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公开(公告)号：US20190306969A1
公开(公告)日：2019-10-03
申请号：US16346611
申请日：2016-12-26
摘要： Lossy members, which are disposed to overlap with a part of branch conductors in a signal conductor, respectively, and cause a loss of the power of signals flowing in the branch conductors, and via holes connecting each of the output terminals of the signal conductor and the ground conductor are included. The branch conductor includes a delay circuit having an electrical length of 90 degrees.
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公开(公告)号：US20210134733A1
公开(公告)日：2021-05-06
申请号：US16491767
申请日：2018-02-22
IPC分类号： H01L23/552 , H01L23/66 , H01L23/36 , H01L23/538
摘要： A microwave device includes: a multilayer resin substrate being a first multilayer resin substrate; an IC being a radio frequency circuit provided on the multilayer resin substrate and electrically connected to the multilayer resin substrate; a heat spreader provided on a side opposite to the multilayer resin substrate across the IC, and in contact with the IC; a mold resin covering the periphery of the IC and the heat spreader; and a conductive film covering the mold resin and the heat spreader, where an inner side of the conductive film is in contact with the heat spreader, and the conductive film is electrically connected to a ground via hole of the multilayer resin substrate.
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公开(公告)号：US20240266715A1
公开(公告)日：2024-08-08
申请号：US18562837
申请日：2021-05-26
发明人： Makoto KIMURA , Yukinobu TARUI , Shunichi ABE , Takumi NAGAMINE
IPC分类号： H01Q1/22 , H01L23/00 , H01L23/367 , H01L23/552 , H01L25/10 , H01Q21/06
CPC分类号： H01Q1/2283 , H01L23/367 , H01L25/105 , H01Q21/065 , H01L23/552 , H01L24/16 , H01L2224/16227
摘要： A microwave module includes a plurality of microwave devices and a microwave module substrate. Each of the plurality of microwave devices exchanges a signal with a corresponding one of a plurality of antenna elements. The microwave module substrate includes a mounting surface on which the plurality of microwave devices are mounted. The microwave module substrate is electrically connected to each of the plurality of antenna elements. The mounting surface is perpendicular to a plane surface on which the plurality of antenna elements are arrayed.
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公开(公告)号：US20210233865A1
公开(公告)日：2021-07-29
申请号：US17263912
申请日：2018-09-12
IPC分类号： H01L23/552 , H01Q1/22 , H01Q1/02 , H03F3/24 , H01L23/66 , H01L23/433 , H01L23/48 , H01L23/498 , H01L25/065
摘要： A microwave device includes: a first multilayer resin substrate including a ground via hole; a semiconductor substrate provided at the first multilayer resin substrate and including a high frequency circuit; and a conductive heat spreader provided at an opposite face of the semiconductor substrate from a face of the semiconductor substrate facing the first multilayer resin substrate. The microwave device includes: a resin provided over the first multilayer resin substrate and covering the semiconductor substrate and the heat spreader such that an opposite face of the heat spreader from a face of the heat spreader facing the semiconductor substrate is exposed as an exposed face; and a conductive film covering the resin and the heat spreader and touching the exposed face. The semiconductor substrate includes a ground through hole extending through the semiconductor substrate. The conductive film is electrically connected to the ground via hole via the heat spreader and the ground through hole.
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公开(公告)号：US20190159332A1
公开(公告)日：2019-05-23
申请号：US16091467
申请日：2016-04-27
发明人： Hidenori ISHIBASHI , Kiyoshi ISHIDA , Eigo KUWATA , Yukinobu TARUI , Hideharu YOSHIOKA , Hiroyuki AOYAMA , Masaomi TSURU
CPC分类号： H05K1/021 , H01L23/13 , H01L23/49827 , H01L23/552 , H01L23/66 , H01L24/19 , H01L2224/04105 , H01L2224/13025 , H01L2224/131 , H01L2224/16227 , H01L2224/16235 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/73267 , H01L2224/92125 , H01L2224/92225 , H01L2924/142 , H01L2924/15311 , H01L2924/15313 , H01L2924/16251 , H01L2924/181 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H05K1/0206 , H05K1/0209 , H05K1/0216 , H05K1/0222 , H05K1/0243 , H05K1/0274 , H05K1/141 , H05K1/181 , H05K1/188 , H05K3/284 , H05K3/3436 , H05K2201/10121 , H05K2203/1316 , H05K2203/1327 , H01L2924/00012 , H01L2924/014 , H01L2924/00014 , H01L2224/16225 , H01L2924/00
摘要： A printed wiring board includes conductor layers, a core layer having an opening, and a build-up layer. A high frequency device placed within the opening is installed such that a mirror surface is thermally connected to a conductor layer for heat dissipation facing the opening from a lower surface side of the core layer, and terminals on the terminal surface are electrically connected to conductor layers formed on an upper surface side of the core layer.
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公开(公告)号：US20190295959A1
公开(公告)日：2019-09-26
申请号：US16306499
申请日：2017-05-29
发明人： Kiyoshi ISHIDA , Yukinobu TARUI
摘要： A semiconductor device functioning properly by maintaining an electromagnetic shielding structure by a conductor layer is provided. A semiconductor device includes a wiring board having a surface, a semiconductor element, an insulating layer, and a conductor layer. The semiconductor element is arranged on the surface of the wiring board. The insulating layer is located on the surface of the wiring board and arranged to surround the semiconductor element. The conductor layer covers an outer peripheral surface of the insulating layer, and is connected to the wiring board. The outer peripheral surface of the insulating layer includes an upper surface located over the semiconductor element, and a side surface connecting the upper surface and the wiring board. The side surface includes a reverse tapered portion. The conductor layer is in contact with a surface of the reverse tapered portion.
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7.发明申请公开(公告)号：US20190139702A1
公开(公告)日：2019-05-09
申请号：US15772646
申请日：2016-11-04
摘要： An irreversible circuit element that can reduce manufacturing costs by preventing faults that lead to product defects includes a magnetic body, a magnetic body securing casing, and a magnet. The magnetic body securing casing is arranged so as to surround the magnetic body. The magnet is arranged on one side of the magnetic body. The magnetic body securing casing includes a first electrode on one casing main surface arranged on the one side, a second electrode on the other casing main surface arranged on the other side opposite to the one side, and a through-conductor that passes through the magnetic body securing casing and electrically connects the first electrode to the second electrode. The first electrode is connected to a first wiring arranged on the one side of the magnetic body.
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公开(公告)号：US20180351595A1
公开(公告)日：2018-12-06
申请号：US15780288
申请日：2016-12-07
摘要： A microwave module includes an RF device and a multilayer resin substrate. The device includes a metal cover covering at least an internal circuit. The substrate includes a first end face on a side of the device, a second end face on a side opposite to the first end face, a signal through-holes surrounding the circuit and connected to the circuit, ground through-holes surrounding the signal through-holes and connected to the cover, a first surface ground provided on the first end face and connected to the cover, an inner layer surface ground connected to ground through-holes, and an RF transmission line surrounded by the ground through-holes, the first surface ground, and the inner layer surface ground, and connected to the signal through-hole.
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公开(公告)号：US20180158794A1
公开(公告)日：2018-06-07
申请号：US15575522
申请日：2016-06-01
CPC分类号： H01L24/48 , H01L21/50 , H01L23/04 , H01L23/055 , H01L23/10 , H01L24/73 , H01L2224/4807 , H01L2224/48095 , H01L2224/48227 , H01L2924/00014 , H01L2924/16152 , H01L2924/163 , H01L2924/1631 , H01L2924/3025 , H01L2224/45099
摘要： A semiconductor device includes a substrate, a semiconductor element, a ground pad, an insulating coating member, a conductive bonding member, and a conductive cap. The inner peripheral end of a bottom of the conductive cap is disposed at a side close to the inner periphery of the insulating coating member relative to the outer peripheral end of the insulating coating member. The bottom has a shape in which the distance between the main surface and itself decreases continuously from its outer peripheral end toward its inner peripheral end.
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