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公开(公告)号：US08324602B2
公开(公告)日：2012-12-04
申请号：US12643831
申请日：2009-12-21
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
CPC分类号： H01L25/167 , H01L31/02325 , H01L2224/49171 , H01L2924/3011 , H01L2924/00
摘要： An optical sensor device, according to an embodiment of the present invention, includes a light source and a light detector. The light source includes one or more light emitting elements, and the light detector includes one or more light detecting elements. A first opaque light barrier portion, between the light source and the light detector, is configured to block light from being transmitted directly from the light source to the light detector. A second opaque light barrier portion, extending from the first opaque light barrier portion in a direction towards the light source, is configured to reduce an amount of specular reflections that would occur if a light transmissive cover plate were placed over the optical sensor device. A third opaque light barrier portion, extending from the first light barrier portion in a direction towards to the light detector, is configured to reduce an amount of specular reflections that would be detected by the light detector, if a light transmissive cover plate were placed over the optical sensor device.
摘要翻译： 根据本发明的实施例的光学传感器装置包括光源和光检测器。 光源包括一个或多个发光元件，并且光检测器包括一个或多个光检测元件。 在光源和光检测器之间的第一不透明光阻挡部分被配置为阻止光直接从光源传输到光检测器。 第二不透明光阻挡部分从第一不透明光阻挡部分朝向光源的方向延伸，被配置为减少如果透光盖板放置在光学传感器装置上方将会发生的镜面反射量。 第三不透明光阻挡部分从第一光阻挡部分朝向光检测器的方向延伸，被配置为减少光检测器将检测到的镜面反射量，如果透光盖板放置在 光学传感器装置。
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公开(公告)号：US08232541B2
公开(公告)日：2012-07-31
申请号：US12499723
申请日：2009-07-08
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
CPC分类号： H01L25/167 , H01L33/58 , H01L2224/49171
摘要： An optical sensor device comprises a light source, a light detector, and an opaque light barrier including a first portion to block light from being transmitted directly from the source to the detector. A second portion of the light barrier extends from the first portion in a direction towards the light source, such that a portion of the second portion covers at least a portion of light emitting element(s) of the source, to reduce an amount of specular reflections, if a light transmissive cover plate were placed over the sensor. Additionally, a third portion of the barrier can extend from the first portion, in a direction towards to the detector, such that a portion of the third portion covers at least a portion of light detecting element(s) of the detector, to reduce an amount of specular reflections that would be detected by the detecting element(s) of the detector, if a light transmissive cover plate were placed over the sensor. Additionally, an off-centered lens can cover a portion of the light source.
摘要翻译： 光学传感器装置包括光源，光检测器和不透明光栅，其包括第一部分，以阻止光从源直接传输到检测器。 光栅的第二部分从第一部分朝向光源的方向延伸，使得第二部分的一部分覆盖源的发光元件的至少一部分，以减少镜面的量 如果将透光盖板放置在传感器上方，则会产生反射。 此外，屏障的第三部分可以从朝向检测器的方向从第一部分延伸，使得第三部分的一部分覆盖检测器的光检测元件的至少一部分，以减少 如果将透光盖板放置在传感器上方，则由检测器的检测元件检测到的镜面反射量。 此外，偏心透镜可以覆盖光源的一部分。
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公开(公告)号：US20100258710A1
公开(公告)日：2010-10-14
申请号：US12643831
申请日：2009-12-21
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
IPC分类号： H01L31/12 , H01L27/14 , H01L31/0232 , H01L21/50 , H01L31/18
CPC分类号： H01L25/167 , H01L31/02325 , H01L2224/49171 , H01L2924/3011 , H01L2924/00
摘要： An optical sensor device, according to an embodiment of the present invention, includes a light source and a light detector. The light source includes one or more light emitting elements, and the light detector includes one or more light detecting elements. A first opaque light barrier portion, between the light source and the light detector, is configured to block light from being transmitted directly from the light source to the light detector. A second opaque light barrier portion, extending from the first opaque light barrier portion in a direction towards the light source, is configured to reduce an amount of specular reflections that would occur if a light transmissive cover plate were placed over the optical sensor device. A third opaque light barrier portion, extending from the first light barrier portion in a direction towards to the light detector, is configured to reduce an amount of specular reflections that would be detected by the light detector, if a light transmissive cover plate were placed over the optical sensor device.
摘要翻译： 根据本发明的实施例的光学传感器装置包括光源和光检测器。 光源包括一个或多个发光元件，并且光检测器包括一个或多个光检测元件。 在光源和光检测器之间的第一不透明光阻挡部分被配置为阻止光直接从光源传输到光检测器。 第二不透明光阻挡部分从第一不透明光阻挡部分朝向光源的方向延伸，被配置为减少如果透光盖板放置在光学传感器装置上方将会发生的镜面反射量。 第三不透明光阻挡部分从第一光阻挡部分朝向光检测器的方向延伸，被配置为减少光检测器将检测到的镜面反射量，如果透光盖板放置在 光学传感器装置。
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公开(公告)号：US20100258712A1
公开(公告)日：2010-10-14
申请号：US12499723
申请日：2009-07-08
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
IPC分类号： H01L31/0232 , H01L33/00 , H01L21/00
CPC分类号： H01L25/167 , H01L33/58 , H01L2224/49171
摘要： An optical sensor device comprises a light source, a light detector, and an opaque light barrier including a first portion to block light from being transmitted directly from the source to the detector. A second portion of the light barrier extends from the first portion in a direction towards the light source, such that a portion of the second portion covers at least a portion of light emitting element(s) of the source, to reduce an amount of specular reflections, if a light transmissive cover plate were placed over the sensor. Additionally, a third portion of the barrier can extend from the first portion, in a direction towards to the detector, such that a portion of the third portion covers at least a portion of light detecting element(s) of the detector, to reduce an amount of specular reflections that would be detected by the detecting element(s) of the detector, if a light transmissive cover plate were placed over the sensor. Additionally, an off-centered lens can cover a portion of the light source.
摘要翻译： 光学传感器装置包括光源，光检测器和不透明光栅，其包括第一部分，以阻止光从源直接传输到检测器。 光栅的第二部分从第一部分朝向光源的方向延伸，使得第二部分的一部分覆盖源的发光元件的至少一部分，以减少镜面的量 如果将透光盖板放置在传感器上方，则会产生反射。 此外，屏障的第三部分可以从朝向检测器的方向从第一部分延伸，使得第三部分的一部分覆盖检测器的光检测元件的至少一部分，以减少 如果将透光盖板放置在传感器上方，则由检测器的检测元件检测到的镜面反射量。 此外，偏心透镜可以覆盖光源的一部分。
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公开(公告)号：US20100259766A1
公开(公告)日：2010-10-14
申请号：US12499693
申请日：2009-07-08
申请人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
发明人： Lynn K. Wiese , Nikhil Kelkar , Viraj Patwardhan
CPC分类号： H01L25/167 , H01L33/58 , H01L2224/49171
摘要： Provided herein are optical sensor devices, methods for making the same, and systems including the same. An optical sensor device, according to an embodiment, includes a light detector die and a light source die attached to the same or different die attachment substrates so that there is a space between the light source die and the light detector die. A light transmissive material covers the light detector die, the light source die and at least a portion of the space between the light detector die and the light source die. A groove is formed (e.g., saw, blade or laser cut, or cast) in the light transmissive material between the light detector die and the light source die, and an opaque material is put within the groove to provide a light barrier between the light detector die and the light source die.
摘要翻译： 本文提供了光学传感器装置及其制造方法，以及包括该传感器装置的系统。 根据实施例的光学传感器装置包括光检测器管芯和附接到相同或不同的管芯附接衬底的光源管芯，使得在光源管芯和光检测器管芯之间存在空间。 透光材料覆盖光检测器管芯，光源管芯和光检测器管芯与光源管芯之间的至少一部分空间。 在光检测器管芯和光源管芯之间的透光材料中形成凹槽（例如，锯，刀片或激光切割或铸造），并且将不透明材料放置在凹槽内以在光线之间提供光屏障 检测器管芯和光源管芯。
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公开(公告)号：USRE36446E
公开(公告)日：1999-12-14
申请号：US118747
申请日：1998-07-17
申请人： Marvin Lumbard , Lynn K. Wiese
发明人： Marvin Lumbard , Lynn K. Wiese
CPC分类号： H01L33/486 , G09F9/33 , H01L24/97 , H01L33/54 , H05K3/3442 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L25/0753 , H01L2924/12041 , H01L2924/14 , H05K2201/09181 , H05K2201/10106 , H05K2201/10128 , Y02P70/613 , Y10T29/49146 , Y10T29/49165
摘要： Processing techniques for various modular components provide various surface mount structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.
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7.发明申请公开(公告)号：US20130221380A1
公开(公告)日：2013-08-29
申请号：US13460594
申请日：2012-04-30
CPC分类号： H01L33/56 , H01L25/0753 , H01L33/54 , H01L33/60 , H01L2224/48247 , H01L2224/48465 , H01L2924/12044 , H01L2924/00
摘要： A method for manufacturing a plurality of optoelectronic apparatuses include attaching bottom surfaces of a plurality of packaged optoelectronic semiconductor devices (POSDs) to a carrier substrate (e.g., a tape) so that there is a space between each POSD and its one or more neighboring POSD(s). A light reflective molding compound is molded around a portion each of the POSDs attached to the carrier substrate so that a reflector cup is formed from the light reflective molding compound for each of the POSDs. The light reflective molding compound can also attach the POSDs to one another. Alternatively, an opaque molding compound can be molded around each POSD/reflector cup to attach the POSDs/reflector cups to one another and form a light barrier between each POSD and its neighboring POSD(s). The carrier substrate is thereafter removed so that electrical contacts on the bottom surfaces of the POSDs are exposed.
摘要翻译： 一种用于制造多个光电子装置的方法包括将多个封装的光电子半导体器件（POSD）的底表面附接到载体衬底（例如，磁带），使得每个POSD与其一个或多个相邻POSD之间存在空间 （s）。 围绕贴附于载体基板的每个POSD的部分模制光反射模塑料，从而为每个POSD的光反射模塑料形成反射杯。 光反射模塑料也可以将POSD相互连接起来。 或者，可以在每个POSD /反射杯周围模制不透明模塑料，以将POSD /反射杯彼此附接，并在每个POSD及其相邻POSD之间形成光屏障。 然后移除载体基板，使得POSD的底表面上的电接触被暴露。
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公开(公告)号：USRE36614E
公开(公告)日：2000-03-14
申请号：US120591
申请日：1998-07-17
申请人： Marvin Lumbard , Lynn K. Wiese
发明人： Marvin Lumbard , Lynn K. Wiese
CPC分类号： H05K3/3442 , G09F9/33 , H01L33/54 , H01L2224/48091 , H01L2224/48227 , H01L33/486 , H05K2201/09181 , H05K2201/10106 , H05K2201/10128 , Y02P70/613
摘要： Processing techniques for various surface mount modular components provide various structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.
摘要翻译： 用于各种表面贴装模块化部件的处理技术为单个装置部件（10）和适合作为字符显示器的多个装置部件（图6和7）提供各种结构。 具有在两侧图案化的基板材料板12的技术。 形成将后侧端子（19,20）连接到前侧连接条（22,24）的通孔（33,43）。 设备（15,16）安装在陆地区域（13,34）上，并且引线键合到连接焊盘（14）。 前侧涂有环氧树脂以将器件封装在具有形成为可选透镜（262,263）的外表面的层中。 然后将板坯分离以提供模块化部件。
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9.发明授权公开(公告)号：US08564012B2
公开(公告)日：2013-10-22
申请号：US13431466
申请日：2012-03-27
IPC分类号： H01L33/00
CPC分类号： H01L21/568 , G01S7/4811 , G01S17/026 , H01L23/3185 , H01L24/97 , H01L31/0203 , H01L2224/32245 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing an optoelectronic apparatus includes attaching bottom surfaces of first and second packaged optoelectronic semiconductor devices (POSDs) to a carrier substrate (e.g., a tape) so that there is a space between the first and second POSDs. An opaque molding compound is molded around portions of the first and second POSDs attached to the carrier substrate, so that peripheral surfaces of the first POSD and the second POSD are surrounded by the opaque molding compound, the space between the first and second POSDs is filled with the opaque molding compound, and the first and second POSDs are attached to one another by the opaque molding compound. The carrier substrate is thereafter removed so that electrical contacts on the bottom surfaces of the first and second POSDs are exposed. A window for each of the POSDs is formed during the molding process or thereafter.
摘要翻译： 一种制造光电子器件的方法包括将第一和第二封装的光电子半导体器件（POSD）的底表面附接到载体衬底（例如，带），使得在第一和第二POSD之间存在空间。 在附着于载体基板的第一POSD和第二POSD的部分上模制不透明的模塑料，使得第一POSD和第二POSD的周边表面被不透明的模塑料包围，填充第一POSD和第二POSD之间的空间 与不透明的模塑料，并且第一和第二POSD通过不透明的模塑料相互连接。 之后移除载体衬底，使第一和第二POSD的底表面上的电接触被暴露。 在成型过程中或之后形成每个POSD的窗口。
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公开(公告)号：US4890383A
公开(公告)日：1990-01-02
申请号：US338720
申请日：1989-04-14
申请人： Marvin Lumbard , Lynn K. Wiese
发明人： Marvin Lumbard , Lynn K. Wiese
IPC分类号： G09F9/33 , H01L25/075 , H01L33/48 , H01L33/54 , H05K3/34
CPC分类号： H01L33/486 , G09F9/33 , H01L24/97 , H01L33/54 , H05K3/3442 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L25/0753 , H01L2924/12041 , H01L2924/14 , H05K2201/09181 , H05K2201/10106 , H05K2201/10128 , Y02P70/613 , Y10T29/49146 , Y10T29/49165
摘要： Processing techniques for various modular components provide various surface mount structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.
摘要翻译： 用于各种模块化部件的处理技术为单个装置部件（10）和适合作为字符显示器的多个装置部件（图6和7）提供各种表面安装结构。 具有在两侧图案化的基板材料板12的技术。 形成将后侧端子（19,20）连接到前侧连接条（22,24）的通孔（33,43）。 设备（15,16）安装在陆地区域（13,34）上，并且引线键合到连接焊盘（14）。 前侧涂有环氧树脂以将器件封装在具有形成为可选透镜（262,263）的外表面的层中。 然后将板坯分离以提供模块化部件。
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