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公开(公告)号：US10243119B2
公开(公告)日：2019-03-26
申请号：US15033307
申请日：2014-10-20
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Joo Oh
IPC: H01L33/58 , G02B6/00 , H01L25/075
Abstract: A light-emitting device package according to an embodiment comprises lenses arranged in and on a light-emitting device. The lenses comprise an upper surface including a recessed part; a groove part arranged on one or more areas of the upper surface; a bottom surface facing the light-emitting device; a supporting part arranged on the bottom surface; and an outer surface that is slanted with respect to the bottom surface and that contacts the groove part, wherein the groove part is arranged more outwardly from the lens than the support part relative to the light-emitting device.
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公开(公告)号：US12244182B2
公开(公告)日：2025-03-04
申请号：US17757903
申请日：2020-11-30
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Joo Oh , Jae Young Kim
Abstract: The present invention may provide a motor including a shaft, a rotor coupled to the shaft, and a stator disposed to correspond to the rotor, wherein the rotor includes a rotor core, a magnet disposed on an outer surface of the rotor core, and a guide in contact with the rotor core, the guide includes a first member in contact with one side surface of the rotor core and a plurality of second members (420, 430) which extend from the first member in an axial direction and are in contact with a side surface of the magnet, and positions of one side end portions and the other side end portions of the second members are different from each other in a circumferential direction.
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公开(公告)号：US11063490B2
公开(公告)日：2021-07-13
申请号：US16316488
申请日：2017-06-19
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Joo Oh , Woo Jin Hyun
Abstract: One embodiment relates to a motor comprising: a motor housing comprising a first housing and a second housing; a stator disposed in the motor housing; a coil wound around the stator; a rotor rotatably disposed in the stator; a shaft coupling with the rotor; a bearing for supporting the shaft; and a busbar terminal connected with an end portion of the coil, wherein the first housing comprises a body part and a first flange, the body part comprising a first region, and a second region extending from the first region, and the first flange extending in a vertical direction from an end portion of the second region, and the busbar terminal and the bearing are disposed in the first region. Accordingly, the structure of the motor may be simplified, and a gap due to tolerance among components may be minimized, and thus the reliability of the motor may be enhanced.
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公开(公告)号：US09541254B2
公开(公告)日：2017-01-10
申请号：US13835075
申请日：2013-03-15
Applicant: LG INNOTEK CO., LTD.
Inventor： Yeo Chan Yoon , Jae Hwan Jung , Sung Joo Oh , Jin Seong Kim
CPC classification number: F21V7/00 , F21V13/04 , F21V13/08 , H01L33/405 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2924/1301 , H01L2933/0091 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed are a light emitting device. The light emitting device includes a body having a cavity; a plurality of lead frames in the cavity; a light emitting chip; a first molding member having a first metal oxide material around the light emitting chip; and a second molding member having a second metal oxide material on the first molding member and the light emitting chip, wherein the light emitting chip includes a reflective electrode layer under a light emitting structure, wherein a top surface of the first molding member extends from a region between a top surface of the light emitting chip and a lateral side of the reflective electrode layer at a predetermined curvature, and wherein a bottom surface of the second molding member includes a curved surface which is convex toward the first molding member.
Abstract translation: 公开了一种发光器件。 发光装置包括具有空腔的主体; 空腔中的多个引线框架; 发光芯片; 具有围绕所述发光芯片的第一金属氧化物材料的第一模制构件; 以及在所述第一模制件和所述发光芯片上具有第二金属氧化物材料的第二模制构件，其中所述发光芯片包括在发光结构下的反射电极层，其中所述第一模制构件的顶表面从 在所述发光芯片的上表面与所述反射电极层的侧面之间的预定曲率的区域，并且其中所述第二成型构件的底面包括朝向所述第一成型构件凸出的弯曲表面。
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公开(公告)号：US10704744B2
公开(公告)日：2020-07-07
申请号：US16074997
申请日：2017-02-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Joo Oh
IPC: H01L33/50 , F21V5/04 , F21K9/69 , H01L33/58 , F21V17/10 , H01L33/48 , F21V9/32 , H01L25/13 , H01L33/62 , H01L25/075 , F21Y115/10 , H01L33/06 , H01L33/12 , H01L33/32 , H01L33/40 , H01L33/42 , H01L33/46
Abstract: A light source unit is disclosed in an embodiment. The disclosed light source unit comprises: a fixing plate having an opening portion; a light emitting device disposed in an opening portion of the fixing plate; and an optical lens disposed on the fixing plate, wherein the fixing plate has a plurality of fixing portions, the optical lens includes: a bottom surface on the fixing plate; a concave recess on the opening portion of the fixing plate; a light incident surface around the recess; and a light exit surface for emitting the light incident to the light incident surface, the fixing plate and the bottom surface of the optical lens are coupled to each other, and the fixing plate is spaced from the light emitting device.
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Patent Agency Ranking
公开(公告)号：US10374135B2
公开(公告)日：2019-08-06
申请号：US15527589
申请日：2015-11-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Keal Doo Moon , Sung Joo Oh
Abstract: An embodiment provides a light emitting device package comprising: a package body; a first lead frame and a second lead frame, of which at least a part of each is inserted into the package body; and a light emitting device electrically flip bonded to the first lead frame and to the second lead frame, wherein the package body forms an electrode separation line between the first lead frame and the second lead frame, and the electrode separation line has at least two curved portions.
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公开(公告)号：US09620691B2
公开(公告)日：2017-04-11
申请号：US14833631
申请日：2015-08-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Joo Oh , Keal Doo Moon , Gyu Hyeong Bak
CPC classification number: H01L33/62 , H01L33/60 , H01L33/647 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: Embodiments provide a light emitting device package including a first lead frame including a first contact area and a first exposed area, a second lead frame spaced apart from the first lead frame, the second lead frame including a second contact area and a second exposed area, a bottom portion located between the first contact area and the first exposed area, between the second contact area and the second exposed area, and between the first contact area and the second contact area, a light emitting device electrically connected to the first and second contact areas, and a package body having a cavity configured to expose the first and second contact areas, the first and second exposed areas, and the bottom portion, wherein the bottom portion has a thermal expansion coefficient greater than a thermal expansion coefficient of the first and second lead frames.
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公开(公告)号：US09564564B2
公开(公告)日：2017-02-07
申请号：US14819952
申请日：2015-08-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Joo Oh , Bong Kul Min
CPC classification number: H01L33/62 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: Disclosed are a light emitting device. The light emitting device include first and second lead frames, a first body on the first and second lead frames and including an open region, a second body on the first body and including a first opening, a light emitting chip on the opening region, and a transmissive layer on the light emitting chip. The first body and the second body are formed of a resin material. A top surface of the first body is located at a position lower than a position of a top surface of the light emitting chip. The second body includes a bottom surface located at a position lower than the position of the top surface of the light emitting chip. The first body comprises an inclined part around the light emitting chip. The first body includes a reflectance material and the second body includes a transmissive material.
Abstract translation: 公开了一种发光器件。 发光器件包括第一引线框架和第二引线框架，第一引线框架和第二引线框架上的第一主体，并且包括开放区域，第一主体上的第二主体，并且包括第一开口，在开口区域上的发光芯片，以及 在发光芯片上的透射层。 第一主体和第二主体由树脂材料形成。 第一主体的顶面位于低于发光芯片的顶面的位置的位置。 第二主体包括位于低于发光芯片的顶表面的位置的位置的底表面。 第一主体包括围绕发光芯片的倾斜部分。 第一主体包括反射材料，第二主体包括透射材料。
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公开(公告)号：US12142970B2
公开(公告)日：2024-11-12
申请号：US17636395
申请日：2020-08-18
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Joo Oh
Abstract: The present invention may provide a motor including a rotor and a stator disposed to correspond to the rotor, wherein the rotor includes a first rotor core and a second rotor core stacked on each other in an axial direction, the first rotor core includes a first surface on which a magnet is disposed and a first hole which passes through the first rotor core in the axial direction, the second rotor core includes a second surface on which a magnet is disposed and a second hole which passes through the second rotor core in the axial direction, the first surface and the second surface are disposed to be misaligned with each other around a center in the axial direction, and the first hole and the second hole are disposed to be aligned with each other.
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公开(公告)号：US09559278B2
公开(公告)日：2017-01-31
申请号：US14724090
申请日：2015-05-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Joo Oh , Keal Doo Moon , Dong Yong Lee
CPC classification number: H01L33/62 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L33/38 , H01L33/486 , H01L33/647 , H01L2224/06102 , H01L2224/13017 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/13294 , H01L2224/133 , H01L2224/1403 , H01L2224/16058 , H01L2224/16227 , H01L2224/16245 , H01L2224/1703 , H01L2224/17051 , H01L2224/81193 , H01L2224/81439 , H01L2224/81815 , H01L2924/12041 , H01L2933/0066 , H01L2924/014 , H01L2924/00014
Abstract: Embodiments provide light emitting device package including a package body, a first lead frame and a second lead frame disposed on the package body, and a light emitting device electrically connected to the first lead frame and the second lead frame via respective conductive adhesives. At least one of the conductive adhesives has the smallest width at a central region thereof.
Abstract translation: 实施例提供了包括封装主体，设置在封装主体上的第一引线框架和第二引线框架的发光器件封装以及经由各自的导电粘合剂电连接到第一引线框架和第二引线框架的发光器件。 至少一种导电粘合剂在其中心区域具有最小的宽度。
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