公开(公告)号：US11798639B2

公开(公告)日：2023-10-24

申请号：US17531825

申请日：2021-11-22

Applicant: MACRONIX INTERNATIONAL CO., LTD.

Inventor： Guan-Wei Wu ,  Yao-Wen Chang ,  Chun-Liang Lu ,  I-Chen Yang

IPC: G11C7/00 ,  G11C16/34 ,  G11C16/08 ,  G11C16/26 ,  G11C16/24 ,  G11C16/04

CPC classification number: G11C16/3427 ,  G11C16/08 ,  G11C16/24 ,  G11C16/26 ,  G11C16/0483

Abstract: A memory device and an operation method thereof are disclosed. The memory device includes a P-well region, a common source line, a ground selection line, at least one dummy ground selection line, a plurality of word lines, at least one dummy string selection line, a string selection line, at least one bit line and at least one memory string. The gates of a plurality of memory cells of the memory string are connected to the word lines. The operation method includes the following steps. Performing a read operation and applying a read voltage on the selected word line. Applying a pass voltage on other unselected word lines and the ground selection lines, etc. Before ending of the read operation, firstly decreasing voltages of the string selection line and the dummy string selection line in advance, then increasing voltage of the bit line.

公开(公告)号：US11758724B2

公开(公告)日：2023-09-12

申请号：US17167221

申请日：2021-02-04

Applicant: MACRONIX INTERNATIONAL CO., LTD.

Inventor： Guan-Wei Wu ,  Yao-Wen Chang ,  I-Chen Yang

IPC: H10B43/27 ,  H10B41/10 ,  H10B41/27 ,  H10B43/10

CPC classification number: H10B43/27 ,  H10B41/10 ,  H10B41/27 ,  H10B43/10

Abstract: A memory device includes a substrate, a laminated structure and a memory string. The laminated structure is disposed on the substrate. The laminated structure includes a plurality of insulating layers and a plurality of conductive layers alternately stacked along a first direction. The memory string is accommodated in the laminated structure along the first direction. The memory string includes a memory layer and a channel layer, and the memory layer is disposed between the laminated structure and the channel layer. At least a portion of the memory layer and the insulating layers are overlapped along the first direction.

公开(公告)号：US10886405B2

公开(公告)日：2021-01-05

申请号：US15371293

申请日：2016-12-07

Applicant: MACRONIX INTERNATIONAL CO., LTD.

Inventor： Yung-Hsiang Chen ,  Yao-Wen Chang ,  Chu-Yung Liu ,  I-Chen Yang ,  Hsin-Wen Chang

IPC: H01L29/78 ,  H01L29/08 ,  H01L29/10 ,  H01L27/112 ,  H01L29/66 ,  H01L29/06

Abstract: A semiconductor structure includes a first source/drain region, a second source/drain region, a channel doping region, a gate structure, a first well and a second well. The second source/drain region is disposed opposite to the first source/drain region. The channel doping region is disposed between the first source/drain region and the second source/drain region. The gate structure is disposed on the channel doping region. The first well has a first portion disposed under the first source/drain region. The second well is disposed opposite to the first well and separated from the second source/drain region. The first source/drain region, the second source/drain region and the channel doping region have a first conductive type. The first well and the second well have a second conductive type different from the first conductive type.

公开(公告)号：US20180144805A1

公开(公告)日：2018-05-24

申请号：US15358300

申请日：2016-11-22

Applicant: MACRONIX INTERNATIONAL CO., LTD.

Inventor： Yung-Hsiang Chen ,  Yao-Wen Chang ,  I-Chen Yang

IPC: G11C16/34 ,  G11C16/10 ,  G11C16/04

CPC classification number: G11C16/3427 ,  G11C16/0483 ,  G11C16/08 ,  G11C16/10 ,  G11C16/24 ,  G11C16/3422

Abstract: A method for operating a memory array is disclosed. The memory array includes a first memory cell, a second memory cell and a third memory cell sharing a gate and arranged along an extending direction of the gate in order. The method includes the following steps. A first bias is applied to a channel of the first memory cell to program the first memory cell. A second bias is applied to a channel of the second memory cell to inhibit programing of the second memory cell. A third bias is applied to a channel of the third memory cell to program or inhibit programing of the third memory cell. The first bias and the third bias are different.

公开(公告)号：US09443955B2

公开(公告)日：2016-09-13

申请号：US14539768

申请日：2014-11-12

Applicant: MACRONIX International Co., Ltd.

Inventor： Guan-Wei Wu ,  Yao-Wen Chang ,  I-Chen Yang ,  Tao-Cheng Lu

IPC: H01L29/66

CPC classification number: H01L29/6656 ,  H01L21/26506 ,  H01L21/26586 ,  H01L21/26593 ,  H01L29/1083 ,  H01L29/6653 ,  H01L29/66575 ,  H01L29/78

Abstract: Provided is a semiconductor device. Two stack layers are disposed on a substrate of a first conductivity type. Each of stack layers includes a dielectric layer and a conductive layer. The dielectric layer is disposed on the substrate. The conductive layer is disposed on the dielectric layer. First doped region of a second conductivity type has a first dopant and is disposed in the substrate between the stack layers. A pre-amorphization implantation (PAI) region is disposed in the first doped region. A second doped region of the second conductivity type has a second dopant and is disposed in the PAI region. The first conductivity type is different from the second conductivity type. A diffusion rate of the second dopant is faster than a diffusion rate of the first dopant, and a thermal activation of the second dopant is higher than that of the first dopant.

Abstract translation: 提供一种半导体器件。 两个堆叠层设置在第一导电类型的衬底上。 每个堆叠层包括电介质层和导电层。 电介质层设置在基板上。 导电层设置在电介质层上。 第二导电类型的第一掺杂区具有第一掺杂剂并且被布置在堆叠层之间的衬底中。 在第一掺杂区域中设置预非晶化注入（PAI）区域。 第二导电类型的第二掺杂区域具有第二掺杂剂并且被布置在PAI区域中。 第一导电类型与第二导电类型不同。 第二掺杂剂的扩散速度比第一掺杂剂的扩散速度快，并且第二掺杂剂的热激活高于第一掺杂剂的扩散速率。

公开(公告)号：US09324789B1

公开(公告)日：2016-04-26

申请号：US14723094

申请日：2015-05-27

Applicant: MACRONIX International Co., Ltd.

Inventor： Guan-Wei Wu ,  Yao-Wen Chang ,  I-Chen Yang ,  Tao-Cheng Lu

IPC: H01L29/788 ,  H01L29/06 ,  H01L27/115 ,  H01L21/764 ,  H01L23/528 ,  H01L23/532

CPC classification number: H01L29/0649 ,  H01L21/764 ,  H01L23/5222 ,  H01L23/528 ,  H01L23/53271 ,  H01L27/11568 ,  H01L27/1157 ,  H01L27/11582 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The memory device is provided to include a substrate, a plurality of stack structures, conductive pillars, charge storage layers, and third conductive layers. The stack structures are arranged along a first direction and extend along a second direction, wherein each stack structure includes a plurality of first conductive layers and a plurality of dielectric layers that are alternately stacked along a third direction. Each conductive pillar is located on the substrate between two adjacent stack structures. Each charge storage layer is disposed between the stack structures and the conductive pillars. Each third conductive layer extending along the first direction overlaps the stack structures in a plurality of overlapped regions and covers a portion of top parts of the stack structures and the conductive pillars. An air gap is formed along the third direction in each overlapped region where the stacked structures and the third conductive layers overlap.

Abstract translation: 存储器件被设置为包括衬底，多个堆叠结构，导电柱，电荷存储层和第三导电层。 堆叠结构沿着第一方向布置并且沿着第二方向延伸，其中每个堆叠结构包括多个第一导电层和沿着第三方向交替堆叠的多个电介质层。 每个导电柱位于两个相邻堆叠结构之间的衬底上。 每个电荷存储层设置在堆叠结构和导电柱之间。 沿着第一方向延伸的每个第三导电层在多个重叠区域中重叠堆叠结构并覆盖堆叠结构的顶部部分和导电柱。 在堆叠结构和第三导电层重叠的重叠区域中沿着第三方向形成气隙。

公开(公告)号：US20150194420A1

公开(公告)日：2015-07-09

申请号：US14150638

申请日：2014-01-08

Applicant: Macronix International Co., Ltd.

Inventor： Shih Yu Wang ,  Yao-Wen Chang ,  Tao-Cheng Lu

IPC: H01L27/02 ,  H01L29/08

CPC classification number: H01L27/0262 ,  H01L27/0266 ,  H01L29/74 ,  H01L29/861

Abstract: A semiconductor device includes a substrate, and first and second wells formed in the substrate. The first well has a first conductivity type. The second well has a second conductivity type different than the first conductivity type. The device includes a first heavily-doped region having the first conductivity type and a second heavily-doped region having the first conductivity type. A portion of the first heavily-doped region is formed in the first well. The second heavily-doped region is formed in the second well. The device also includes an insulating layer formed over a channel region of the substrate between the first and second heavily-doped regions, and a gate electrode formed over the insulating layer. The device further includes a terminal for coupling to a circuit being protected, and a switching circuit coupled between the terminal and the first heavily-doped region, and between the terminal and the gate electrode.

Abstract translation: 半导体器件包括衬底以及形成在衬底中的第一阱和第二阱。 第一阱具有第一导电类型。 第二阱具有与第一导电类型不同的第二导电类型。 该器件包括具有第一导电类型的第一重掺杂区和具有第一导电类型的第二重掺杂区。 在第一阱中形成第一重掺杂区的一部分。 在第二阱中形成第二重掺杂区域。 该器件还包括在第一和第二重掺杂区域之间的衬底的沟道区域上形成的绝缘层，以及形成在绝缘层上的栅电极。 该器件还包括用于耦合到被保护的电路的端子，以及耦合在端子和第一重掺杂区域之间以及端子和栅电极之间的开关电路。

公开(公告)号：US20140159134A1

公开(公告)日：2014-06-12

申请号：US13707426

申请日：2012-12-06

Applicant: MACRONIX INTERNATIONAL CO., LTD.

Inventor： Guan-Wei Wu ,  I-Chen Yang ,  Yao-Wen Chang ,  Tao-Cheng Lu

IPC: H01L29/792 ,  H01L29/66

CPC classification number: H01L29/792 ,  H01L29/42352 ,  H01L29/66833

Abstract: A non-volatile memory and a manufacturing method thereof are provided. The non-volatile memory including a gate structure disposed on a substrate, doped regions, charge storage layers, and a first dielectric layer. There are recesses in the substrate at two sides of the gate structure. The gate structure includes a gate dielectric layer disposed on the substrate and a gate disposed on the gate dielectric layer. There is an interface between the gate dielectric layer and the substrate. The doped regions are disposed in the substrate around the recesses. The charge storage layers are disposed in the recesses, and a top surface of each of the charge storage layers is higher than the interface. The first dielectric layer is disposed between the charge storage layers and the substrate, and between the charge storage layers and the gate structure.

Abstract translation: 提供了一种非易失性存储器及其制造方法。 非易失性存储器包括设置在衬底上的栅极结构，掺杂区域，电荷存储层和第一介电层。 栅极结构两侧的基板上有凹槽。 栅极结构包括设置在衬底上的栅极电介质层和设置在栅极介电层上的栅极。 在栅介电层和衬底之间存在界面。 掺杂区域围绕凹部设置在基板中。 电荷存储层设置在凹部中，并且每个电荷存储层的顶表面高于界面。 第一介电层设置在电荷存储层与基板之间，电荷存储层与栅极结构之间。

公开(公告)号：US12002522B2

公开(公告)日：2024-06-04

申请号：US17743493

申请日：2022-05-13

Applicant: MACRONIX INTERNATIONAL CO., LTD.

Inventor： Tao-Yuan Lin ,  I-Chen Yang ,  Yao-Wen Chang

IPC: G11C16/00 ,  G11C16/10 ,  G11C16/34

CPC classification number: G11C16/3427 ,  G11C16/10

Abstract: A memory device and an operation method thereof are provided. The operation method includes: in a programming operation, programming a plurality of threshold voltages of a plurality of switches on a plurality of string select lines and a plurality of ground select lines as a first reference threshold voltage, and programming a plurality of threshold voltages of a plurality of dummy memory cells on a plurality of dummy word lines as being gradually increased along a first direction or a second direction, and the threshold voltages of the dummy memory cells being higher than the first reference threshold voltage; wherein the first direction being from the string select lines to a plurality of word lines and the second direction being from the ground select lines to the word lines.

公开(公告)号：US11177000B2

公开(公告)日：2021-11-16

申请号：US16445362

申请日：2019-06-19

Applicant: MACRONIX INTERNATIONAL CO., LTD.

Inventor： Guan-Wei Wu ,  Yao-Wen Chang ,  Chih-Chieh Cheng ,  I-Chen Yang

IPC: G11C16/10 ,  H01L27/1157 ,  G11C11/56 ,  G11C16/26 ,  G11C16/08 ,  G11C16/24 ,  G11C16/34

Abstract: An operating method of a non-volatile memory includes: generating a first programming pulse with a first time period to a target memory cell in a memory array; reading and verifying whether a threshold voltage of the target memory cell reaches a target voltage level; and generating a second programming pulse with a second time period to the target memory cell when the threshold voltage of the target memory cell does not reach the target voltage level, wherein the second time period is longer than the first time period.