-
公开(公告)号：US20160133810A1
公开(公告)日：2016-05-12
申请号：US14982013
申请日：2015-12-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Su Jung JUNG , Byung Mok KIM , Young Jun CHO , Seo Yeon KWON
CPC classification number: H01L33/64 , H01L24/73 , H01L25/167 , H01L33/06 , H01L33/32 , H01L33/405 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00012 , H01L2924/00014
Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.
-
公开(公告)号：US20180130934A1
公开(公告)日：2018-05-10
申请号：US15863146
申请日：2018-01-05
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Hiroshi KODAIRA , Su Jung JUNG , Bo Hee KANG , Young Jin NO , Yuichiro TANDA , Satoshi OZEKI
CPC classification number: H01L33/642 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
-
公开(公告)号：US20160043296A1
公开(公告)日：2016-02-11
申请号：US14885661
申请日：2015-10-16
Applicant: LG Innotek Co., Ltd.
Inventor： Su Jung JUNG , Yon Tae MOON , Young Jun CHO , Son Kyo HWANG , Byung Mok KIM , Seo Yeon KWON
IPC: H01L33/64
CPC classification number: H01L33/641 , C09K11/67 , H01L25/0753 , H01L33/62 , H01L33/64 , H01L2224/32013 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/01322 , H01L2924/12032 , H01S5/02469 , H01L2924/00014 , H01L2924/00
Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
-
公开(公告)号：US20140167095A1
公开(公告)日：2014-06-19
申请号：US14105439
申请日：2013-12-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Young Jin NO , Bo Hee KANG , Hiroshi KODAIRA
IPC: H01L33/62
CPC classification number: H01L33/62 , H01L23/3677 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48455 , H01L2224/48997 , H01L2224/73265 , H01L2224/85951 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15174 , H01L2924/15183 , H01L2924/15787 , H01L2924/181 , H01L2224/45099 , H01L2924/20752 , H01L2924/20753 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
Abstract: Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction.
Abstract translation: 公开了一种发光器件封装，其包括：封装体，其包括设置在其表面上的至少一个电极焊盘;发光器件，其布置在封装主体上，所述发光器件通过导线电连接到所述电极焊盘;以及 通孔电极通过封装体，其中，所述线在所述发光器件和所述电极焊盘中的至少一个上形成针迹，所述发光器件封装还包括设置在所述线圈上的接合球，并且所述通孔电极非 在垂直方向上重新缝合线圈和接合球。
-
公开(公告)号：US20190067544A1
公开(公告)日：2019-02-28
申请号：US16176316
申请日：2018-10-31
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Su Jung JUNG , Yu Dong KIM , Gun Kyo LEE
Abstract: Provided is a light emitting device package. The light emitting device package comprises a body, a heat diffusing member, a light emitting diode (LED), and a buffer layer. A cavity with an opened topside is formed in the body. The heat dissipation member is disposed between a bottom surface of the cavity and a lower surface of the body. The LED is disposed on one of an electrode disposed on the bottom surface of the cavity. The buffer layer is disposed between the heat dissipation member and a pad and has a thickness thinner than a thickness of the heat dissipation member.
-
Patent Agency Ranking
公开(公告)号：US20150270463A1
公开(公告)日：2015-09-24
申请号：US14729771
申请日：2015-06-03
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok KIM , Bo Hee KANG , Ha Na KIM , Hiroshi KODAIRA , Yuichiro TANDA , Satoshi OZEKI
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
Abstract translation: 1.一种发光器件封装，包括包括第一腔和第二腔的封装体，设置在所述第一腔的底表面上的垫，设置在所述第二腔上的发光器件，电连接到所述垫，散热构件插入 散热构件包括主体和布置在主体的部分边缘区域处的扩展部分和设置在封装主体处的电极图案，其中封装体具有设置在上部的下部分的上部和下部 ，其中所述第一腔包括侧表面和底表面，其中所述第二腔设置在所述第一腔的底表面中。
-
公开(公告)号：US20140191276A1
公开(公告)日：2014-07-10
申请号：US14149547
申请日：2014-01-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Hiroshi KODAIRA , Ha Na KIM , Yuichiro TANDA , Satoshi OZEKI
IPC: H01L33/58
CPC classification number: H01L33/58 , H01L33/48 , H01L33/56 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
Abstract: Disclosed is a light emitting device package with improved light extraction efficiency. The light emitting device package includes a substrate, a light emitting device disposed on the substrate, and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm.
Abstract translation: 公开了一种具有改进的光提取效率的发光器件封装。 发光器件封装包括衬底，设置在衬底上的发光器件和设置在发光器件上方的光传输单元，光传输单元与发光器件间隔开，其中， 发光装置和光传输单元为0.15mm至0.35mm。
-
公开(公告)号：US20140084182A1
公开(公告)日：2014-03-27
申请号：US14035700
申请日：2013-09-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Bo Hee KANG , Ha Na KIM , Hiroshi KODAIRA
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.
Abstract translation: 实施例提供了一种发光器件封装，其包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件，插入封装主体中以热接触的散热构件 和发光装置，以及设置在散热构件上的抗断裂层。 抗断裂层与散热构件的至少一部分周边区域垂直重叠。
-
公开(公告)号：US20170324003A1
公开(公告)日：2017-11-09
申请号：US15319486
申请日：2015-06-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Hiroshi KODAIRA , Baek Jun KIM , Ha Na KIM , Jung Woo LEE , Sang Ung HWANG
CPC classification number: H01L33/387 , F21V7/05 , H01L33/486 , H01L33/60 , H01L51/0076 , H01L2224/48091 , H01L2224/73265 , H01L2933/0033 , H05K1/0212 , H01L2924/00014
Abstract: A light-emitting device package of the embodiments includes a package body; at least one light emitting device above the package body; an adhesive layer between the at least one light emitting device and the package body; and an adhesive-layer-accommodating portion disposed in the package body for accommodating the adhesive layer therein, wherein the adhesive-layer-accommodating portion has a side surface disposed to be inclined at a predetermined angle relative to an imaginary vertical plane that extends in a thickness direction of the package body.
-
公开(公告)号：US20170117443A1
公开(公告)日：2017-04-27
申请号：US15319318
申请日：2015-05-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok KIM , Ha Na KIM , Hiroshi KODAIRA , Baek Jun KIM , Jung Woo LEE , Sang Ung HWANG
CPC classification number: H01L33/483 , H01L33/486 , H01L33/52 , H01L33/58 , H01L2224/48091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: A light-emitting device package according to an embodiment includes a package body including a cavity and a recessed portion formed around the cavity, the recessed portion having at least one concave portion; at least one light-emitting device mounted in the cavity; a light-transmitting member disposed to cover a top of the cavity and configured to transmit light emitted from the at least one light-emitting device; and a bonding member accommodated in the at least one concave portion so as to allow the light-transmitting member and the package body to be bonded to each other in the recessed portion.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.017 seconds)
