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公开(公告)号：US20170324003A1
公开(公告)日：2017-11-09
申请号：US15319486
申请日：2015-06-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Hiroshi KODAIRA , Baek Jun KIM , Ha Na KIM , Jung Woo LEE , Sang Ung HWANG
CPC classification number: H01L33/387 , F21V7/05 , H01L33/486 , H01L33/60 , H01L51/0076 , H01L2224/48091 , H01L2224/73265 , H01L2933/0033 , H05K1/0212 , H01L2924/00014
Abstract: A light-emitting device package of the embodiments includes a package body; at least one light emitting device above the package body; an adhesive layer between the at least one light emitting device and the package body; and an adhesive-layer-accommodating portion disposed in the package body for accommodating the adhesive layer therein, wherein the adhesive-layer-accommodating portion has a side surface disposed to be inclined at a predetermined angle relative to an imaginary vertical plane that extends in a thickness direction of the package body.
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公开(公告)号：US20170117443A1
公开(公告)日：2017-04-27
申请号：US15319318
申请日：2015-05-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Ha Na KIM , Hiroshi KODAIRA , Baek Jun KIM , Jung Woo LEE , Sang Ung HWANG
CPC classification number: H01L33/483 , H01L33/486 , H01L33/52 , H01L33/58 , H01L2224/48091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: A light-emitting device package according to an embodiment includes a package body including a cavity and a recessed portion formed around the cavity, the recessed portion having at least one concave portion; at least one light-emitting device mounted in the cavity; a light-transmitting member disposed to cover a top of the cavity and configured to transmit light emitted from the at least one light-emitting device; and a bonding member accommodated in the at least one concave portion so as to allow the light-transmitting member and the package body to be bonded to each other in the recessed portion.
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公开(公告)号：US20160211429A1
公开(公告)日：2016-07-21
申请号：US15082091
申请日：2016-03-28
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok KIM , Bo Hee KANG , Ha Na KIM , Hiroshi KODAIRA , Yuichiro TANDA , Satoshi OZEKI
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
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公开(公告)号：US20160126426A1
公开(公告)日：2016-05-05
申请号：US14892906
申请日：2014-05-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Ha Na KIM , Byung Mok KIM
CPC classification number: H01L33/486 , H01L33/502 , H01L33/58 , H01L2924/16195 , H01L2924/16315
Abstract: An embodiment relates to a light emitting module. A light emitting module according to an embodiment comprises: a light source unit comprising a light emitting device; a body comprising a lower portion on which the light source unit is arranged, a wall portion arranged on the lower portion and configured to surround the light source unit, and an upper portion arranged on the wall portion; an optical member arranged on the light source unit to transmit light from the light emitting device; and an adhesive member arranged between the wall portion of the body and the optical member to couple the body and the optical member, wherein the upper portion of the body is arranged between the light emitting device and the adhesive member.
Abstract translation: 实施例涉及发光模块。 根据实施例的发光模块包括：光源单元，包括发光器件; 一个主体，包括设置有光源单元的下部，布置在下部并被构造成围绕光源单元的壁部分和布置在壁部上的上部; 配置在所述光源单元上以从所述发光装置透射光的光学构件; 以及布置在所述主体的所述壁部分和所述光学构件之间以将所述主体和所述光学构件联接的粘合构件，其中所述主体的上部布置在所述发光装置和所述粘合构件之间。
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Patent Agency Ranking
公开(公告)号：US20160181479A1
公开(公告)日：2016-06-23
申请号：US14978741
申请日：2015-12-22
Applicant: LG INNOTEK CO., LTD.
Inventor： Baek Jun KIM , Hiroshi KODAIRA , Ki Man KANG , Ha Na KIM , Hyun Don SONG , Jung Woo LEE , Jung Hun OH
CPC classification number: H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2924/16315 , H01L2933/0058 , H01L2924/00014
Abstract: A light emitting device includes a body having a cavity and a step difference structure around the cavity, a plurality of electrodes in the cavity, a light emitting chip in the cavity, a transparent window having an outer portion provided on the step difference structure to cover the cavity, and an adhesive member between the transparent window and the body. The adhesive member includes a first adhesive member between an outer bottom surface of the transparent window and a bottom of the step difference structure and a second adhesive member between the outer portion of the transparent window and the body.
Abstract translation: 一种发光器件包括具有空腔的腔体和围绕空腔的台阶差分结构，空腔中的多个电极，空腔中的发光芯片，具有设置在台阶差分结构上的外部部分的透明窗口以覆盖 空腔和透明窗与主体之间的粘合构件。 所述粘合部件包括在所述透明窗的外底表面和所述台阶差结构的底部之间的第一粘合构件，以及在所述透明窗的外部与所述主体之间的第二粘合构件。
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公开(公告)号：US20150270463A1
公开(公告)日：2015-09-24
申请号：US14729771
申请日：2015-06-03
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok KIM , Bo Hee KANG , Ha Na KIM , Hiroshi KODAIRA , Yuichiro TANDA , Satoshi OZEKI
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
Abstract translation: 1.一种发光器件封装，包括包括第一腔和第二腔的封装体，设置在所述第一腔的底表面上的垫，设置在所述第二腔上的发光器件，电连接到所述垫，散热构件插入 散热构件包括主体和布置在主体的部分边缘区域处的扩展部分和设置在封装主体处的电极图案，其中封装体具有设置在上部的下部分的上部和下部 ，其中所述第一腔包括侧表面和底表面，其中所述第二腔设置在所述第一腔的底表面中。
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公开(公告)号：US20140246604A1
公开(公告)日：2014-09-04
申请号：US14275725
申请日：2014-05-12
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na KIM , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers.
Abstract translation: 一种发光器件封装，包括包括多个第一陶瓷层的封装体，放置在封装主体上的至少一个电极图案，与电极图形电连接的至少一个发光器件，以及设置在封装体中的散热构件 本体与发光器件热接触，其中散热构件在对应于不同第一陶瓷层的边界的区域处设置有扩展部分。
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公开(公告)号：US20140191276A1
公开(公告)日：2014-07-10
申请号：US14149547
申请日：2014-01-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Hiroshi KODAIRA , Ha Na KIM , Yuichiro TANDA , Satoshi OZEKI
IPC: H01L33/58
CPC classification number: H01L33/58 , H01L33/48 , H01L33/56 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
Abstract: Disclosed is a light emitting device package with improved light extraction efficiency. The light emitting device package includes a substrate, a light emitting device disposed on the substrate, and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm.
Abstract translation: 公开了一种具有改进的光提取效率的发光器件封装。 发光器件封装包括衬底，设置在衬底上的发光器件和设置在发光器件上方的光传输单元，光传输单元与发光器件间隔开，其中， 发光装置和光传输单元为0.15mm至0.35mm。
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公开(公告)号：US20140084182A1
公开(公告)日：2014-03-27
申请号：US14035700
申请日：2013-09-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Bo Hee KANG , Ha Na KIM , Hiroshi KODAIRA
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.
Abstract translation: 实施例提供了一种发光器件封装，其包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件，插入封装主体中以热接触的散热构件 和发光装置，以及设置在散热构件上的抗断裂层。 抗断裂层与散热构件的至少一部分周边区域垂直重叠。
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