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公开(公告)号：US10128423B2
公开(公告)日：2018-11-13
申请号：US14953081
申请日：2015-11-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Song Eun Lee , Gyu Hyeong Bak , Bong Kul Min
Abstract: Disclosed are a light emitting device and a lighting apparatus having the same. The light emitting device includes a plurality of lead frames, a first body having non-transmissive resin material on top surfaces of the lead frames, a second body having transmittance resin material on a top surface of the first body, a light emitting chip on at least one of the lead frames exposed in the first opening of the second body, and a first transmissive layer disposed in the first opening of the second body. The first body and the second body is disposed around the light emitting chip.
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公开(公告)号：US09885450B2
公开(公告)日：2018-02-06
申请号：US14338812
申请日：2014-07-23
Applicant: LG INNOTEK CO., LTD
Inventor： Sang Won Lee , Gyu Hyeong Bak
IPC: H01L33/00 , F21K9/60 , H01L33/58 , G02B19/00 , H01L33/50 , H01L33/52 , F21V5/04 , H01L33/56 , H01L33/32 , B82Y20/00 , F21Y101/00 , F21Y115/10
CPC classification number: F21K9/60 , B82Y20/00 , F21V5/04 , F21Y2101/00 , F21Y2115/10 , G02B19/0014 , G02B19/0066 , G02B19/0071 , H01L33/32 , H01L33/50 , H01L33/52 , H01L33/56 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: Provided is a light emitting apparatus. The light emitting apparatus includes a substrate; a light emitting device on the substrate; a fluorescent layer formed on the substrate and the light emitting device to surround the light emitting device; an encapsulant resin layer formed on the substrate and the fluorescent layer to surround the fluorescent layer; and a lens disposed on the light emitting device and supported by the substrate, wherein the lens includes a lens body having a first recess formed at a center of a top surface of the lens body and a second recess formed at a center of a bottom surface of the lens body, and a lens supporter provided at the bottom surface of the lens body to support the lens body such that the lens body is spaced apart from the substrate.
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公开(公告)号：US10030823B2
公开(公告)日：2018-07-24
申请号：US15855058
申请日：2017-12-27
Applicant: LG INNOTEK CO., LTD
Inventor： Sang Won Lee , Gyu Hyeong Bak
IPC: H01L33/00 , F21K9/60 , H01L33/56 , F21V5/04 , H01L33/52 , H01L33/50 , H01L33/58 , G02B19/00 , B82Y20/00 , F21Y115/10 , H01L33/32 , F21Y101/00
CPC classification number: F21K9/60 , B82Y20/00 , F21V5/04 , F21Y2101/00 , F21Y2115/10 , G02B19/0014 , G02B19/0066 , G02B19/0071 , H01L33/32 , H01L33/50 , H01L33/52 , H01L33/56 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: Provided is a light emitting apparatus. The light emitting apparatus includes a substrate; a light emitting device on the substrate; a fluorescent layer formed on the substrate and the light emitting device to surround the light emitting device; an encapsulant resin layer formed on the substrate and the fluorescent layer to surround the fluorescent layer; and a lens disposed on the light emitting device and supported by the substrate, wherein the lens includes a lens body having a first recess formed at a center of a top surface of the lens body and a second recess formed at a center of a bottom surface of the lens body, and a lens supporter provided at the bottom surface of the lens body to support the lens body such that the lens body is spaced apart from the substrate.
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公开(公告)号：US09638378B2
公开(公告)日：2017-05-02
申请号：US14855658
申请日：2015-09-16
Applicant: LG INNOTEK CO., LTD
Inventor： Sang Won Lee , Gyu Hyeong Bak
IPC: H01L33/00 , F21K99/00 , H01L33/58 , G02B19/00 , H01L33/50 , H01L33/52 , F21V5/04 , H01L33/56 , F21K9/60 , H01L33/32 , B82Y20/00 , F21Y101/00
CPC classification number: F21K9/60 , B82Y20/00 , F21V5/04 , F21Y2101/00 , F21Y2115/10 , G02B19/0014 , G02B19/0066 , G02B19/0071 , H01L33/32 , H01L33/50 , H01L33/52 , H01L33/56 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: Provided is a light emitting apparatus. The light emitting apparatus includes a substrate; a light emitting device on the substrate; a fluorescent layer formed on the substrate and the light emitting device to surround the light emitting device; an encapsulant resin layer formed on the substrate and the fluorescent layer to surround the fluorescent layer; and a lens disposed on the light emitting device and supported by the substrate, wherein the lens includes a lens body having a first recess formed at a center of a top surface of the lens body and a second recess formed at a center of a bottom surface of the lens body, and a lens supporter provided at the bottom surface of the lens body to support the lens body such that the lens body is spaced apart from the substrate.
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公开(公告)号：US10546986B2
公开(公告)日：2020-01-28
申请号：US15513510
申请日：2015-09-22
Applicant: LG INNOTEK CO., LTD.
Inventor： Gyu Hyeong Bak , Bong Kul Min
Abstract: A light-emitting device package according to an embodiment provides a light-emitting device including a light-emitting structure having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a package body; first and second lead frames disposed in the package body and disposed to be electrically isolated from each other; a first solder portion of a solid state disposed between the first lead frame and the first conductive semiconductor layer, the first solder portion having a uniform area and an even thickness; and a second solder portion of a solid state disposed between the second lead frame and the second conductive semiconductor layer, the second solder portion having a uniform area and an even thickness.
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Patent Agency Ranking
公开(公告)号：US20180119895A1
公开(公告)日：2018-05-03
申请号：US15855058
申请日：2017-12-27
Applicant: LG Innotek Co., Ltd
Inventor： Sang Won Lee , Gyu Hyeong Bak
IPC: H01L33/52 , F21V5/04 , H01L33/56 , G02B19/00 , H01L33/50 , H01L33/58 , B82Y20/00 , F21Y101/00 , H01L33/32
CPC classification number: F21K9/60 , B82Y20/00 , F21V5/04 , F21Y2101/00 , F21Y2115/10 , G02B19/0014 , G02B19/0066 , G02B19/0071 , H01L33/32 , H01L33/50 , H01L33/52 , H01L33/56 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: Provided is a light emitting apparatus. The light emitting apparatus includes a substrate; a light emitting device on the substrate; a fluorescent layer formed on the substrate and the light emitting device to surround the light emitting device; an encapsulant resin layer formed on the substrate and the fluorescent layer to surround the fluorescent layer; and a lens disposed on the light emitting device and supported by the substrate, wherein the lens includes a lens body having a first recess formed at a center of a top surface of the lens body and a second recess formed at a center of a bottom surface of the lens body, and a lens supporter provided at the bottom surface of the lens body to support the lens body such that the lens body is spaced apart from the substrate.
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公开(公告)号：US09620691B2
公开(公告)日：2017-04-11
申请号：US14833631
申请日：2015-08-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Joo Oh , Keal Doo Moon , Gyu Hyeong Bak
CPC classification number: H01L33/62 , H01L33/60 , H01L33/647 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: Embodiments provide a light emitting device package including a first lead frame including a first contact area and a first exposed area, a second lead frame spaced apart from the first lead frame, the second lead frame including a second contact area and a second exposed area, a bottom portion located between the first contact area and the first exposed area, between the second contact area and the second exposed area, and between the first contact area and the second contact area, a light emitting device electrically connected to the first and second contact areas, and a package body having a cavity configured to expose the first and second contact areas, the first and second exposed areas, and the bottom portion, wherein the bottom portion has a thermal expansion coefficient greater than a thermal expansion coefficient of the first and second lead frames.
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公开(公告)号：US10396258B2
公开(公告)日：2019-08-27
申请号：US15314118
申请日：2015-05-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Dae Geun Kim , Kyoung Un Kim , Seul Ki Kim , Bong Kul Min , Gyu Hyeong Bak
Abstract: An embodiment comprises: a substrate having a chip mounting region; first and second wiring layers disposed on the substrate around the chip mounting region so as to be spaced apart from each other; and a plurality of light emitting chips disposed on the chip mounting region, wherein the first wiring layer comprises a first wiring pattern disposed at one side of a reference line and having a first concave part, and a first extending pattern extending from the first wiring pattern to the other side of the reference line, the second wiring layer comprises a second wiring pattern disposed at the other side of the reference line and having a second concave part, and a second extending pattern extending from the second wiring pattern to one side of the reference line, and the reference line is a straight line passing through the center of the chip mounting region.
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公开(公告)号：US09534744B2
公开(公告)日：2017-01-03
申请号：US14855640
申请日：2015-09-16
Applicant: LG INNOTEK CO., LTD
Inventor： Sang Won Lee , Gyu Hyeong Bak
IPC: H01L33/00 , F21K99/00 , H01L33/58 , G02B19/00 , H01L33/50 , H01L33/52 , F21V5/04 , H01L33/56 , H01L33/32 , B82Y20/00 , F21Y101/00
CPC classification number: F21K9/60 , B82Y20/00 , F21V5/04 , F21Y2101/00 , F21Y2115/10 , G02B19/0014 , G02B19/0066 , G02B19/0071 , H01L33/32 , H01L33/50 , H01L33/52 , H01L33/56 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: Provided is a light emitting apparatus. The light emitting apparatus includes a substrate; a light emitting device on the substrate; a fluorescent layer formed on the substrate and the light emitting device to surround the light emitting device; an encapsulant resin layer formed on the substrate and the fluorescent layer to surround the fluorescent layer; and a lens disposed on the light emitting device and supported by the substrate, wherein the lens includes a lens body having a first recess formed at a center of a top surface of the lens body and a second recess formed at a center of a bottom surface of the lens body, and a lens supporter provided at the bottom surface of the lens body to support the lens body such that the lens body is spaced apart from the substrate.
Abstract translation: 提供了一种发光装置。 发光装置包括：基板; 基板上的发光器件; 形成在基板上的荧光层和围绕发光器件的发光器件; 形成在所述基板上的密封树脂层和所述荧光层，以包围所述荧光层; 以及设置在所述发光装置上并由所述基板支撑的透镜，其中，所述透镜包括透镜体，所述透镜体具有形成在所述透镜主体的顶表面的中心处的第一凹部和形成在所述透镜主体的中心的第二凹部 以及透镜支撑体，其设置在透镜体的底表面处以支撑透镜体，使得透镜主体与基板间隔开。
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公开(公告)号：US20140332837A1
公开(公告)日：2014-11-13
申请号：US14338812
申请日：2014-07-23
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Won LEE , Gyu Hyeong Bak
CPC classification number: F21K9/60 , B82Y20/00 , F21V5/04 , F21Y2101/00 , F21Y2115/10 , G02B19/0014 , G02B19/0066 , G02B19/0071 , H01L33/32 , H01L33/50 , H01L33/52 , H01L33/56 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: Provided is a light emitting apparatus. The light emitting apparatus includes a substrate; a light emitting device on the substrate; a fluorescent layer formed on the substrate and the light emitting device to surround the light emitting device; an encapsulant resin layer formed on the substrate and the fluorescent layer to surround the fluorescent layer; and a lens disposed on the light emitting device and supported by the substrate, wherein the lens includes a lens body having a first recess formed at a center of a top surface of the lens body and a second recess formed at a center of a bottom surface of the lens body, and a lens supporter provided at the bottom surface of the lens body to support the lens body such that the lens body is spaced apart from the substrate.
Abstract translation: 提供了一种发光装置。 发光装置包括：基板; 基板上的发光器件; 形成在基板上的荧光层和围绕发光器件的发光器件; 形成在所述基板上的密封树脂层和所述荧光层，以包围所述荧光层; 以及设置在所述发光装置上并由所述基板支撑的透镜，其中，所述透镜包括透镜体，所述透镜体具有形成在所述透镜主体的顶表面的中心处的第一凹部和形成在所述透镜主体的中心的第二凹部 以及透镜支撑体，其设置在透镜体的底表面处以支撑透镜体，使得透镜主体与基板间隔开。
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