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1.发明授权Method for making three-dimensional liquid crystal polymer multilayer circuit boards 有权制备三维液晶聚合物多层电路板的方法公开(公告)号：US08778124B2
公开(公告)日：2014-07-15
申请号：US12016060
申请日：2008-01-17
IPC分类号： B32B37/00
CPC分类号： H05K3/0014 , H01H2219/01 , H05K1/0284 , H05K1/185 , H05K3/4611 , H05K2201/0141 , H05K2201/091 , H05K2203/1105 , H05K2203/302
摘要： A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.
摘要翻译： 一种制造非平面三维（3D）多层电路板的方法。 该方法可以包括形成包括至少一对液晶聚合物（LCP）层的层叠布置，其间具有结合层。 所述堆叠布置还可包括至少一个LCP层上的至少一个导电图案层。 该方法还可以包括加热和施加压力到堆叠的布置以将堆叠布置形成非平面3D形状并且同时使结合层将堆叠布置的相邻LCP层结合在一起，从而形成非平面3D 多层电路板。
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2.发明申请公开(公告)号：US20090185357A1
公开(公告)日：2009-07-23
申请号：US12016089
申请日：2008-01-17
申请人： Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Paul Brian Jaynes , Philip Anthony Marvin
发明人： Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Paul Brian Jaynes , Philip Anthony Marvin
CPC分类号： H01H13/704 , H01H11/00 , H05K1/0284 , H05K3/303 , H05K3/4614 , H05K3/4626 , H05K3/4632 , H05K2201/0141 , H05K2201/091 , Y10T29/49107 , Y10T29/4913
摘要： An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.
摘要翻译： 电子设备包括具有在其中限定薄膜开关凹部的非平面三维形状的多层电路板。 多层电路板可以包括至少一个液晶聚合物（LCP）层和至少一个导电图案层，其上限定了与薄膜开关凹部相邻的至少一个薄膜开关电极以限定薄膜开关。 电子器件还可以包括填充薄膜开关凹部的可压缩电介质材料。 电子设备还可以包括膜开关凹部内的至少一个弹簧构件。
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3.发明申请METHOD FOR MAKING THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARDS 有权制备三维液晶聚合物多层电路板的方法公开(公告)号：US20090183829A1
公开(公告)日：2009-07-23
申请号：US12016060
申请日：2008-01-17
CPC分类号： H05K3/0014 , H01H2219/01 , H05K1/0284 , H05K1/185 , H05K3/4611 , H05K2201/0141 , H05K2201/091 , H05K2203/1105 , H05K2203/302
摘要： A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.
摘要翻译： 一种制造非平面三维（3D）多层电路板的方法。 该方法可以包括形成包括至少一对液晶聚合物（LCP）层的层叠布置，其间具有结合层。 所述堆叠布置还可包括至少一个LCP层上的至少一个导电图案层。 该方法还可以包括加热和施加压力到堆叠的布置以将堆叠布置形成非平面3D形状并且同时使结合层将堆叠布置的相邻LCP层结合在一起，从而形成非平面3D 多层电路板。
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4.发明授权公开(公告)号：US09117602B2
公开(公告)日：2015-08-25
申请号：US12016089
申请日：2008-01-17
申请人： Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Paul Brian Jaynes , Philip Anthony Marvin
发明人： Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Paul Brian Jaynes , Philip Anthony Marvin
IPC分类号： H05K1/03 , H05K1/09 , H01H13/704 , H05K1/02 , H05K3/46
CPC分类号： H01H13/704 , H01H11/00 , H05K1/0284 , H05K3/303 , H05K3/4614 , H05K3/4626 , H05K3/4632 , H05K2201/0141 , H05K2201/091 , Y10T29/49107 , Y10T29/4913
摘要： An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.
摘要翻译： 电子设备包括具有在其中限定薄膜开关凹部的非平面三维形状的多层电路板。 多层电路板可以包括至少一个液晶聚合物（LCP）层和至少一个导电图案层，其上限定了与薄膜开关凹部相邻的至少一个薄膜开关电极以限定薄膜开关。 电子器件还可以包括填充薄膜开关凹部的可压缩电介质材料。 电子设备还可以包括膜开关凹部内的至少一个弹簧构件。
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5.发明授权Method for making electrical structure with air dielectric and related electrical structures 有权用空气电介质和相关电气结构制造电气结构的方法公开(公告)号：US09142497B2
公开(公告)日：2015-09-22
申请号：US13253388
申请日：2011-10-05
申请人： Michael Raymond Weatherspoon , Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
发明人： Michael Raymond Weatherspoon , Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
IPC分类号： H05K3/36 , H05K3/46 , H01L23/498 , H01L21/48 , H01L23/66
CPC分类号： H01P3/121 , H01L21/4846 , H01L23/498 , H01L23/66 , H01L2223/6627 , H01L2924/0002 , H05K3/4614 , H05K3/4697 , H05K2201/0141 , H05K2203/016 , H05K2203/308 , H01L2924/00
摘要： A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
摘要翻译： 已经描述了一种用于制造具有空气电介质的电结构的方法，并且包括形成包括牺牲衬底的第一子单元，在牺牲衬底上包括第一金属的导电层和牺牲衬底上的牺牲电介质层， 导电层。 该方法还包括在其上形成包括电介质层和其上的导电层的第二子单元，其上包括第一金属，并且将第二金属涂覆到第一和第二子单元中的一个或多个的第一金属上。 该方法还包括将第一和第二子单元对齐在一起，加热和压制对准的第一和第二子单元以形成将相邻金属部分粘合在一起的第一和第二金属的金属间化合物，以及去除牺牲基底和牺牲介电层从而形成 电气结构具有空气电介质。
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公开(公告)号：US20130120095A1
公开(公告)日：2013-05-16
申请号：US13293671
申请日：2011-11-10
申请人： Michael Raymond Weatherspoon , Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
发明人： Michael Raymond Weatherspoon , Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
CPC分类号： H01F27/2804 , H01F5/00 , H01F17/0006 , H01F41/041 , H01F2017/0046 , H01F2017/0073 , H05K1/165 , H05K3/146 , H05K3/16 , H05K3/20 , H05K2201/0141 , H05K2201/0305 , H05K2201/1003 , H05K2203/016 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49075
摘要： A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.
摘要翻译： 一种制造电感器的方法。 该方法包括形成具有牺牲衬底的第一子单元和限定电感器并且在牺牲衬底上包括第一金属的导电层。 该方法包括形成具有电介质层和导电层的第二子单元，其上限定电感器端子并具有第一金属，并且将第二金属涂覆到第一和第二子单元之一的第一金属上。 该方法包括将第一和第二子单元对齐在一起，加热和压缩对准的第一和第二子单元以形成将相邻金属部分粘合在一起的第一和第二金属的金属间化合物，以及去除牺牲基板。
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公开(公告)号：US20110095720A1
公开(公告)日：2011-04-28
申请号：US12607472
申请日：2009-10-28
CPC分类号： H01M10/465 , H01M4/525 , H01M4/5825 , H01M10/0436 , H01M10/0562 , H01M10/0585 , Y10T29/49108
摘要： A micro electrical-mechanical systems (MEMS) device INCLUDES a MEMS substrate and at least one MEMS structure on the MEMS substrate. In addition, there is at least one battery cell on the MEMS substrate coupled to the at least one MEMS structure. The at least one battery cell includes a support fin extending vertically upward from the MEMS substrate and a first electrode layer on the support fin. In addition, there is an electrolyte layer on the cathode layer, and a second electrode layer on the electrolyte layer. The support fin may have a height greater than a width. The first electrode layer may have a processing temperature associated therewith that exceeds a stability temperature associated with the second electrode layer.
摘要翻译： 微机电系统（MEMS）装置包括MEMS基板和MEMS基板上的至少一个MEMS结构。 此外，在MEMS衬底上存在至少一个耦合到至少一个MEMS结构的电池单元。 所述至少一个电池单元包括从所述MEMS基板垂直向上延伸的支撑翅片和所述支撑翅片上的第一电极层。 此外，阴极层上存在电解质层，电解质层上具有第二电极层。 支撑翅片可以具有高于宽度的高度。 第一电极层可以具有与其相关联的处理温度，其超过与第二电极层相关联的稳定性温度。
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8.发明授权Method to make a multilayer circuit board with intermetallic compound and related circuit boards 有权制造具有金属间化合物和相关电路板的多层电路板的方法公开(公告)号：US08904632B2
公开(公告)日：2014-12-09
申请号：US13242155
申请日：2011-09-23
申请人： Michael Raymond Weatherspoon , Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Casey P. Rodriguez
发明人： Michael Raymond Weatherspoon , Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Casey P. Rodriguez
CPC分类号： H05K1/0298 , H05K1/09 , H05K1/116 , H05K3/429 , H05K3/4614 , H05K2201/0141 , H05K2201/09545 , H05K2203/061 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.
摘要翻译： 一种用于从电路板层制造多层电路板的方法，每个电路板包括介电层和其上包括第一金属的导电迹线。 该方法包括在第一电路板层中形成通孔，将通孔与第一金属电镀，并将第二金属涂覆在第一电路板层的第一金属上，镀通孔和第一金属 金属。 该方法还包括将第一和第二电路板层对准在一起，使得第一电路板层的电镀通孔与第二电路板层上的特征相邻，并且加热并压紧对准的第一和第二电路板层 以将电介质层层叠在一起，并将相邻的金属部分结合在一起的第一和第二金属的金属间化合物。
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9.发明申请METHOD FOR MAKING ELECTRICAL STRUCTURE WITH AIR DIELECTRIC AND RELATED ELECTRICAL STRUCTURES 有权用于制造具有空气介质和相关电气结构的电气结构的方法公开(公告)号：US20130087365A1
公开(公告)日：2013-04-11
申请号：US13253388
申请日：2011-10-05
申请人： Michael Raymond Weatherspoon , Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
发明人： Michael Raymond Weatherspoon , Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
CPC分类号： H01P3/121 , H01L21/4846 , H01L23/498 , H01L23/66 , H01L2223/6627 , H01L2924/0002 , H05K3/4614 , H05K3/4697 , H05K2201/0141 , H05K2203/016 , H05K2203/308 , H01L2924/00
摘要： A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
摘要翻译： 已经描述了一种用于制造具有空气电介质的电结构的方法，并且包括形成包括牺牲衬底的第一子单元，在牺牲衬底上包括第一金属的导电层和牺牲衬底上的牺牲电介质层， 导电层。 该方法还包括在其上形成包括电介质层和其上的导电层的第二子单元，其上包括第一金属，并且将第二金属涂覆到第一和第二子单元中的一个或多个的第一金属上。 该方法还包括将第一和第二子单元对齐在一起，加热和压制对准的第一和第二子单元以形成将相邻金属部分粘合在一起的第一和第二金属的金属间化合物，以及去除牺牲基底和牺牲介电层从而形成 电气结构具有空气电介质。
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10.发明申请METHOD TO MAKE A MULTILAYER CIRCUIT BOARD WITH INTERMETALLIC COMPOUND AND RELATED CIRCUIT BOARDS 有权制造具有互联化合物和相关电路板的多层电路板的方法公开(公告)号：US20130075137A1
公开(公告)日：2013-03-28
申请号：US13242155
申请日：2011-09-23
申请人： Michael Raymond Weatherspoon , Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Casey P. Rodriguez
发明人： Michael Raymond Weatherspoon , Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Casey P. Rodriguez
CPC分类号： H05K1/0298 , H05K1/09 , H05K1/116 , H05K3/429 , H05K3/4614 , H05K2201/0141 , H05K2201/09545 , H05K2203/061 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.
摘要翻译： 一种用于从电路板层制造多层电路板的方法，每个电路板包括介电层和其上包括第一金属的导电迹线。 该方法包括在第一电路板层中形成通孔，将通孔与第一金属电镀，并将第二金属涂覆在第一电路板层的第一金属上，镀通孔和第一金属 金属。 该方法还包括将第一和第二电路板层对准在一起，使得第一电路板层的电镀通孔与第二电路板层上的特征相邻，并且加热并压紧对准的第一和第二电路板层 以将电介质层层叠在一起，并将相邻的金属部分结合在一起的第一和第二金属的金属间化合物。
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