种二胺化合物的聚合物和至少一种酸二酐的聚酰胺酸; (B)分子中具有至少一个可聚合的烯键式不饱和键的光聚合化合物; 和(C)光引发剂。