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    Method for applying metal features onto barrier layers using ion permeable barriers
    2.
    发明申请
    Method for applying metal features onto barrier layers using ion permeable barriers 审中-公开
    使用离子渗透屏障将金属特征施加到阻挡层上的方法

    公开(公告)号：US20060189129A1

    公开(公告)日：2006-08-24

    申请号：US11413228

    申请日：2006-04-28

    申请人： Rajesh Baskaran ,  Bioh Kim ,  Robert Batz ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

    发明人： Rajesh Baskaran ,  Bioh Kim ,  Robert Batz ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

    IPC分类号： C25D5/34 ,  H01L21/44

    CPC分类号： C25D3/02 ,  C25D5/38 ,  C25D5/54 ,  C25D7/123 ,  C25D17/00 ,  C25D17/001 ,  C25D17/002 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/321 ,  H01L21/76843 ,  H01L21/76861 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76883 ,  H01L21/76885

    摘要： The methods described are directed to processes for producing structures containing metallized features for use in microelectronic workpieces. The processes treat a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and metallized features include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The processes described modify an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process. According to the processes described metallized features are formed on the treated barrier layers using processes that employ ion permeable barriers.

    摘要翻译： 所描述的方法涉及用于生产用于微电子工件的包含金属化特征的结构的方法。 该方法处理阻挡层以促进阻挡层和金属化特征之间的粘附。 用于促进阻挡层和金属化特征之间的粘合的合适方式包括阻挡层的酸处理，阻挡层的电解处理，或阻挡层和金属化特征之间的结合层的沉积。 所描述的方法改变了阻挡层的外表面，使得其更适合于在屏障上电沉积金属，因此不需要PVD或CVD种子层沉积工艺。 根据所述方法，使用采用离子可渗透屏障的方法在经处理的阻挡层上形成金属化特征。

    Copper electrolytic process using cation permeable barrier
    3.
    发明申请
    Copper electrolytic process using cation permeable barrier 审中-公开
    铜电解工艺采用阳离子渗透屏障

    公开(公告)号：US20060260946A1

    公开(公告)日：2006-11-23

    申请号：US11414535

    申请日：2006-04-28

    申请人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

    发明人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

    IPC分类号： C25D5/02

    CPC分类号： C25F3/02 ,  C25D3/02 ,  C25D3/38 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25F7/00 ,  H01L21/2885

    摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.

    摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。 阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。 所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。

    Apparatus and method for deposition of an electrophoretic emulsion
    5.
    发明申请
    Apparatus and method for deposition of an electrophoretic emulsion 审中-公开
    用于沉积电泳乳液的装置和方法

    公开(公告)号：US20070175759A1

    公开(公告)日：2007-08-02

    申请号：US11644788

    申请日：2006-12-22

    申请人： John Klocke ,  Kyle Hanson

    发明人： John Klocke ,  Kyle Hanson

    IPC分类号： C25B7/00

    CPC分类号： G03F7/164 ,  C25D7/12 ,  C25D13/00 ,  C25D13/12 ,  C25D13/22 ,  C25D17/001

    摘要： The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry. The system, apparatus and method, for providing electrophoretic resist (“EPR”) layers on microelectronic workpieces for the microfabrication of microelectronic devices comprises a deposition station for receiving a microelectronic workpiece and depositing a layer of electrophoretic photoresist (EPR) thereon, a workpiece handling apparatus, and a control unit coupled to the workpiece handling apparatus and the deposition station for coordinating the processing of the workpiece in accordance with a predetermined sequence and set of processing parameters.

    摘要翻译： 本发明提供了一种能够在微细加工工业中使用电泳抗蚀剂用于生产微电子器件的系统，并且具有足够高的质量以用作当前光致抗蚀剂沉积技术的替代或补充。 该系统能够在符合微电子制造业所需的清洁度和生产吞吐量的标准的自动化设备中应用电泳抗蚀剂。 用于在微电子工件上提供用于微电子器件的微细加工的电泳抗蚀剂（“EPR”）层的系统，装置和方法包括用于接收微电子工件并在其上沉积一层电泳光致抗蚀剂（EPR）的沉积站，工件处理 装置和耦合到工件处理装置和沉积站的控制单元，用于根据预定的顺序和一组处理参数来协调工件的处理。

    Apparatus and method for deposition of an electrophoretic emulsion
    7.
    发明授权
    Apparatus and method for deposition of an electrophoretic emulsion 有权

    公开(公告)号：US07147765B2

    公开(公告)日：2006-12-12

    申请号：US10234628

    申请日：2002-09-03

    申请人： John Klocke ,  Kyle Hanson

    发明人： John Klocke ,  Kyle Hanson

    IPC分类号： C25D13/00 ,  C25D13/04

    CPC分类号： G03F7/164 ,  C25D7/12 ,  C25D13/00 ,  C25D13/12 ,  C25D13/22 ,  C25D17/001

    摘要： The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry. The system, apparatus and method, for providing electrophoretic resist (“EPR”) layers on microelectronic workpieces for the microfabrication of microelectronic devices comprises a deposition station for receiving a microelectronic workpiece and depositing a layer of electrophoretic photoresist (EPR) thereon, a workpiece handling apparatus, and a control unit coupled to the workpiece handling apparatus and the deposition station for coordinating the processing of the workpiece in accordance with a predetermined sequence and set of processing parameters.

    Method and system for idle state operation
    8.
    发明申请
    Method and system for idle state operation 有权

    公开(公告)号：US20060032758A1

    公开(公告)日：2006-02-16

    申请号：US11198905

    申请日：2005-08-05

    申请人： John Klocke ,  Kyle Hanson ,  Rajesh Baskaran

    发明人： John Klocke ,  Kyle Hanson ,  Rajesh Baskaran

    IPC分类号： C25D5/34

    CPC分类号： C23C18/1632 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25F7/00

    摘要： Methods and systems for electrochemically processing microfeature workpieces are described herein. In one embodiment, a process for electrochemically treating a surface of a plurality of microfeature workpieces in an electrochemical treating chamber that includes a processing unit separated from an electrode unit by an ion-permeable barrier is described. The process involves an idle stage wherein during the idle stage, processing fluid components are prevented from transferring between the first processing fluid and the second processing fluid. The described system includes a flow control system for controlling the flow of processing fluid to achieve separation of a processing fluid from the barrier during the idle stage.

    Chambers, systems, and methods for electrochemically processing microfeature workpieces
    9.
    发明申请
    Chambers, systems, and methods for electrochemically processing microfeature workpieces 有权
    用于电化学处理微型工件的室，系统和方法

    公开(公告)号：US20050121317A1

    公开(公告)日：2005-06-09

    申请号：US10729349

    申请日：2003-12-05

    申请人： John Klocke ,  Kyle Hanson

    发明人： John Klocke ,  Kyle Hanson

    IPC分类号： C23C18/16 ,  C25B9/00 ,  C25D3/38 ,  C25D5/02 ,  C25D7/12 ,  C25D11/02 ,  C25D17/00 ,  C25F3/02 ,  C25F7/00

    CPC分类号： C25F3/02 ,  C25D3/38 ,  C25D11/02 ,  C25D17/001 ,  C25D17/002 ,  C25F7/00

    摘要： Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.

    摘要翻译： 本文公开了用于电化学处理微特征工件的室，系统和方法。 在一个实施例中，电化学沉积室包括具有第一流动系统的处理单元，该第一流动系统构造成将第一处理流体的流动传送到微特征工件。 腔室还包括具有电极和第二流动系统的电极单元，该第二流动系统构造成输送至少靠近电极的第二处理流体的流动。 该腔室还包括处理单元和电极单元之间的无孔屏障，以分离第一和第二处理流体。 无孔屏障被配置成允许阳离子或阴离子流过第一和第二处理流体之间的屏障。