公开(公告)号：US20160155907A1

公开(公告)日：2016-06-02

申请号：US14953254

申请日：2015-11-27

Applicant: LG Innotek Co., Ltd.

Inventor： Satoshi OZEKI ,  Yuichiro TANDA

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/483 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: An embodiment relates to a light-emitting device package. In an embodiment, the light-emitting device package includes a package body configured to include a top surface, a plate guide unit disposed on the top surface, and a cavity formed in the top surface, a light-emitting device disposed within the cavity, a plate disposed on the top surface of the package body and guided by the plate guide unit, and an adhesive member disposed between the top surface of the package body and the plate. The adhesive member includes a base layer made of a flexible material, a first adhesive tape disposed between the base layer and the top surface of the package body and bonded to the base layer and the top surface of the package body, and a second adhesive tape disposed between the base layer and the plate and bonded to the base layer and the plate.

Abstract translation: 实施例涉及发光器件封装。 在一个实施例中，发光器件封装包括封装主体，其被构造为包括顶表面，设置在顶表面上的板引导单元和形成在顶表面中的空腔，设置在腔内的发光器件， 设置在封装主体的顶表面上并由板引导单元引导的板，以及设置在封装体的顶表面和板之间的粘合构件。 粘合剂构件包括由柔性材料制成的基层，第一粘合带，其设置在基体层和封装主体的顶表面之间并且接合到基底层和封装体的顶表面;以及第二粘合带 设置在基层和板之间并结合到基层和板上。

公开(公告)号：US20160013382A1

公开(公告)日：2016-01-14

申请号：US14794475

申请日：2015-07-08

Applicant: LG Innotek Co., Ltd.

Inventor： Satoshi OZEKI ,  Yuichiro TANDA

IPC: H01L33/60 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A light emitting device package may be provided that includes: a lead frame; a light emitting device disposed on the lead frame; a metallic reflector which is disposed on the lead frame, has a hollow portion in which the light emitting device is disposed, reflects light emitted from the light emitting device, and is formed by a mold; and a resin body which surrounds the lead frame and the reflector. The resin body includes an insulation layer disposed between the lead frame and the reflector, and a protrusion disposed on the reflector.

Abstract translation: 可以提供一种发光器件封装，其包括：引线框架; 设置在引线框架上的发光器件; 设置在引线框架上的金属反射器具有设置有发光器件的中空部分，反射从发光器件发射的光，并由模具形成; 以及围绕引线框架和反射器的树脂体。 树脂体包括设置在引线框架和反射器之间的绝缘层和设置在反射器上的突起。

公开(公告)号：US20160211429A1

公开(公告)日：2016-07-21

申请号：US15082091

申请日：2016-03-28

Applicant: LG Innotek Co., Ltd.

Inventor： Byung Mok KIM ,  Bo Hee KANG ,  Ha Na KIM ,  Hiroshi KODAIRA ,  Yuichiro TANDA ,  Satoshi OZEKI

IPC: H01L33/62 ,  H01L33/38 ,  H01L33/48

CPC classification number: H01L33/62 ,  A61L2/08 ,  A61L2/10 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/00014

Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.

公开(公告)号：US20180261740A1

公开(公告)日：2018-09-13

申请号：US15976311

申请日：2018-05-10

Applicant: LG Innotek Co., Ltd.

Inventor： Satoshi OZEKI ,  Yuichiro TANDA

IPC: H01L33/60 ,  H01L33/48 ,  H01L23/00

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An ultraviolet light emitting device package can include a first conductive member and second conductive members; a light emitting device to emit ultraviolet light and disposed on the first conductive member; an aluminum reflector on the second conductive members, the aluminum reflector having a hollow portion in which the light emitting device is disposed, and configured to reflect ultraviolet light emitted from the light emitting device; a cover glass on the aluminum reflector and the light emitting device; and an insulator between the aluminum reflector and the second conductive members, in which the first conductive member is insulated from the light emitting device and the second conductive members, a middle area of the first conductive member corresponds to a middle area of the hollow portion, the light emitting device is disposed on the middle area of the first conductive member, the second conductive members are disposed on both sides of the first conductive member, symmetrically, and the second conductive members are electrically connected to the light emitting device, both outermost edges of the aluminum reflector protrude farther than corresponding outermost edges of the second conductive members.

公开(公告)号：US20180130934A1

公开(公告)日：2018-05-10

申请号：US15863146

申请日：2018-01-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Byung Mok KIM ,  Hiroshi KODAIRA ,  Su Jung JUNG ,  Bo Hee KANG ,  Young Jin NO ,  Yuichiro TANDA ,  Satoshi OZEKI

IPC: H01L33/64 ,  H01L33/58 ,  H01L33/48

CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.

公开(公告)号：US20160013377A1

公开(公告)日：2016-01-14

申请号：US14794476

申请日：2015-07-08

Applicant: LG Innotek Co., Ltd.

Inventor： Satoshi OZEKI ,  Yuichiro TANDA

IPC: H01L33/56 ,  H01L33/60 ,  H01L33/54 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L33/56 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: A light emitting device package may be provided that includes: a lead frame which includes a first frame and a second frame disposed on both sides of the first frame respectively; a light emitting device which is disposed on the first frame and is electrically connected to the second frame; and a resin body which includes a first resin body which is disposed between the first frame and the second frame, and a second resin body which covers an outer surface of the lead frame. An end of the first frame and an end of the second frame are disposed on an outer surface of the second resin body.

Abstract translation: 可以提供一种发光器件封装，其包括：引线框架，其分别包括设置在第一框架两侧的第一框架和第二框架; 发光装置，其设置在所述第一框架上并电连接到所述第二框架; 以及树脂体，其包括设置在所述第一框架和所述第二框架之间的第一树脂体，以及覆盖所述引线框架的外表面的第二树脂体。 第一框架的端部和第二框架的端部设置在第二树脂体的外表面上。

公开(公告)号：US20150270463A1

公开(公告)日：2015-09-24

申请号：US14729771

申请日：2015-06-03

Applicant: LG Innotek Co., Ltd.

Inventor： Byung Mok KIM ,  Bo Hee KANG ,  Ha Na KIM ,  Hiroshi KODAIRA ,  Yuichiro TANDA ,  Satoshi OZEKI

IPC: H01L33/64 ,  H01L33/38 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/62 ,  A61L2/08 ,  A61L2/10 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/00014

Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.

Abstract translation: 1.一种发光器件封装，包括包括第一腔和第二腔的封装体，设置在所述第一腔的底表面上的垫，设置在所述第二腔上的发光器件，电连接到所述垫，散热构件插入 散热构件包括主体和布置在主体的部分边缘区域处的扩展部分和设置在封装主体处的电极图案，其中封装体具有设置在上部的下部分的上部和下部 ，其中所述第一腔包括侧表面和底表面，其中所述第二腔设置在所述第一腔的底表面中。

公开(公告)号：US20140191276A1

公开(公告)日：2014-07-10

申请号：US14149547

申请日：2014-01-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Byung Mok KIM ,  Hiroshi KODAIRA ,  Ha Na KIM ,  Yuichiro TANDA ,  Satoshi OZEKI

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L33/48 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Disclosed is a light emitting device package with improved light extraction efficiency. The light emitting device package includes a substrate, a light emitting device disposed on the substrate, and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm.

Abstract translation: 公开了一种具有改进的光提取效率的发光器件封装。 发光器件封装包括衬底，设置在衬底上的发光器件和设置在发光器件上方的光传输单元，光传输单元与发光器件间隔开，其中， 发光装置和光传输单元为0.15mm至0.35mm。