公开(公告)号：US20070269357A1

公开(公告)日：2007-11-22

申请号：US11750274

申请日：2007-05-17

Applicant: Mark Anderson ,  Michael Ray ,  Ronald Shafer

Inventor： Mark Anderson ,  Michael Ray ,  Ronald Shafer

IPC: B01D53/52

CPC classification number: B01D53/526 ,  B01D53/77 ,  B01D2251/206 ,  B01D2257/304 ,  B01D2257/504 ,  C01B17/64 ,  Y02C10/04 ,  Y02P20/152 ,  Y10S423/05

Abstract: A process for treating a gas comprising hydrogen suilfide and carbon dioxide by contacting the gas with a scrub solution comprising ammonium sulfite and ammonium bisulfite in a first contact zone to produce ammonium thiosulfate. The scrub solution can be formed in a second contact zone by contacting ammonia and hydrogen sulfide with an aqueous solution. The oxidation potential of the first contact zone effluent liquid can be controlled by modulating the amount of sulfur dioxide supplied to the second contact zone. Alternatively, the sulfite concentration of the first contact zone effluent can be measured with an infrared analyzer and the amount of sulfur dioxide supplied to the second contact zone modulated in response. Additionally, the amount of ammonia supplied to the second contact zone can be modulated in response to the pH in the second contact zone. The process can further comprise a solvent scrubber to remove carbon dioxide from the first contact zone overhead gas. A third contact zone can be included in the process to separate the hydrogen sulfite from the carbon dioxide in the solvent regenerator overhead gas.

Abstract translation: 一种通过在第一接触区使气体与包含亚硫酸铵和亚硫酸氢铵的洗涤溶液接触以产生硫代硫酸铵的方法来处理包含氢化硅和二氧化碳的气体。 洗涤溶液可以通过使氨和硫化氢与水溶液接触而在第二接触区中形成。 可以通过调节供应到第二接触区的二氧化硫的量来控制第一接触区流出液的氧化电位。 或者，可以用红外分析仪测量第一接触区流出物的亚硫酸盐浓度，并且响应地调制供应到第二接触区的二氧化硫的量。 另外，可以响应于第二接触区域中的pH调节供应到第二接触区域的氨的量。 该方法还可以包括用于从第一接触区塔顶气体中除去二氧化碳的溶剂洗涤器。 在该方法中可以包括第三接触区，以从溶剂再生器塔顶气体中的二氧化碳中分离出亚硫酸氢盐。

公开(公告)号：US20060129016A1

公开(公告)日：2006-06-15

申请号：US11009996

申请日：2004-12-10

Applicant: Mark Anderson ,  Michael Ray

Inventor： Mark Anderson ,  Michael Ray

IPC: C07C2/58

CPC classification number: C07C2/62

Abstract: A method is provided for reducing the water content of a sulfuric acid catalyst in a sulfuric acid-catalyzed process carried out in a reactor comprising: (a) withdrawing a portion of catalyst from the acid settler, forming a withdrawn catalyst stream; (b) continuously adding an SO3-containing substance to the withdrawn catalyst stream at a desired rate, forming a fortified catalyst, while maintaining the temperature of the fortified catalyst stream below about 60° F.; (c) returning the fortified catalyst to the reactor; whereby the water concentration in the fortified catalyst is maintained at 1.5 to 4 weight percent of the catalyst. A method is also provided for drying paraffinic feed or recycle hydrocarbon streams in a reactor system comprising contacting the feed or recycle hydrocarbon streams with spent sulfuric acid, whereby the feed or recycle streams are dried and whereby a portion of the sulfuric acid esters in the spent acid are converted to sulfuric acid and alkylate. The alkylate produced is extracted into the hydrocarbon phase and returns to the reactor system.

Abstract translation: 提供了一种在反应器中进行的硫酸催化方法中降低硫酸催化剂的含水量的方法，包括：（a）从酸沉降器中取出一部分催化剂，形成抽出的催化剂流; （b）以所需的速率连续地向所抽出的催化剂流中加入含SO 3的物质，形成强化的催化剂，同时将强化的催化剂流的温度保持在约60°F以下。 （c）将强化催化剂返回到反应器; 由此将强化催化剂中的水浓度保持在催化剂的1.5〜4重量％。 还提供了一种用于在反应器系统中干燥链烷烃进料或再循环烃流的方法，包括使进料或再循环烃流与废硫酸接触，由此将进料或再循环料流干燥，由此将一部分硫酸酯在废料中 酸被转化成硫酸和烷基化物。 产生的烷基化物被提取到烃相中并返回反应器系统。

公开(公告)号：US07003871B2

公开(公告)日：2006-02-28

申请号：US10677640

申请日：2003-10-01

Applicant: Michael Ray

Inventor： Michael Ray

IPC: H01R43/00

CPC classification number: H05K3/1225 ,  H05K1/0269 ,  H05K3/1233 ,  H05K2203/107 ,  H05K2203/163 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: A method and apparatus for manufacturing or assembling a plurality of printed circuit boards to reduce rework at a printed circuit board assembly facility, which may include the following: cutting a first solder paste stencil based on a first solder paste stencil data set on a solder paste stencil cutting machine or device; utilizing the first stencil to apply solder paste to a first printed circuit board at a manufacturing or assembly facility; identifying a solder paste error condition with solder paste error information on the first printed circuit board; transmitting the solder paste error information for remote analysis; generating an adjusted first data set; transmitting the adjusted first data set to the printed circuit board manufacturing or assembly facility; utilizing the adjusted first data set to cut another solder paste stencil based on the adjusted stencil data; and utilizing the adjusted first solder paste stencil to manufacture a second printed circuit board without the solder paste error condition.

Abstract translation: 一种用于制造或组装多个印刷电路板以减少印刷电路板组装设备的返工的方法和装置，其可以包括以下步骤：基于在焊膏上设置的第一焊膏模版数据来切割第一焊膏模版 模切机或设备; 利用第一模板在制造或组装设施中将焊膏施加到第一印刷电路板; 在第一印刷电路板上识别焊膏误差信息，焊膏误差信息; 发送用于远程分析的焊膏错误信息; 生成调整后的第一数据集; 将经调整的第一数据集发送到印刷电路板制造或组装设施; 利用经调整的第一数据集，根据经调整的模板数据切割另一焊膏模版; 并利用调整后的第一焊锡膏模板制造第二印刷电路板，而没有焊膏错误状况。

公开(公告)号：US5585968A

公开(公告)日：1996-12-17

申请号：US160567

申请日：1993-12-01

Applicant: Glenn F. Guhman ,  Michael Ray ,  Theodore R. Touw

Inventor： Glenn F. Guhman ,  Michael Ray ,  Theodore R. Touw

IPC: B29D11/00 ,  B29K83/00 ,  G02B3/00 ,  G02B27/44

CPC classification number: G02B3/0087 ,  Y10S359/90 ,  Y10T428/249961 ,  Y10T428/249969 ,  Y10T428/249978

Abstract: An optical device having a variable index of refraction across its surface includes a light transmissive material with a plurality of regions in the light transmissive material. Each region has an index of refraction which is different from the remainder of the material. The regions may be arranged in the surface of the material such that the density of the regions on the surface varies across the surface. Each region may be a bore, including a hole that extends through the light transmissive material. Variations in the density of the regions or bores as well as the depth and shape of the bores may be utilized to create variations of the refractive index within the light transmissive material.

Abstract translation: 在其表面上具有可变折射率的光学装置包括在透光材料中具有多个区域的透光材料。 每个区域的折射率与材料的其余部分不同。 这些区域可以布置在材料的表面中，使得表面上的区域的密度在整个表面上变化。 每个区域可以是孔，包括延伸穿过透光材料的孔。 可以利用区域或孔的密度以及孔的深度和形状的变化来产生透光材料内的折射率的变化。

公开(公告)号：US06455931B1

公开(公告)日：2002-09-24

申请号：US09859618

申请日：2001-05-15

Applicant: William J. Hamilton, Jr. ,  Michael Ray ,  Eli E. Gordon ,  Christopher L. Fletcher ,  Ronald W. Berry

Inventor： William J. Hamilton, Jr. ,  Michael Ray ,  Eli E. Gordon ,  Christopher L. Fletcher ,  Ronald W. Berry

IPC: H01L2334

CPC classification number: H01L27/14683 ,  H01L27/14601 ,  H01L27/14643 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A monolithic microelectronic array structure includes a microelectronic integrated circuit array having a first plurality of microelectronic integrated circuit elements each deposited on a front side of a substrate. The substrates are physically discontinuous so that each substrate comprises a substrate island which is physically separated from the other substrate islands. The monolithic microelectronic array structure optionally includes a first plurality of input/output elements with a respective input/output element associated with and directly connected to each of the microelectronic integrated circuit elements, and a second plurality of electrically conductive interconnects extending between the microelectronic integrated circuit elements of adjacent substrate islands. The monolithic microelectronic array structure may be planar, or it may be curved.

Abstract translation: 单片微电子阵列结构包括微电子集成电路阵列，其具有分别沉积在衬底的前侧上的第一多个微电子集成电路元件。 衬底物理不连续，使得每个衬底包括与其它衬底岛物理分离的衬底岛。 单片微电子阵列结构可选地包括具有与每个微电子集成电路元件相关联并直接连接到每个微电子集成电路元件的相应输入/输出元件的第一多个输入/输出元件，以及在微电子集成电路之间延伸的第二多个导电互连 相邻衬底岛的元素。 单片微电子阵列结构可以是平面的，或者它可以是弯曲的。

公开(公告)号：US5808350A

公开(公告)日：1998-09-15

申请号：US778934

申请日：1997-01-03

Applicant: Michael D. Jack ,  Michael Ray ,  Richard H. Wyles

Inventor： Michael D. Jack ,  Michael Ray ,  Richard H. Wyles

IPC: G01J5/10 ,  G01J5/34 ,  H01L27/146 ,  H01L37/02 ,  H01L31/0256 ,  H01L27/148 ,  H01L31/0232

CPC classification number: H01L37/02 ,  G01J5/10 ,  G01J5/34 ,  H01L27/14652

Abstract: An imaging device (10) has a plurality of unit cells that contribute to forming an image of a scene. The imaging device includes a layer of semiconductor material (16), for example silicon, that has low noise photogate charge-mode readout circuitry (20, 21, 26, 28) (e.g., CCD or CMOS readout circuitry and structures) that is disposed upon a first surface (18) of the layer. A second, opposing surface of the layer is a radiation admitting surface of the layer. The layer has a bandgap selected for absorbing electromagnetic radiation having wavelengths shorter than about one micrometer and for generating charge carriers from the absorbed radiation. The generated charge carriers are collected by the photogate charge-mode readout circuitry. A thermal sensing element (22) is disposed above and is thermally isolated from the first surface of the layer. The thermal sensing element may be, by example, one of a bolometer element, a pyroelectric element, or a thermopile element. A layer (12) of narrower bandgap semiconductor material can also be employed with this invention, wherein the layer of narrower bandgap semiconductor material (such as InGaAs or HgCdTe) is atomically bonded to the second surface along a heterojunction interface that is continuous or apertured across the second surface. The bonded layer is used to absorb NIR and visible light.

Abstract translation: 成像装置（10）具有有助于形成场景图像的多个单位单元。 该成像装置包括半导体材料层（16），例如硅，其具有低噪声光栅充电模式读出电路（20,21,26,28）（例如，CCD或CMOS读出电路和结构），其被布置 在该层的第一表面（18）上。 层的第二相对表面是该层的辐射入射表面。 该层具有选择用于吸收波长短于约一微米的电磁辐射的带隙，并用于从吸收的辐射产生电荷载流子。 产生的电荷载流子由光栅充电模式读出电路收集。 热敏元件（22）设置在层的第一表面的上方并与之隔离。 热敏元件可以是例如测辐射热计元件，热电元件或热电堆元件之一。 窄带隙半导体材料的层（12）也可以用于本发明，其中较窄带隙半导体材料（例如InGaAs或HgCdTe）的层沿着连续或有孔跨越的异质结界面原子键合到第二表面 第二个表面。 接合层用于吸收近红外和可见光。

公开(公告)号：US5753375A

公开(公告)日：1998-05-19

申请号：US369035

申请日：1995-01-05

Applicant: Michael Ray

Inventor： Michael Ray

IPC: H01L21/768 ,  B32B15/00

CPC classification number: H01L21/76877 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A microelectronic device includes a substrate device and a dark mirror coating overlying one side of the substrate device. The dark mirror coating has a via therethrough to the substrate device. The dark mirror coating has a plurality of alternating layers of dielectrics and metals. Each metallic layer has an electrically nonconducting region adjacent to the vias, preferably formed by anodizing the metallic layers after deposition.

Abstract translation: 微电子器件包括衬底器件和覆盖衬底器件一侧的暗镜涂层。 暗镜涂层具有穿过其穿过基底装置的通孔。 暗镜涂层具有多个交替的电介质层和金属层。 每个金属层具有与通孔相邻的电非导电区域，优选通过在沉积之后阳极氧化金属层而形成。

公开(公告)号：US5701008A

公开(公告)日：1997-12-23

申请号：US758408

申请日：1996-11-29

Applicant: Michael Ray ,  Adam M. Kennedy

Inventor： Michael Ray ,  Adam M. Kennedy

IPC: G01J1/02 ,  G01J5/02 ,  G01J5/08 ,  G01J5/12 ,  G01J5/14 ,  G01J5/06

CPC classification number: G01J5/08 ,  G01J5/045 ,  G01J5/0806 ,  G01J5/0875 ,  G01J2005/0077 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14649 ,  H01L2924/0002

Abstract: An infrared (IR) microlens array has a plurality of microlenses (12) aligned with respective IR detector array pixels (6) to focus incoming IR radiation onto the pixels (6) to improve the efficiency of IR detection, and a gas molecule getter grating (14) inside a vacuum-sealed Dewar assembly that houses the detector array (4) increases the surface area of the getter (15) to improve the efficiency of removing residual gas molecules from the Dewar assembly.

Abstract translation: 红外（IR）微透镜阵列具有与各自的IR检测器阵列像素（6）对准的多个微透镜（12），以将入射的IR辐射聚焦到像素（6）上以提高IR检测的效率，以及气体分子吸气光栅 （14）在容纳检测器阵列（4）的真空密封的杜瓦组件内增加了吸气剂（15）的表面积，以提高从杜瓦组件去除残留气体分子的效率。

公开(公告)号：US20060248791A1

公开(公告)日：2006-11-09

申请号：US11486349

申请日：2006-07-13

Applicant: Robert Hogsett ,  Philippus Meyer ,  Michael Ray ,  Michael Schlegel ,  Sheldon Schultz

Inventor： Robert Hogsett ,  Philippus Meyer ,  Michael Ray ,  Michael Schlegel ,  Sheldon Schultz

IPC: C10L5/00

CPC classification number: C10L9/06 ,  B01J8/0065 ,  B01J2208/00132 ,  B01J2219/00038 ,  B01J2219/0004 ,  C10L9/08 ,  F28C3/14 ,  F28D7/00

Abstract: Carbonaceous materials are thermally upgraded in a pressurized steam environment to remove moisture and other byproducts. A variety of water/solid separation devices may be employed in a process vessel to maximize moisture removal from the upgraded charge. Heating media inlet nozzles and process chamber vents are strategically positioned at the process vessel wall to minimize short circuiting of heating media to vessel outlet vents and to continuously separate hot water removed from the charge and condensed steam, such that the upgraded material removed from the process vessel is not discharged with accompanying free moisture. After upgrading, the charge may be rehydrated to improve its stability during shipping and storage.

Abstract translation: 碳质材料在加压蒸汽环境中热升级以除去水分和其它副产物。 可以在处理容器中使用各种水/固体分离装置，以使从升级的装料中除去湿度最大化。 加热介质入口喷嘴和处理室通风口在策略上位于过程容器壁处，以最小化加热介质到容器出口通气口的短路，并连续分离从电荷和冷凝蒸汽中除去的热水，使得从过程中除去的升级的材料 船只不伴随自由水分排放。 升级后，充电可以重新水化，以提高运输和储存期间的稳定性。

公开(公告)号：US20050071996A1

公开(公告)日：2005-04-07

申请号：US10677640

申请日：2003-10-01

Applicant: Michael Ray

Inventor： Michael Ray

IPC: H05K1/02 ,  H05K3/12 ,  H05K3/00

CPC classification number: H05K3/1225 ,  H05K1/0269 ,  H05K3/1233 ,  H05K2203/107 ,  H05K2203/163 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: A method and apparatus for manufacturing or assembling a plurality of printed circuit boards to reduce rework at a printed circuit board assembly facility, which may include the following: cutting a first solder paste stencil based on a first solder paste stencil data set on a solder paste stencil cutting machine or device; utilizing the first stencil to apply solder paste to a first printed circuit board at a manufacturing or assembly facility; identifying a solder paste error condition with solder paste error information on the first printed circuit board; transmitting the solder paste error information for remote analysis; generating an adjusted first data set; transmitting the adjusted first data set to the printed circuit board manufacturing or assembly facility; utilizing the adjusted first data set to cut another solder paste stencil based on the adjusted stencil data; and utilizing the adjusted first solder paste stencil to manufacture a second printed circuit board without the solder paste error condition.

Abstract translation: 一种用于制造或组装多个印刷电路板以减少印刷电路板组装设备的返工的方法和装置，其可以包括以下步骤：基于在焊膏上设置的第一焊膏模版数据来切割第一焊膏模版 模切机或设备; 利用第一模板在制造或组装设施中将焊膏施加到第一印刷电路板; 在第一印刷电路板上识别焊膏误差信息，焊膏误差信息; 发送用于远程分析的焊膏错误信息; 生成调整后的第一数据集; 将经调整的第一数据集发送到印刷电路板制造或组装设施; 利用经调整的第一数据集，根据经调整的模板数据切割另一焊膏模版; 并利用调整后的第一焊锡膏模板制造第二印刷电路板，而没有焊膏错误状况。