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公开(公告)号：US08377725B2
公开(公告)日：2013-02-19
申请号：US12555478
申请日：2009-09-08
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L24/97 , H01L25/167 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012
摘要： A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
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公开(公告)号：US08604507B2
公开(公告)日：2013-12-10
申请号：US13240460
申请日：2011-09-22
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/97 , H01L25/167 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012
摘要： A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
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公开(公告)号：US20100059782A1
公开(公告)日：2010-03-11
申请号：US12555478
申请日：2009-09-08
CPC分类号： H01L33/62 , H01L24/97 , H01L25/167 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012
摘要： A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
摘要翻译： 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。
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公开(公告)号：US20120007127A1
公开(公告)日：2012-01-12
申请号：US13240460
申请日：2011-09-22
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L24/97 , H01L25/167 , H01L31/02002 , H01L31/0203 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/97 , H01L2924/00014 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2224/85 , H01L2924/00012
摘要： A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
摘要翻译： 一种制造光半导体器件的方法，包括在支撑衬底上形成彼此分开设置的多个第一和第二导电构件; 提供由第一和第二导电构件之间的光阻树脂形成的基底构件; 将光学半导体元件安装在第一和/或第二导电构件上; 通过由半透明树脂形成的密封构件覆盖光学半导体元件; 并且在去除支撑衬底之后获得单独的光学半导体器件。
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公开(公告)号：US20070126356A1
公开(公告)日：2007-06-07
申请号：US11600869
申请日：2006-11-17
申请人： Yuichiro Tanda , Hiroto Tamaki
发明人： Yuichiro Tanda , Hiroto Tamaki
IPC分类号： H01J1/62
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/0603 , H01L2224/16 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/0102 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10157 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device, comprises a light emitting element, a plurality of electroconductive layers on which said light emitting element is mounted or which are electrically connected to the light emitting element, and a translucent insulating member that seals the light emitting element and has the electroconductive layers as its bottom surface, wherein the electroconductive layers have a protrusion on part of their side faces, and the upper edges of the protrusion is rounded off.
摘要翻译： 一种发光器件，包括发光元件，多个导电层，所述发光元件安装在所述多个导电层上或者电连接到所述发光元件;以及半透明绝缘构件，其密封所述发光元件并具有导电性 层作为其底表面，其中导电层在其侧面的一部分上具有突起，并且突起的上边缘被倒圆。
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公开(公告)号：US07888869B2
公开(公告)日：2011-02-15
申请号：US11600869
申请日：2006-11-17
申请人： Yuichiro Tanda , Hiroto Tamaki
发明人： Yuichiro Tanda , Hiroto Tamaki
IPC分类号： H01J1/62
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/0603 , H01L2224/16 , H01L2224/16245 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/0102 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10157 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device, comprises a light emitting element, a plurality of electroconductive layers on which said light emitting element is mounted or which are electrically connected to the light emitting element, and a translucent insulating member that seals the light emitting element and has the electroconductive layers as its bottom surface, wherein the electroconductive layers have a protrusion on part of their side faces, and the upper edges of the protrusion is rounded off.
摘要翻译： 一种发光器件，包括发光元件，多个导电层，所述发光元件安装在所述多个导电层上或者电连接到所述发光元件;以及半透明绝缘构件，其密封所述发光元件并具有导电性 层作为其底表面，其中导电层在其侧面的一部分上具有突起，并且突起的上边缘被倒圆。
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公开(公告)号：US07851999B2
公开(公告)日：2010-12-14
申请号：US12404346
申请日：2009-03-16
申请人： Yuichiro Tanda
发明人： Yuichiro Tanda
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2224/49171 , H01L2924/01322 , H01L2924/181 , Y10S362/80 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting device includes an insulating board, a metal member, a light emitting element, a conductive member, and a transparent member. The insulating board defines a through hole. The metal member is inserted into the through hole. The light emitting element is mounted on the top surface of the metal member. The conductive member is formed on the insulating board and is electrically connected to the light emitting element. The transparent member covers the light emitting element and the top surface of the insulating board. The metal member has a substantially stepped rectangle in a cross-sectional view. The top surface of the substantially stepped rectangle of the metal member projects higher than the top surface of the insulating board. The insulating board is mated with the metal member.
摘要翻译： 发光器件包括绝缘板，金属构件，发光元件，导电构件和透明构件。 绝缘板限定一个通孔。 金属构件插入到通孔中。 发光元件安装在金属构件的顶面上。 导电构件形成在绝缘板上并与发光元件电连接。 透明构件覆盖发光元件和绝缘板的顶表面。 金属构件在截面图中具有大致阶梯形的矩形。 金属构件的大致阶梯形的矩形的顶面比绝缘板的上表面突出。 绝缘板与金属构件配合。
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公开(公告)号：US20070164302A1
公开(公告)日：2007-07-19
申请号：US11615593
申请日：2006-12-22
申请人： Yuichiro Tanda
发明人： Yuichiro Tanda
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2224/49171 , H01L2924/01322 , H01L2924/181 , Y10S362/80 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting device capable of efficiently dissipating heat outward, and a method producing it are provided. The light emitting device comprises an insulating board, a metal member, a light emitting element, a conductive member and a transparent member. The insulating board has a through hole. The metal member is inserted into the through hole. The light emitting element is mounted on the top surface of the metal member. The conductive member is formed on the insulating board and is electrically connected to the light emitting element. The transparent member covers the light emitting element and the top surface of the insulating board. The conductive member is continuously formed from the top surface to the bottom surface of the insulating board. The bottom surface of the metal member is substantially coplanar with the bottom surface of the conductive member on the bottom surface side of the insulating board.
摘要翻译： 提供能够有效地向外散热的发光装置及其制造方法。 发光装置包括绝缘板，金属构件，发光元件，导电构件和透明构件。 绝缘板具有通孔。 金属构件插入到通孔中。 发光元件安装在金属构件的顶面上。 导电构件形成在绝缘板上并与发光元件电连接。 透明构件覆盖发光元件和绝缘板的顶表面。 导电构件从绝缘板的顶表面到底表面连续形成。 金属部件的底面与绝缘基板的底面侧的导电部件的底面基本共面。
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公开(公告)号：US06899469B2
公开(公告)日：2005-05-31
申请号：US10245384
申请日：2002-09-18
IPC分类号： G02B6/42 , H01L31/0232 , H01L33/00 , H01L33/56 , G02B6/36
CPC分类号： G02B6/4246 , G02B6/4206 , H01L2224/48091 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A bidirectional optical transmission device has a housing having a guide portion in which an end of a single optical fiber is to be inserted. A light-receiving device and a light-emitting device are provided in the housing. Light path restricting members are provided in the light-receiving device so as to restrict light beams entering the light-receiving device.
摘要翻译： 双向光传输装置具有壳体，其具有引导部分，单个光纤的端部将被插入该引导部分。 在壳体内设置有光接收装置和发光装置。 在光接收装置中设置光路限制构件，以限制进入光接收装置的光束。
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公开(公告)号：US20070194676A1
公开(公告)日：2007-08-23
申请号：US11708124
申请日：2007-02-20
IPC分类号： H01K1/30
CPC分类号： C09K11/025 , C09K11/7774 , H01L33/501 , H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2933/0041 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： A light emitting apparatus including a base (2) having electrodes (6a, 6b), an LED (4) mounted on the base and electrically connected through electrical connecting members to the electrodes, a translucent sealing resin (8) to seal the light emitting element, a wavelength conversion material (9) to convert at least one portion of light emitted from the light emitting element to a different wavelength and a precipitation-prevention agent (10) to reduce precipitation of the wavelength conversion material being contained in the sealing resin, the precipitation-prevention agent being capable of controlling an amount of the wavelength conversion material precipitated.
摘要翻译： 一种发光装置，包括具有电极（6a，6b）的基座（2），安装在基座上并通过电连接构件电连接到电极的LED（4），半透明密封树脂（8） 发光元件，将从发光元件发射的光的至少一部分转换为不同波长的波长转换材料（9）和防止沉淀剂（10），以减少包含在所述发光元件中的波长转换材料的沉淀 密封树脂，所述防沉淀剂能够控制所述波长转换材料的沉淀量。
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