利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

12 条记录 (耗时 0.019 秒)

    Methods for manufacture a capacitor with three-dimensional high surface area electrodes
    1.
    发明授权
    Methods for manufacture a capacitor with three-dimensional high surface area electrodes 有权
    制造具有三维高表面积电极的电容器的方法

    公开(公告)号：US08561271B2

    公开(公告)日：2013-10-22

    申请号：US12969186

    申请日：2010-12-15

    申请人： Liang Chai ,  Alan Rae ,  James M Wison

    发明人： Liang Chai ,  Alan Rae ,  James M Wison

    IPC分类号： H01G4/10

    CPC分类号： H01G4/10 ,  H01G4/005 ,  H01G4/008 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/30 ,  Y10T29/43 ,  Y10T29/435

    摘要： A method for making a capacitor having improved capacitance efficiency which results from increasing the effective area of an electrode surface is disclosed. Specifically, an improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer. Advantageously, embodiments of a three-dimensional capacitor drastically reduce the space footprint that is required in a circuit to accommodate the capacitor, when compared to current capacitor designs. Increased capacitance density may be realized without using high k (high constant) dielectric materials, additional “electrode-dielectric-electrode” arrangements in an ever increasing stack, or serially stringing together multiple capacitors.

    摘要翻译： 公开了一种通过增加电极表面的有效面积制造具有提高的电容效率的电容器的方法。 具体地说，改进的“三维”电容器可以由与电介质接合点的三维方面的电极层构成，使得电极的一部分延伸到电介质层中。 有利的是，与当前的电容器设计相比，三维电容器的实施例大大减少了电路中所需的容纳电容器的空间足迹。 可以在不使用高k（高常数）电介质材料的情况下实现增加的电容密度，而在不断增加的叠层中使用附加的“电极 - 电介质电极”布置，或者串联连接多个电容器。

    Capacitor with Three-Dimensional High Surface Area Electrode and Methods of Manufacture
    2.
    发明申请
    Capacitor with Three-Dimensional High Surface Area Electrode and Methods of Manufacture 有权
    具有三维高表面积电极的电容器及其制造方法

    公开(公告)号：US20110310528A1

    公开(公告)日：2011-12-22

    申请号：US12969186

    申请日：2010-12-15

    申请人： Liang Chai ,  Alan Rae ,  Jim Wilson

    发明人： Liang Chai ,  Alan Rae ,  Jim Wilson

    IPC分类号： H01G4/06 ,  H01G7/00

    CPC分类号： H01G4/10 ,  H01G4/005 ,  H01G4/008 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/30 ,  Y10T29/43 ,  Y10T29/435

    摘要： A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer. Advantageously, embodiments of a three-dimensional capacitor drastically reduce the space footprint that is required in a circuit to accommodate the capacitor, when compared to current capacitor designs. Increased capacitance density may be realized without using high k (high constant) dielectric materials, additional “electrode-dielectric-electrode” arrangements in an ever increasing stack, or serially stringing together multiple capacitors.

    摘要翻译： 公开了一种电容器及其制造方法，其具有由于增加电极表面的有效面积而提高的电容效率。 可以在与电介质的界面点处具有三维方面的电极层来构造改进的“三维”电容器，使得电极的一部分延伸到电介质层中。 有利的是，与当前的电容器设计相比，三维电容器的实施例大大减少了电路中所需的容纳电容器的空间足迹。 可以在不使用高k（高常数）电介质材料的情况下实现增加的电容密度，而在不断增加的叠层中使用附加的“电极 - 电介质电极”布置，或者串联连接多个电容器。

    ELECTRONIC DEVICES WITH INTERNAL MOISTURE RESISTANT COATINGS
    6.
    发明申请
    ELECTRONIC DEVICES WITH INTERNAL MOISTURE RESISTANT COATINGS 审中-公开
    具有内部防潮涂层的电子设备

    公开(公告)号：US20130176700A1

    公开(公告)日：2013-07-11

    申请号：US13735862

    申请日：2013-01-07

    申请人： Blake Stevens ,  Max Sorenson ,  Alan Rae ,  Marc Chason

    发明人： Blake Stevens ,  Max Sorenson ,  Alan Rae ,  Marc Chason

    IPC分类号： H05K1/18 ,  H05K13/00

    CPC分类号： H05K3/284 ,  H01L2224/16225 ,  H05K1/185 ,  H05K13/00 ,  H05K2201/09872 ,  Y10T29/49002 ,  Y10T29/49117

    摘要： A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant-coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.

    摘要翻译： 防潮电子设备包括至少一部分至少部分被防潮涂层覆盖的电子部件。 防潮涂层可以位于电子设备的内部。 防潮涂层可以仅覆盖电子设备内的内部空间的边界的一部分。 防潮涂层可以包括一个或多个可辨别的边界或接缝，其可以位于电子设备的两个或更多个部件彼此接合的位置处或邻近位置处。 还公开了装配方法。