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公开(公告)号：US20070238278A1
公开(公告)日：2007-10-11
申请号：US11278180
申请日：2006-03-31
IPC分类号： H01L21/3205
CPC分类号： H01L21/28273 , B82Y10/00 , H01L21/28282 , H01L29/6653 , H01L29/66825 , H01L29/66833
摘要： Removing a portion of a structure in a semiconductor device to separate the structure. The structure has two portions of different heights. In one example, the structure is removed by forming a spacer over the lower portion adjacent to the sidewall of the higher portion. A second material is then formed on the structure outside of the spacer. The spacer is removed and the portion under the spacer is then removed to separate the structure at that location. In one embodiment, separate channel regions are implemented in the separated structures. In other embodiments, separate gate structures are implemented in the separated structures.
摘要翻译： 去除半导体器件中的一部分结构以分离结构。 该结构具有两个不同高度的部分。 在一个示例中，通过在与较高部分的侧壁相邻的下部形成隔离物来移除结构。 然后在间隔件外部的结构上形成第二材料。 移除间隔物，然后移除间隔物下面的部分以在该位置分离结构。 在一个实施例中，在分离的结构中实现单独的通道区域。 在其他实施例中，在分离的结构中实现单独的门结构。
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公开(公告)号：US07427549B2
公开(公告)日：2008-09-23
申请号：US11278180
申请日：2006-03-31
IPC分类号： H01L21/336
CPC分类号： H01L21/28273 , B82Y10/00 , H01L21/28282 , H01L29/6653 , H01L29/66825 , H01L29/66833
摘要： Removing a portion of a structure in a semiconductor device to separate the structure. The structure has two portions of different heights. In one example, the structure is removed by forming a spacer over the lower portion adjacent to the sidewall of the higher portion. A second material is then formed on the structure outside of the spacer. The spacer is removed and the portion under the spacer is then removed to separate the structure at that location. In one embodiment, separate channel regions are implemented in the separated structures. In other embodiments, separate gate structures are implemented in the separated structures.
摘要翻译： 去除半导体器件中的一部分结构以分离结构。 该结构具有两个不同高度的部分。 在一个示例中，通过在与较高部分的侧壁相邻的下部形成隔离物来移除结构。 然后在间隔件外部的结构上形成第二材料。 移除间隔物，然后移除间隔物下面的部分以在该位置分离结构。 在一个实施例中，在分离的结构中实现单独的通道区域。 在其他实施例中，在分离的结构中实现单独的门结构。
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3.发明授权Transistor having three electrically isolated electrodes and method of formation 有权具有三个电隔离电极的晶体管和形成方法公开(公告)号：US07098502B2
公开(公告)日：2006-08-29
申请号：US10705317
申请日：2003-11-10
IPC分类号： H01L27/108 , H01L27/12 , H01L21/00 , H01L21/336
CPC分类号： H01L27/108 , B82Y10/00 , H01L21/28273 , H01L21/28282 , H01L27/10826 , H01L27/10879 , H01L27/10894 , H01L29/42332 , H01L29/66825 , H01L29/66833 , H01L29/785 , H01L29/7881
摘要： A transistor (10) is formed having three separately controllable gates (44, 42, 18). The three gate regions may be electrically biased differently and the gate regions may have different conductivity properties. The dielectrics on the channel sidewall may be different than the dielectrics on the top of the channel. Electrical contacts to source, drain and the three gates is selectively made. By including charge storage layers, such as nanoclusters, adjacent the transistor channel and controlling the charge storage layers via the three gate regions, both volatile and non-volatile memory cells are realized using the same process to create a universal memory process. When implemented as a volatile cell, the height of the transistor and the characteristics of channel sidewall dielectrics control the memory retention characteristics. When implemented as a nonvolatile cell, the width of the transistor and the characteristics of the overlying channel dielectrics control the memory retention characteristics.
摘要翻译： 晶体管（10）形成有三个可分别控制的栅极（44,42,18）。 三个栅极区域可以被不同地电偏置，并且栅极区域可以具有不同的导电性质。 通道侧壁上的电介质可以不同于通道顶部的电介质。 选择性地制造到源极，漏极和三个栅极的电接触。 通过包括与晶体管沟道相邻的电荷存储层，例如纳米团簇，并通过三个栅极区域控制电荷存储层，使用相同的过程实现易失性和非易失性存储单元，从而创建通用存储器处理。 当实现为易失性单元时，晶体管的高度和通道侧壁电介质的特性控制存储器保持特性。 当被实现为非易失性单元时，晶体管的宽度和上覆通道电介质的特性控制存储器保持特性。
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公开(公告)号：US07018876B2
公开(公告)日：2006-03-28
申请号：US10871772
申请日：2004-06-18
IPC分类号： H01L21/00 , H01L21/84 , H01L21/8238 , H01L21/336
CPC分类号： H01L21/28273 , H01L29/42324 , H01L29/66795 , H01L29/66825 , H01L29/785 , H01L29/7887
摘要： A transistor (103) with a vertical structure (113) that includes a dielectric structure (201) below a semiconductor structure (109). The semiconductor structure includes a channel region (731) and source/drain regions (707, 709). The transistor includes a gate structure (705, 703) that has a portion laterally adjacent to the semiconductor structure and a portion laterally adjacent to the dielectric structure. In one embodiment, the gate structure is a floating gate structure wherein a control gate structure (719) also includes portion laterally adjacent to the dielectric structure and a portion laterally adjacent to the semiconductor structure. In some examples, having a portion of the floating gate and a portion of the control gate adjacent to the dielectric structure acts to increase the control gate to floating gate capacitance without significantly increasing the capacitance of the floating gate to channel region.
摘要翻译： 一种具有垂直结构（113）的晶体管（103），其包括半导体结构（109）下面的电介质结构（201）。 半导体结构包括沟道区（731）和源极/漏极区（707,709）。 晶体管包括具有与半导体结构横向相邻的部分和与电介质结构横向相邻的部分的栅极结构（705,703）。 在一个实施例中，栅极结构是浮动栅极结构，其中控制栅极结构（719）还包括横向邻近电介质结构的部分和与半导体结构横向相邻的部分。 在一些示例中，具有浮置栅极的一部分和与电介质结构相邻的控制栅极的一部分用于将控制栅极增加到浮置栅极电容，而不显着增加浮置栅极到沟道区的电容。
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公开(公告)号：US06903967B2
公开(公告)日：2005-06-07
申请号：US10443908
申请日：2003-05-22
IPC分类号： G11C11/34 , G11C16/04 , H01L21/28 , H01L21/336 , H01L29/788 , H01L29/792
CPC分类号： B82Y10/00 , G11C16/0458 , G11C16/0475 , G11C2216/06 , H01L21/28273 , H01L29/66818 , H01L29/66825 , H01L29/785 , H01L29/7855 , H01L29/7887 , H01L29/7923
摘要： A memory having gate structures adjacent opposing sidewalls of a semiconductor structure including a channel region and a plurality of charge storage locations between the gate structures and the opposing sidewalls. The channel region is located between two current terminal regions, which in one example serve as the source/drain regions. A memory cell can be implemented in an array of memory cells wherein one gate structure is coupled to one word line and the other gate structure is coupled to another word line. In one example, each cell includes four charge storage locations, each for storing one bit of data.
摘要翻译： 一种存储器，其具有邻近半导体结构的相对侧壁的栅极结构，该半导体结构包括沟道区和栅极结构与相对侧壁之间的多个电荷存储位置。 沟道区域位于两个电流端子区域之间，在一个示例中，该区域用作源极/漏极区域。 存储器单元可以在存储单元的阵列中实现，其中一个栅极结构耦合到一个字线，而另一个栅极结构耦合到另一个字线。 在一个示例中，每个单元包括四个电荷存储位置，每个用于存储一位数据。
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公开(公告)号：US20050057964A1
公开(公告)日：2005-03-17
申请号：US10443908
申请日：2003-05-22
IPC分类号： G11C11/34 , G11C16/04 , H01L21/28 , H01L21/336 , H01L29/788 , H01L29/792
CPC分类号： B82Y10/00 , G11C16/0458 , G11C16/0475 , G11C2216/06 , H01L21/28273 , H01L29/66818 , H01L29/66825 , H01L29/785 , H01L29/7855 , H01L29/7887 , H01L29/7923
摘要： A memory having gate structures adjacent opposing sidewalls of a semiconductor structure including a channel region and a plurality of charge storage locations between the gate structures and the opposing sidewalls. The channel region is located between two current terminal regions, which in one example serve as the source/drain regions. A memory cell can be implemented in an array of memory cells wherein one gate structure is coupled to one word line and the other gate structure is coupled to another word line. In one example, each cell includes four charge storage locations, each for storing one bit of data.
摘要翻译： 一种存储器，其具有邻近半导体结构的相对侧壁的栅极结构，该半导体结构包括沟道区和栅极结构与相对侧壁之间的多个电荷存储位置。 沟道区域位于两个电流端子区域之间，在一个示例中，该区域用作源极/漏极区域。 存储器单元可以在存储单元的阵列中实现，其中一个栅极结构耦合到一个字线，而另一个栅极结构耦合到另一个字线。 在一个示例中，每个单元包括四个电荷存储位置，每个用于存储一位数据。
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公开(公告)号：US20090184309A1
公开(公告)日：2009-07-23
申请号：US12016733
申请日：2008-01-18
IPC分类号： H01L45/00
CPC分类号： H01L45/1675 , G11C13/0004 , H01L27/2436 , H01L45/06 , H01L45/1226 , H01L45/126 , H01L45/144
摘要： A method for forming a phase change memory cell (PCM) includes forming a heater for the phase change memory and forming a phase change structrure electrically coupled to the heater. The forming a heater includes siliciding a material including silicon to form a silicide structure, wherein the heater includes at least a portion of the silicide structure. The phase change structure exhibits a first resistive value when in a first phase state and exhibits a second resistive value when in a second phase state. The silicide structure produces heat when current flows through the silicide structure for changing the phase state of the phase change structure.
摘要翻译： 形成相变存储单元（PCM）的方法包括形成用于相变存储器的加热器，并形成电耦合到加热器的相变结构。 形成加热器包括将包括硅的材料硅化以形成硅化物结构，其中加热器包括至少一部分硅化物结构。 当处于第一相位状态时，相变结构呈现第一电阻值，并且当处于第二相位状态时呈现第二电阻值。 当电流流过硅化物结构以改变相变结构的相位状态时，硅化物结构产生热量。
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8.发明授权公开(公告)号：US07109550B2
公开(公告)日：2006-09-19
申请号：US11036860
申请日：2005-01-13
IPC分类号： H01L29/792
CPC分类号： H01L29/66659 , H01L21/26586 , H01L21/823468 , H01L29/665 , H01L29/6656 , H01L29/6659 , H01L29/7833 , H01L29/7835 , H01L29/7842 , Y10S257/90
摘要： A semiconductor process and resulting transistor includes forming conductive extension spacers (146, 150) on either side of a gate electrode (116). Conductive extensions (146, 150) and gate electrode 116 are independently doped such that each of the structures may be n-type or p-type. Source/drain regions (156) are implanted laterally disposed on either side of the spacers (146, 150). Spacers (146, 150) may be independently doped by using a first angled implant (132) to dope first extension spacer (146) and a second angled implant (140) to dope second spacer (150). In one embodiment, the use of differently doped extension spacers (146, 150) eliminates the need for threshold adjustment channel implants.
摘要翻译： 半导体工艺和所得晶体管包括在栅电极（116）的任一侧上形成导电延伸间隔物（146,150）。 导电延伸部（146,150）和栅电极116被独立地掺杂，使得每个结构可以是n型或p型。 源极/漏极区域（156）被植入在间隔物（146,150）的任一侧上。 间隔物（146,150）可以通过使用第一成角度的植入物（132）来掺杂第一延伸间隔物（146）和第二成角度的植入物（140）以掺杂第二间隔物（150）来独立地掺杂。 在一个实施例中，使用不同掺杂的延伸间隔物（146,150）消除了对阈值调整通道植入物的需要。
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9.发明授权Method of making a phase change memory cell having a silicide heater in conjunction with a FinFET 有权制造具有与FinFET结合的硅化物加热器的相变存储单元的方法公开(公告)号：US08563355B2
公开(公告)日：2013-10-22
申请号：US12016739
申请日：2008-01-18
IPC分类号： H01L21/06
CPC分类号： H01L27/2436 , H01L29/785 , H01L45/06 , H01L45/1226 , H01L45/126 , H01L45/144 , H01L45/1675
摘要： A phase change memory (PCM) cell includes a transistor, a PCM structure, and a heater. The transistor has a first current electrode and a second current electrode in a structure, and a channel region having a first portion along a first sidewall of the structure and having a second portion along a second sidewall of the structure. The second sidewall is opposite the first sidewall. The transistor has a control electrode that has a first portion adjacent to the first sidewall and a second portion adjacent to the second sidewall. The PCM structure exhibits first and second resistive values when in first and second phase states, respectively. The heater is on the structure and produces heat when current flows through the heater for changing the phase state of the phase change structure.
摘要翻译： 相变存储器（PCM）单元包括晶体管，PCM结构和加热器。 晶体管具有结构中的第一电流电极和第二电流电极，以及具有沿着结构的第一侧壁的第一部分并且具有沿着结构的第二侧壁的第二部分的沟道区域。 第二侧壁与第一侧壁相对。 晶体管具有控制电极，该控制电极具有与第一侧壁相邻的第一部分和与第二侧壁相邻的第二部分。 当分别处于第一和第二相位状态时，PCM结构呈现出第一和第二电阻值。 当电流流过加热器以改变相变结构的相位状态时，加热器在结构上并产生热量。
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公开(公告)号：US07820491B2
公开(公告)日：2010-10-26
申请号：US11620075
申请日：2007-01-05
CPC分类号： H01L27/105 , H01L21/84 , H01L27/112 , H01L27/11206 , H01L27/11517 , H01L27/1203 , H01L27/15 , H01L29/66825 , H01L29/788
摘要： A semiconductor device has a semiconductor substrate that in turn has a top semiconductor layer portion and a major supporting portion under the top semiconductor layer portion. An interconnect layer is over the semiconductor layer. A memory array is in a portion of the top semiconductor layer portion and a portion of the interconnect layer. The memory is erased by removing at least a portion of the major supporting portion and, after the step of removing, applying light to the memory array from a side opposite the interconnect layer. The result is that the memory array receives light from the backside and is erased.
摘要翻译： 半导体器件具有半导体衬底，其又具有顶部半导体层部分和顶部半导体层部分下方的主要支撑部分。 互连层在半导体层之上。 存储器阵列位于顶部半导体层部分和互连层的一部分中。 通过去除主要支撑部分的至少一部分并且在移除步骤之后，从与互连层相对的一侧将光施加到存储器阵列来擦除存储器。 结果是存储器阵列从背面接收光并被擦除。
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