摘要:
Bond pads on an integrated circuit are provided with planarizing dielectric structures to permit the electroplating of metal posts having planar top surfaces. The metal posts contact at least three sides of the planarizing dielectric structures. The planarizing dielectric structures can be used on integrated circuits having bond pads of different sizes to electroplate metal posts having the same height.
摘要:
Bond pads on an integrated circuit are provided with planarizing dielectric structures to permit the electroplating of metal posts having planar top surfaces. The metal posts contact at least three sides of the planarizing dielectric structures. The planarizing dielectric structures can be used on integrated circuits having bond pads of different sizes to electroplate metal posts having the same height.
摘要:
An integrated circuit containing a FeCap array. The FeCap array is at least partially surrounded on the sides by hydrogen barrier walls and on the top by a hydrogen barrier top plate. A method for at least partially enclosing a FeCap array with hydrogen barrier walls and a hydrogen barrier top plate.
摘要:
A system and method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device is disclosed. The technology includes a method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device. The method includes detecting a non-network enabled device locally coupled to a first computer system, the first computer system coupled to the network. The method further includes enabling routing of data through the non-network enabled device to a second computer system coupled to the network by using the first computer system as a communication interface between the non-network enabled device and the second computer system wherein the second computer system is automatically identified based on recognizing a portion of the data as a routing destination.
摘要:
Semiconductor devices and methods are disclosed for improving electrical connections to integrated circuits. A process flow and device with a dual/single damascene interconnect structure overlying an existing interconnect structure in a semiconductor wafer is provided. A capping layer is formed thereon that comprises nickel/palladium layers within a bond pad opening. The layers are polished using a chemical mechanical polishing (CMP) technique so that the capping layers are within the opening.
摘要:
A system and method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device is disclosed. The technology includes a method for enabling routing of data on a network based on a portion of data accessed from a non-network enabled device. The method includes detecting a non-network enabled device locally coupled to a first computer system, the first computer system coupled to the network. The method further includes enabling routing of data through the non-network enabled device to a second computer system coupled to the network by using the first computer system as a communication interface between the non-network enabled device and the second computer system wherein the second computer system is automatically identified based on recognizing a portion of the data as a routing destination.
摘要:
An electronic device includes a security system which provides for protection of designated files stored on an electronic device. For example, an electronic device may receive user input selecting a file for protection processing. The user input may select the file for encryption and automatic decryption under certain predetermined conditions and/or for automatic saving to a remote storage device after the device has been reported stolen, for instance. After receiving the user input selecting the file for protection processing, the electronic device may automatically receive theft information from a remote server, wherein the theft information indicates whether the electronic device has been reported stolen. After determining whether the electronic device has been reported stolen, the electronic device may automatically process the selected file according to the selected protection processing, wherein the processing is contingent on whether the electronic device has been reported stolen. Other embodiments are described and claimed.
摘要:
Provided is a method for manufacturing an interconnect. The method for manufacturing the interconnect, in one embodiment, includes forming a first metal feature over or within a substrate, the first metal feature having an exposed surface. The method for manufacturing the interconnect may additionally include cleaning the exposed surface using a reactive system with a reducing agent, and subjecting the exposed surface to a plasma etch. The method for manufacturing the interconnect may further include contacting the first metal feature with a second metal feature.
摘要:
An integrated circuit containing a FeCap array. The FeCap array is at least partially surrounded on the sides by hydrogen barrier walls and on the top by a hydrogen barrier top plate. A method for at least partially enclosing a FeCap array with hydrogen barrier walls and a hydrogen barrier top plate.
摘要:
A rich, robust fax addressing experience is provided for users. In some embodiments, multiple different ways of addressing a fax and related functionality are exposed to a user and work seamlessly together to give a compelling addressing experience. In some embodiments, a fax application can resolve recipient names and/or numbers. Additionally, a user can type in a fax number and have that number resolved as a valid number. Further, some embodiments can provide a user interface that is designed to help a user compose a fax number, thus ensuring that the number is in the proper format. In some embodiments, the fax application can allow the user to choose from among a number of different address books and then employ the chosen address book in the fax addressing experience.