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1.发明授权公开(公告)号：US09246054B2
公开(公告)日：2016-01-26
申请号：US14151613
申请日：2014-01-09
Applicant: LG INNOTEK CO., LTD. , LG ELECTRONICS INC.
Inventor： Hyun Kyong Cho , Sun Kyung Kim , Jun Ho Jang
IPC: H01L33/24 , H01L33/46 , H01L33/48 , H01L33/60 , H01L33/62 , H01L33/20 , H01L33/40 , H01L33/00 , H01L33/22 , H01L33/42 , H01L33/44
CPC classification number: H01L33/20 , H01L33/0079 , H01L33/22 , H01L33/405 , H01L33/42 , H01L33/44 , H01L33/48 , H01L33/60 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2933/0016 , H01L2933/0033 , H01L2933/0083 , Y10S438/977 , H01L2924/00014 , H01L2924/00
Abstract: A nitride-based light emitting device capable of achieving an enhancement in emission efficiency and an enhancement in reliability is disclosed. The light emitting device includes a semiconductor layer, and a light extracting layer arranged on the semiconductor layer and made of a material having a refractive index equal to or higher than a reflective index of the semiconductor layer.
Abstract translation: 公开了一种能够实现发光效率提高和可靠性提高的氮化物系发光器件。 发光器件包括半导体层和布置在半导体层上并由折射率等于或高于半导体层的反射率的材料制成的光提取层。
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公开(公告)号：US09312459B2
公开(公告)日：2016-04-12
申请号：US14248179
申请日：2014-04-08
Applicant: LG ELECTRONICS INC. , LG INNOTEK CO., LTD.
Inventor： Jun Ho Jang , Geun Ho Kim
CPC classification number: H01L29/167 , H01L25/167 , H01L29/866 , H01L33/0079 , H01L33/0095 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/405 , H01L33/44 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2933/0033 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device having a vertical structure and a package thereof, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity. The device and package include a sub-mount, a first-type electrode, a second-type electrode, a light emitting device, a zener diode, and a lens on the sub-mount.
Abstract translation: 一种具有垂直结构和封装的发光器件，其能够抑制在衬底分离过程中产生的冲击，并且实现批量生产率的提高。 该装置和封装包括副安装座，第一型电极，第二类型电极，发光装置，齐纳二极管和子安装座上的透镜。
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公开(公告)号：US09285632B2
公开(公告)日：2016-03-15
申请号：US14600941
申请日：2015-01-20
Applicant: LG ELECTRONICS INC. , LG INNOTEK CO., LTD.
Inventor： Jung Hoon Seo , Jun Ho Jang
IPC: G02B6/36 , G02B6/34 , G02B6/32 , G02B6/12 , G02B6/00 , G02B7/02 , G02F1/1335 , H01L33/54 , H01L33/58 , F21K99/00 , F21V5/00 , F21V5/04 , F21V13/02 , H01L33/56 , F21Y101/02 , F21Y105/00
CPC classification number: G02F1/133606 , F21K9/60 , F21V5/007 , F21V5/048 , F21V13/02 , F21Y2105/10 , F21Y2115/10 , G02F1/133603 , G02F1/133611 , G02F2001/133607 , H01L33/54 , H01L33/56 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting device package including light emitting devices, and optical lenses respectively disposed over the light emitting devices. Further, a respective optical lens includes an extending member extending from a body of the respective optical lens, and including a first portion laterally extending in a first direction substantially perpendicular to the central axis of the respective light emitting device, and a second portion extending towards the substrate in a second direction substantially parallel with the central axis of the respective light emitting device. A vertical cross section of the second portion is substantially symmetrical with respect to an axis that is spaced apart in the first direction from and substantially parallel with the central axis of the respective light emitting device.
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公开(公告)号：US08961043B2
公开(公告)日：2015-02-24
申请号：US14448929
申请日：2014-07-31
Applicant: LG Electronics Inc. , LG Innotek Co., Ltd
Inventor： Jung Hoon Seo , Jun Ho Jang
IPC: G02B6/36 , G02B6/34 , G02B6/32 , G02B6/12 , G02B3/00 , G02B7/02 , F21V5/00 , F21K99/00 , G02F1/1335 , H01L33/58 , F21Y101/02
CPC classification number: G02F1/133606 , F21K9/60 , F21V5/007 , F21V5/048 , F21V13/02 , F21Y2105/10 , F21Y2115/10 , G02F1/133603 , G02F1/133611 , G02F2001/133607 , H01L33/54 , H01L33/56 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting device package including light emitting devices, and optical lenses respectively disposed over the light emitting devices. Further, a respective optical lens includes an extending member extending from a body of the respective optical lens, and including a first portion laterally extending in a first direction substantially perpendicular to the central axis of the respective light emitting device, and a second portion extending towards the substrate in a second direction substantially parallel with the central axis of the respective light emitting device. A vertical cross section of the second portion is substantially symmetrical with respect to an axis that is spaced apart in the first direction from and substantially parallel with the central axis of the respective light emitting device.
Abstract translation: 包括发光器件的发光器件封装和分别设置在发光器件上的光学透镜。 此外，相应的光学透镜包括从相应的光学透镜的主体延伸的延伸部件，并且包括在基本上垂直于各个发光器件的中心轴线的第一方向上横向延伸的第一部分和朝向 所述基板在基本上平行于各个发光器件的中心轴线的第二方向上。 第二部分的垂直横截面相对于在与相应的发光装置的中心轴线的第一方向上间隔开的基本对称。
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5.发明授权公开(公告)号：US09837578B2
公开(公告)日：2017-12-05
申请号：US14974991
申请日：2015-12-18
Applicant: LG INNOTEK CO., LTD. , LG ELECTRONICS INC.
Inventor： Hyun Kyong Cho , Sun Kyung Kim , Jun Ho Jang
IPC: H01L33/20 , H01L33/40 , H01L33/42 , H01L33/48 , H01L33/62 , H01L33/60 , H01L33/00 , H01L33/22 , H01L33/44
CPC classification number: H01L33/20 , H01L33/0079 , H01L33/22 , H01L33/405 , H01L33/42 , H01L33/44 , H01L33/48 , H01L33/60 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2933/0016 , H01L2933/0033 , H01L2933/0083 , Y10S438/977 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device including a support layer; a reflective electrode disposed on the support layer; an ohmic electrode disposed on the reflective electrode, the ohmic electrode including a transparent electrode; and a semiconductor structure disposed on the ohmic electrode, the semiconductor structure including a p-type semiconductor layer disposed on the ohmic electrode; a light emitting layer disposed on the p-type semiconductor layer; and an n-type semiconductor layer disposed on the light emitting layer. Further, the transparent electrode has a thickness in the range of 40 nm to 90 nm.
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Patent Agency Ranking
公开(公告)号：US09812531B2
公开(公告)日：2017-11-07
申请号：US15598820
申请日：2017-05-18
Applicant: LG Electronics Inc. , LG Innotek Co., Ltd.
Inventor： Jun Ho Jang , Geun Ho Kim
IPC: H01L29/16 , H01L33/20 , H01L29/167 , H01L25/16 , H01L33/62 , H01L33/00 , H01L33/58 , H01L29/866 , H01L33/32 , H01L33/48 , H01L33/40 , H01L33/60 , H01L33/44 , H01L33/38
CPC classification number: H01L29/167 , H01L25/167 , H01L29/866 , H01L33/0079 , H01L33/0095 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/405 , H01L33/44 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2933/0033 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device package can include a sub-mount having a first surface, a second surface, a bottom surface and a cavity; a first layer on the first surface; a second layer on the second surface; a third layer on the bottom surface; a light emitting device on the first layer and including a supporting layer including an anti-diffusion layer, a first electrode on the supporting layer, a semiconductor light emitting structure electrically connected to the first electrode, and a second electrode electrically connected to the semiconductor light emitting structure, in which the first and second electrodes electrically connect to the first layer and the second layer, respectively, and the semiconductor light emitting structure includes a light extraction structure; an ESD property improving diode on the second surface, electrically connected to the second layer and arranged a distance apart from the light emitting device, and a lens on the sub-mount.
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公开(公告)号：US09679973B2
公开(公告)日：2017-06-13
申请号：US15059881
申请日：2016-03-03
Applicant: LG ELECTRONICS INC. , LG INNOTEK CO., LTD.
Inventor： Jun Ho Jang , Geun Ho Kim
IPC: H01L33/62 , H01L33/58 , H01L29/167 , H01L25/16 , H01L33/00 , H01L33/32 , H01L33/40 , H01L33/60 , H01L33/48 , H01L29/866 , H01L33/20 , H01L33/38 , H01L33/44
CPC classification number: H01L29/167 , H01L25/167 , H01L29/866 , H01L33/0079 , H01L33/0095 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/405 , H01L33/44 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2933/0033 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device having a vertical structure and a package thereof, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity. The device and package include a sub-mount, a first-type electrode, a second-type electrode, a light emitting device, a zener diode, and a lens on the sub-mount.
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公开(公告)号：US09880416B2
公开(公告)日：2018-01-30
申请号：US14600964
申请日：2015-01-20
Applicant: LG ELECTRONICS INC. , LG INNOTEK CO., LTD.
Inventor： Jung Hoon Seo , Jun Ho Jang
IPC: G02B6/36 , G02B6/34 , G02B6/32 , G02B6/12 , G02B3/00 , G02B7/02 , G02F1/1335 , H01L33/54 , H01L33/58 , F21V5/00 , F21V5/04 , F21V13/02 , F21K9/60 , H01L33/56 , F21Y105/10 , F21Y115/10
CPC classification number: G02F1/133606 , F21K9/60 , F21V5/007 , F21V5/048 , F21V13/02 , F21Y2105/10 , F21Y2115/10 , G02F1/133603 , G02F1/133611 , G02F2001/133607 , H01L33/54 , H01L33/56 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting device package including light emitting devices, and optical lenses respectively disposed over the light emitting devices. Further, a respective optical lens includes an extending member extending from a body of the respective optical lens, and including a first portion laterally extending in a first direction substantially perpendicular to the central axis of the respective light emitting device, and a second portion extending towards the substrate in a second direction substantially parallel with the central axis of the respective light emitting device. A vertical cross section of the second portion is substantially symmetrical with respect to an axis that is spaced apart in the first direction from and substantially parallel with the central axis of the respective light emitting device.
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9.发明授权公开(公告)号：US09530936B2
公开(公告)日：2016-12-27
申请号：US14097028
申请日：2013-12-04
Applicant: LG ELECTRONICS INC. , LG INNOTEK CO., LTD.
Inventor： Jun Ho Jang , Jae Wan Choi , Duk Kyu Bae , Hyun Kyong Cho , Jong Kook Park , Sun Jung Kim , Jeong Soo Lee
CPC classification number: H01L33/405 , H01L33/0075 , H01L33/0079 , H01L33/04 , H01L33/06 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/40 , H01L33/44 , H01L2933/0016 , H01L2933/0083
Abstract: An LED having vertical topology and a method of making the same is capable of improving a luminous efficiency and reliability, and is also capable of achieving mass productivity. The method includes forming a semiconductor layer on a substrate; forming a first electrode on the semiconductor layer; forming a supporting layer on the first electrode; generating an acoustic stress wave at the interface between the substrate and semiconductor layer, thereby separating the substrate from the semiconductor layer; and forming a second electrode on the semiconductor layer exposed by the separation of the substrate.
Abstract translation: 具有垂直拓扑结构的LED及其制造方法能够提高发光效率和可靠性，并且还能够实现批量生产。 该方法包括在衬底上形成半导体层; 在所述半导体层上形成第一电极; 在所述第一电极上形成支撑层; 在衬底和半导体层之间的界面处产生声应力波，从而将衬底与半导体层分离; 以及在通过所述衬底的分离而暴露的所述半导体层上形成第二电极。
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公开(公告)号：US08729595B2
公开(公告)日：2014-05-20
申请号：US14018297
申请日：2013-09-04
Applicant: LG Electronics Inc.
Inventor： Jun Ho Jang , Geun Ho Kim
CPC classification number: H01L29/167 , H01L25/167 , H01L29/866 , H01L33/0079 , H01L33/0095 , H01L33/20 , H01L33/32 , H01L33/38 , H01L33/405 , H01L33/44 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48227 , H01L2224/73265 , H01L2924/10253 , H01L2933/0033 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device having a vertical structure and a package thereof, which are capable of damping impact generated in a substrate separation process, and achieving an improvement in mass productivity. The device and package include a sub-mount, a first-type electrode, a second-type electrode, a light emitting device, a zener diode, and a lens on the sub-mount.
Abstract translation: 一种具有垂直结构和封装的发光器件，其能够抑制在衬底分离过程中产生的冲击，并且实现批量生产率的提高。 该装置和封装包括副安装座，第一型电极，第二类型电极，发光装置，齐纳二极管和子安装座上的透镜。
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