摘要:
An apparatus for bonding lead terminals to bumps of a semiconductor chip by using a laser beam. On the basis of a temperature signal obtained from irradiation of a lead terminal and a bump to be bonded together under irradiation of the laser beam, state of contact and the bond between the bump and the lead terminal are decided. The bonding between the terminals and the bumps can be realized without fail by checking the state of contact therebetween in precedence to the bonding operation.
摘要:
A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions. Thus, in the case where the workpiece is cut along the intersecting cutting lines, replacement of the fixing table fixing the workpiece is unnecessary and wear of the fixing table is prevented.
摘要:
A bonding apparatus according to the present invention bonds a semiconductor chip to a conductive member in the face-down style without heating the semiconductor chip. The semiconductor chip which consists essentially of silicon is placed on leads which are put on a TAB tape. A glass plate member is mounted on the semiconductor chip. An infrared light beam is irradiated onto the semiconductor chip from above the semiconductor chip. Transmitted by the semiconductor chip, the infrared light beam illuminates bumps. As a result, the bumps heat up and melt. Since the semiconductor chip does not absorb the infrared light beam, bonding of the semiconductor chip to the leads does not cause a rise in temperature of the semiconductor chip. The bonding apparatus according to the present invention makes the face-down style bonding possible.
摘要:
In order to position an optical semiconductor element in high accuracy and to readily fabricate the same, step is formed on an upper surface of a forward end of an electrode (123) projecting from a lead frame. A submount (102) is previously soldered to a lower stage surface (125), while solder (172) is applied to its upper surface. A collet (61) which is softly supported by a spring (63) in the vertical direction suctionally holds a laser diode element (101) and approaches the electrode (123) from above, to be stopped when its leg portion (61b) comes into contact with an upper stage surface (126). Thus, the laser diode element (101) is precisely positioned. In this state, the solder (172) is heated and cooled, to solder the laser diode element (101) to the submount (102). The laser diode element (101) molded with transparent resin, to be easy to fabricate.
摘要:
A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions. Thus, in the case where the workpiece is cut along the intersecting cutting lines, replacement of the fixing table fixing the workpiece is unnecessary and wear of the fixing table is prevented.
摘要:
The present invention relates to a rolling guide unit wherein spatter scattered as a result of arc welding, gas welding and so forth does not adhere to the track rail.The effect is obtained by forming a fluororesin coating layer on the surface of the track rail.
摘要:
Resin compositions for laminated sheets and laminated sheets produced therefrom are disclosed, the compositions comprising at least one allyl ester resin composed of a polybasic acid and a polyhydric alcohol, wherein an allyl ester group of said resin is bonded to at least one of terminals thereof.
摘要:
Resin compositions of high adhesivity which comprise (A) ethylene-vinylacetate copolymer or mixture of said copolymer with polyethylene, (B) chlorinated or chlorosulfonated polyethylene, (C) unsaturated carboxylic acids maintaining solid at room temperature and (D) organic peroxides or these components blended with phenolic compounds and/or acid-acceptors.
摘要:
A method for producing a food product containing nattokinase but containing little or none vitamin K2, comprising treating a Bacillus natto culture or culture supernatant with at least one coagulant selected from the group consisting of an inorganic coagulant and a cationic polymer coagulant (excluding chitosan). As the inorganic coagulant, calcium chloride or poly aluminum chloride is preferable, and their mixtures with a phosphorus coagulant are also preferably used. As the cationic polymer coagulant, cationic polysaccharides, hexamethylenediamine/ephichlorohydrin polycondensates or dimethylamine/epichlorohydrin polycondensates are preferably used, and their mixtures with a polyacrylate are also preferably used.
摘要:
A network I/O system includes a central communication unit having a communication port and a plurality of terminal communication units each having an upstream communication port and a plurality of downstream ports wherein the central communication unit transmits, to the terminal communication units, routing data of the central communication unit to the terminal communication units for setting identification numbers in the terminal communication units and data of the identification number of the terminal communication units, the terminal communication units refer to the data to transmit to the downstream communication port and set the identification number in a targeted terminal communication unit, and a communication port number of the downstream communication port is appended to routing recognition data to be transmitted from the terminal communication units to the central communication unit at a time of passing through the terminal communication units, thereby recognizing a network configuration.