公开(公告)号：US20060157355A1

公开(公告)日：2006-07-20

申请号：US11299293

申请日：2005-12-08

申请人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

发明人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

IPC分类号： B23H5/00

CPC分类号： C25D7/123 ,  C25D3/02 ,  C25D3/38 ,  C25D5/022 ,  C25D17/001 ,  C25D17/002 ,  C25F3/02 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76868 ,  H01L21/76873 ,  H05K3/423

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.

摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阴离子可渗透阻挡层对微特征工件进行电解处理。 阴离子可渗透阻挡层将第一处理流体与第二处理流体分离，同时允许某些阴离子物质在两种流体之间转移。 所描述的过程在反复电镀循环中产生沉积物，其在所期望的范围内显示电阻率值。

公开(公告)号：US20070068820A1

公开(公告)日：2007-03-29

申请号：US11416659

申请日：2006-05-03

申请人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

发明人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

IPC分类号： C25D21/06

CPC分类号： C25D7/123 ,  C25D3/02 ,  C25D3/38 ,  C25D5/022 ,  C25D17/001 ,  C25D17/002 ,  C25F3/02 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/76843 ,  H01L21/76846 ,  H01L21/76868 ,  H01L21/76873 ,  H05K3/423

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.

摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阴离子可渗透阻挡层对微特征工件进行电解处理。 阴离子可渗透阻挡层将第一处理流体与第二处理流体分离，同时允许某些阴离子物质在两种流体之间转移。 所描述的过程在反复电镀循环中产生沉积物，其在所期望的范围内显示电阻率值。

公开(公告)号：US20060189129A1

公开(公告)日：2006-08-24

申请号：US11413228

申请日：2006-04-28

申请人： Rajesh Baskaran ,  Bioh Kim ,  Robert Batz ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

发明人： Rajesh Baskaran ,  Bioh Kim ,  Robert Batz ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

IPC分类号： C25D5/34 ,  H01L21/44

CPC分类号： C25D3/02 ,  C25D5/38 ,  C25D5/54 ,  C25D7/123 ,  C25D17/00 ,  C25D17/001 ,  C25D17/002 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/321 ,  H01L21/76843 ,  H01L21/76861 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76883 ,  H01L21/76885

摘要： The methods described are directed to processes for producing structures containing metallized features for use in microelectronic workpieces. The processes treat a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and metallized features include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The processes described modify an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process. According to the processes described metallized features are formed on the treated barrier layers using processes that employ ion permeable barriers.

摘要翻译： 所描述的方法涉及用于生产用于微电子工件的包含金属化特征的结构的方法。 该方法处理阻挡层以促进阻挡层和金属化特征之间的粘附。 用于促进阻挡层和金属化特征之间的粘合的合适方式包括阻挡层的酸处理，阻挡层的电解处理，或阻挡层和金属化特征之间的结合层的沉积。 所描述的方法改变了阻挡层的外表面，使得其更适合于在屏障上电沉积金属，因此不需要PVD或CVD种子层沉积工艺。 根据所述方法，使用采用离子可渗透屏障的方法在经处理的阻挡层上形成金属化特征。

公开(公告)号：US20060163072A1

公开(公告)日：2006-07-27

申请号：US11296574

申请日：2005-12-07

申请人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

发明人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

IPC分类号： C25D1/00

CPC分类号： C25D21/12 ,  C25D17/00 ,  C25D17/001 ,  C25D17/002 ,  C25D17/12

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.

公开(公告)号：US20060260946A1

公开(公告)日：2006-11-23

申请号：US11414535

申请日：2006-04-28

申请人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

发明人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

IPC分类号： C25D5/02

CPC分类号： C25F3/02 ,  C25D3/02 ,  C25D3/38 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25F7/00 ,  H01L21/2885

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.

摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。 阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。 所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。

公开(公告)号：US20060237323A1

公开(公告)日：2006-10-26

申请号：US11414145

申请日：2006-04-28

申请人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

发明人： Rajesh Baskaran ,  Robert Batz ,  Bioh Kim ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

IPC分类号： C25D5/02

CPC分类号： C25D7/12 ,  C25D5/00 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02 ,  C25D21/12

摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.

公开(公告)号：US20080011450A1

公开(公告)日：2008-01-17

申请号：US11776952

申请日：2007-07-12

申请人： Kyle Hanson ,  Robert Batz ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory Wilson ,  Paul McHugh

发明人： Kyle Hanson ,  Robert Batz ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory Wilson ,  Paul McHugh

IPC分类号： B05B1/00 ,  F17D3/00

CPC分类号： H01L21/6723 ,  C23C18/1676 ,  H01L21/67109 ,  Y10T137/0318

摘要： Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater. The interaction between the microelectronic workpiece and the processing liquid can be further controlled by controlling the rate at which the microelectronic workpiece rotates and/or the manner in which the microelectronic workpiece is introduced to and/or withdrawn from the processing liquid.

摘要翻译： 用液体对微电子工件进行热处理的装置和方法。 根据本发明的实施例的装置包括配置成承载诸如无电处理液体的处理液体的处理容器。 容器具有用于将热量传递到和/或内部的处理液体的热传递壁。 传热装置，例如容纳从处理容器溢出的处理液体的储存器，将热量传递到处理容器内或从处理容器内的处理液体。 传热装置还可以将热量传递到内部或外部热源，例如承载传热流体的导管或电阻加热器。 通过控制微电子工件旋转的速度和/或微电子工件被引入和/或从处理液中取出的方式，可以进一步控制微电子工件和处理液之间的相互作用。

公开(公告)号：US20050205111A1

公开(公告)日：2005-09-22

申请号：US11020018

申请日：2004-12-20

申请人： Thomas Ritzdorf ,  Dakin Fulton ,  Robert Batz ,  Kevin Witt ,  Kyle Hanson

发明人： Thomas Ritzdorf ,  Dakin Fulton ,  Robert Batz ,  Kevin Witt ,  Kyle Hanson

IPC分类号： C25D7/12 ,  H01L21/00 ,  B08B3/02

CPC分类号： C25D17/001 ,  H01L21/67051

摘要： Methods and apparatuses for processing microfeature workpieces are disclosed herein. In one embodiment, a workpiece support carries a workpiece in a processing volume of a processing chamber. A first fluid delivery device directs an unsupported stream of a first fluid into the processing volume. A second fluid delivery device directs an unsupported stream of a second fluid into the processing volume. A first fluid collector receives at least a portion of the first fluid, and a second fluid collector receives at least a portion of the second fluid. Accordingly, embodiments of the apparatus support the use of multiple fluids in a single processing volume to control, restrict, and/or eliminate mixing between the two fluids while reducing and/or eliminating the need for purging and/or rinsing portions of the apparatus. The rotation rate and/or position of the workpiece can also be controlled to control the manner in which the fluids are collected.

摘要翻译： 本文公开了微加工件的加工方法和装置。 在一个实施例中，工件支撑件在处理室的处理容积中承载工件。 第一流体输送装置将未支撑的第一流体流引导到处理体积中。 第二流体递送装置将未支撑的第二流体流引导到处理体积中。 第一流体收集器容纳第一流体的至少一部分，并且第二流体收集器容纳至少一部分第二流体。 因此，该设备的实施例支持在单个处理体积中使用多个流体来控制，限制和/或消除两种流体之间的混合，同时减少和/或消除对设备的清洗和/或漂洗部分的需要。 也可以控制工件的旋转速度和/或位置，以控制流体被收集的方式。

公开(公告)号：US08844035B2

公开(公告)日：2014-09-23

申请号：US13369498

申请日：2012-02-09

申请人： Christopher C. O'Rourke ,  Frank Gerard Bordonaro ,  Louis Menditto ,  Robert Batz

发明人： Christopher C. O'Rourke ,  Frank Gerard Bordonaro ,  Louis Menditto ,  Robert Batz

IPC分类号： H04L29/06

CPC分类号： H04L63/0227 ,  H04L63/1408 ,  H04L63/1441

摘要： Techniques for responding to intrusions on a packet switched network include receiving user data at a subscriber-aware gateway server between a network access server and a content server. The user data includes subscriber identifier data that indicates a unique identifier for a particular user, network address data that indicates a network address for a host used by the particular user, NAS data that indicates an identifier for the network access server, flow list data that indicates one or more open data packet flows, and suspicious activity data. The suspicious activity data indicates a value for a property of the open data packet flows that indicates suspicious activity. It is determined whether an intrusion condition is satisfied based on the suspicious activity data. If the intrusion condition is satisfied, then the gateway responds based at least in part on user data other than the network address data.

摘要翻译： 用于响应分组交换网络上的入侵的技术包括在网络接入服务器和内容服务器之间的用户感知网关服务器处接收用户数据。 用户数据包括指示特定用户的唯一标识符的用户标识符数据，指示特定用户使用的主机的网络地址的网络地址数据，指示网络接入服务器的标识符的NAS数据， 指示一个或多个打开的数据分组流和可疑活动数据。 可疑活动数据表示指示可疑活动的开放数据分组流的属性的值。 基于可疑活动数据确定是否满足入侵条件。 如果入侵条件满足，则网关至少部分地基于除了网络地址数据之外的用户数据进行响应。

公开(公告)号：US07640023B2

公开(公告)日：2009-12-29

申请号：US11417960

申请日：2006-05-03

申请人： Weimin Ma ,  Ashish Chandwadkar ,  Chris O'Rourke ,  Robert Batz ,  Kevin Shatzkamer ,  Anand K. Oswal ,  Mark Grayson ,  Jayaraman Iyer

发明人： Weimin Ma ,  Ashish Chandwadkar ,  Chris O'Rourke ,  Robert Batz ,  Kevin Shatzkamer ,  Anand K. Oswal ,  Mark Grayson ,  Jayaraman Iyer

IPC分类号： H04W72/00

CPC分类号： H04W28/08 ,  H04L67/1002 ,  H04L67/1008 ,  H04L67/1014 ,  H04L67/1036 ,  H04W74/004 ,  H04W88/14

摘要： Techniques and systems for server farm load balancing and resource allocation are disclosed. In one embodiment, a method of load balancing can include: arranging servers into service groups; receiving an access request with information related to a differentiation between the service groups; selecting one of the service groups based on a mapping comparison to the information; and selecting one of the servers within the selected service group based on a hardware utilization comparison. The servers can include GPRS (General Packet Radio Service) Gateway Support Node (GGSN) or Remote Authentication Dial In User Service (RADIUS) servers, for example. The information can include an Access Point Name (APN) or Calling Station ID, for example.

摘要翻译： 披露了用于服务器场负载平衡和资源分配的技术和系统。 在一个实施例中，负载平衡的方法可以包括：将服务器排列成服务组; 接收具有与服务组之间的区别相关的信息的访问请求; 基于与信息的映射比较来选择服务组之一; 以及基于硬件利用率比较来选择所选服务组内的一个服务器。 服务器可以包括例如GPRS（通用分组无线电业务）网关支持节点（GGSN）或远程认证拨入用户服务（RADIUS）服务器。 该信息可以包括例如接入点名称（APN）或呼叫站ID。