CUTTING APPARATUS
    2.
    发明申请
    CUTTING APPARATUS 失效
    切割装置

    公开(公告)号:US20070066190A1

    公开(公告)日:2007-03-22

    申请号:US11522447

    申请日:2006-09-18

    IPC分类号: B24C3/00

    CPC分类号: B24C1/045 B24C3/04

    摘要: A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions. Thus, in the case where the workpiece is cut along the intersecting cutting lines, replacement of the fixing table fixing the workpiece is unnecessary and wear of the fixing table is prevented.

    摘要翻译: 切割装置在高压下喷射含有磨粒的水,以沿相交方向延伸的切割线切割工件。 切割装置包括:固定工件的固定台; 在切割线下方的各个位置设置在固定台中的槽部; 设置在固定台的除了设置槽部的区域以外的区域的突出部分以工件与突出部分接触的方式; 支撑部分,用于将所述突出部分基本上平行于沿着所述凹槽部分延伸Y方向的切割线; 框架部分,其设置成在固定台的外周的至少一部分中将支撑部彼此连接; 以及可附接和可拆卸地设置以覆盖支撑部分的保护构件。 因此,在沿着相交的切割线切割工件的情况下,不需要更换固定工件的固定台,并且防止了固定台的磨损。

    Optical semiconductor device for optical communications with increased
positional accuracy of an optical access and method of fabricating the
same
    4.
    发明授权
    Optical semiconductor device for optical communications with increased positional accuracy of an optical access and method of fabricating the same 失效
    用于光通信的光学半导体器件,其具有增加的光学访问的位置精度及其制造方法

    公开(公告)号:US5606182A

    公开(公告)日:1997-02-25

    申请号:US428369

    申请日:1995-04-25

    摘要: In order to position an optical semiconductor element in high accuracy and to readily fabricate the same, step is formed on an upper surface of a forward end of an electrode (123) projecting from a lead frame. A submount (102) is previously soldered to a lower stage surface (125), while solder (172) is applied to its upper surface. A collet (61) which is softly supported by a spring (63) in the vertical direction suctionally holds a laser diode element (101) and approaches the electrode (123) from above, to be stopped when its leg portion (61b) comes into contact with an upper stage surface (126). Thus, the laser diode element (101) is precisely positioned. In this state, the solder (172) is heated and cooled, to solder the laser diode element (101) to the submount (102). The laser diode element (101) molded with transparent resin, to be easy to fabricate.

    摘要翻译: 为了高精度地定位光学半导体元件并且容易地制造光学半导体元件,在从引线框架突出的电极(123)的前端的上表面上形成台阶。 预先将底座(102)焊接到下层表面(125),而将焊料(172)施加到其上表面。 在垂直方向上由弹簧(63)轻柔地支撑的夹头(61)从其上方抽吸地保持激光二极管元件(101)并从上方接近电极(123),以在其脚部(61b)进入时停止 与上级表面(126)接触。 因此,激光二极管元件(101)被精确定位。 在这种状态下,焊料(172)被加热和冷却,以将激光二极管元件(101)焊接到基座(102)。 用透明树脂模制的激光二极管元件(101)易于制造。

    Cutting apparatus
    5.
    发明授权
    Cutting apparatus 失效
    切割设备

    公开(公告)号:US07207868B2

    公开(公告)日:2007-04-24

    申请号:US11522447

    申请日:2006-09-18

    IPC分类号: B24B1/00

    CPC分类号: B24C1/045 B24C3/04

    摘要: A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions. Thus, in the case where the workpiece is cut along the intersecting cutting lines, replacement of the fixing table fixing the workpiece is unnecessary and wear of the fixing table is prevented.

    摘要翻译: 切割装置在高压下喷射含有磨粒的水,以沿相交方向延伸的切割线切割工件。 切割装置包括:固定工件的固定台; 在切割线下方的各个位置设置在固定台中的槽部; 设置在固定台的除了设置槽部的区域以外的区域的突出部分以工件与突出部分接触的方式; 支撑部分,用于将所述突出部分基本上平行于沿着所述凹槽部分延伸Y方向的切割线; 框架部分,其设置成在固定台的外周的至少一部分中将支撑部彼此连接; 以及可附接和可拆卸地设置以覆盖支撑部分的保护构件。 因此,在沿着相交的切割线切割工件的情况下,不需要更换固定工件的固定台,并且防止了固定台的磨损。

    Method for producing foods from culture of Bacillus natto
    9.
    发明授权
    Method for producing foods from culture of Bacillus natto 有权
    从纳豆芽孢杆菌培养物生产食物的方法

    公开(公告)号:US08603552B2

    公开(公告)日:2013-12-10

    申请号:US11296942

    申请日:2005-12-08

    IPC分类号: A23L1/10

    CPC分类号: A23L33/15

    摘要: A method for producing a food product containing nattokinase but containing little or none vitamin K2, comprising treating a Bacillus natto culture or culture supernatant with at least one coagulant selected from the group consisting of an inorganic coagulant and a cationic polymer coagulant (excluding chitosan). As the inorganic coagulant, calcium chloride or poly aluminum chloride is preferable, and their mixtures with a phosphorus coagulant are also preferably used. As the cationic polymer coagulant, cationic polysaccharides, hexamethylenediamine/ephichlorohydrin polycondensates or dimethylamine/epichlorohydrin polycondensates are preferably used, and their mixtures with a polyacrylate are also preferably used.

    摘要翻译: 一种含有纳豆激酶但含有很少或不含有维生素K2的食品的方法,包括用至少一种选自无机凝结剂和阳离子聚合物凝结剂(不包括壳聚糖)的凝结剂处理纳豆芽孢杆菌培养物或培养上清液。 作为无机凝结剂,优选使用氯化钙或聚氯化铝,也优选使用与磷混凝剂的混合物。 作为阳离子聚合物凝结剂,优选使用阳离子多糖,六亚甲基二胺/对氯醇缩聚物或二甲胺/表氯醇缩聚物,并且优选使用它们与聚丙烯酸酯的混合物。

    Network configuration method
    10.
    发明授权
    Network configuration method 有权
    网络配置方法

    公开(公告)号:US08468221B2

    公开(公告)日:2013-06-18

    申请号:US12784166

    申请日:2010-05-20

    IPC分类号: G06F15/177

    CPC分类号: H04L41/0803 H04L61/2038

    摘要: A network I/O system includes a central communication unit having a communication port and a plurality of terminal communication units each having an upstream communication port and a plurality of downstream ports wherein the central communication unit transmits, to the terminal communication units, routing data of the central communication unit to the terminal communication units for setting identification numbers in the terminal communication units and data of the identification number of the terminal communication units, the terminal communication units refer to the data to transmit to the downstream communication port and set the identification number in a targeted terminal communication unit, and a communication port number of the downstream communication port is appended to routing recognition data to be transmitted from the terminal communication units to the central communication unit at a time of passing through the terminal communication units, thereby recognizing a network configuration.

    摘要翻译: 网络I / O系统包括具有通信端口的中央通信单元和具有上游通信端口和多个下游端口的多个终端通信单元,其中中央通信单元向终端通信单元发送路由数据 中央通信单元到终端通信单元,用于设置终端通信单元中的识别号码和终端通信单元的识别号码的数据,终端通信单元参考要发送到下游通信端口的数据并设置识别号码 在目标终端通信单元中,并且下行通信端口的通信端口号被附加到在通过终端通信单元时从终端通信单元发送到中央通信单元的路由识别数据,从而识别 网络c 配置