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19 条记录 (耗时 0.037 秒)

    Implementing enhanced low loss, thin, high performance flexible circuits
    6.
    发明授权
    Implementing enhanced low loss, thin, high performance flexible circuits 有权
    实现增强型低损耗，薄型，高性能的柔性电路

    公开(公告)号：US09089071B2

    公开(公告)日：2015-07-21

    申请号：US13535792

    申请日：2012-06-28

    申请人： John R. Dangler ,  Matthew S. Doyle

    发明人： John R. Dangler ,  Matthew S. Doyle

    IPC分类号： G06F19/00 ,  H05K1/18

    CPC分类号： H05K1/189 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/0005 ,  H05K3/4635 ,  H05K3/4638 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/09718 ,  H05K2203/063

    摘要： A method, system and computer program product are provided for implementing enhanced low loss, thin, high performance flexible circuits. A plurality of predefined values including predefined layout, spacing and density of conductor, signal trace construct, shape and feature values are provided for each signal layer in a flexible circuit. Volumetric calculations are performed using the predefined values for each signal layer in the flexible circuit and a respective adjacent adhesive layer is characterized for each signal layer providing a respective optimized adjacent adhesive layer.

    摘要翻译： 提供了一种方法，系统和计算机程序产品，用于实现增强型低损耗，薄型，高性能的柔性电路。 为柔性电路中的每个信号层提供多个预定值，包括预定布局，导体间距和密度，信号迹线构造，形状和特征值。 使用柔性电路中的每个信号层的预定值进行体积计算，并且相应的相邻粘合剂层的特征在于每个信号层提供相应优化的相邻粘合剂层。

    Apparatus for accessing and probing the connections between a chip package and a printed circuit board
    8.
    发明授权
    Apparatus for accessing and probing the connections between a chip package and a printed circuit board 失效
    用于访问和探测芯片封装和印刷电路板之间的连接的装置

    公开(公告)号：US07525299B1

    公开(公告)日：2009-04-28

    申请号：US12163346

    申请日：2008-06-27

    申请人： Paul W. Rudrud ,  Roger A. Booth, Jr. ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse M. Hefner ,  Ankur K. Patel ,  Thomas W. Liang

    发明人： Paul W. Rudrud ,  Roger A. Booth, Jr. ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse M. Hefner ,  Ankur K. Patel ,  Thomas W. Liang

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2812 ,  G01R31/046

    摘要： A device to access and/or verify connections between a chip package and a printed circuit board (“PCB”), specifically within packages lacking back-side measurement access, includes a housing for insertion between the chip package and PCB. A passageway in the housing connects an entrance and an exit from the housing. The entrance is disposed on an end of the housing facing away from the chip package. The exit is disposed on a side of the housing below the chip package such that the passageway is directed at a signal path between the chip package and the PCB. A conductor disposed in the passageway is movable between a retracted position in which a contact end of the conductor is disposed within the passageway of the housing and an extended position in which the contact end of the conductor is disposed outside of the housing and in contact with the signal path.

    摘要翻译： 访问和/或验证芯片封装和印刷电路板（“PCB”）之间的连接的装置，特别是在没有背面测量通路的封装中，包括用于插入芯片封装和PCB之间的壳体。 壳体中的通道连接入口和出口与壳体。 入口设置在壳体的远离芯片封装的一端。 出口设置在芯片封装下方的壳体的一侧，使得通道指向芯片封装和PCB之间的信号路径。 设置在通道中的导体可在缩回位置之间移动，在该缩回位置，导体的接触端设置在壳体的通道内，并且延伸位置，其中导体的接触端设置在壳体的外部并与其接触 信号路径。

    Flexible Printed Circuits Capable of Transmitting Electrical and Optical Signals
    9.
    发明申请
    Flexible Printed Circuits Capable of Transmitting Electrical and Optical Signals 失效
    灵活的印刷电路能够传输电和光信号

    公开(公告)号：US20070269159A1

    公开(公告)日：2007-11-22

    申请号：US11383985

    申请日：2006-05-18

    申请人： John R. Dangler ,  Matthew S. Doyle

    发明人： John R. Dangler ,  Matthew S. Doyle

    IPC分类号： G02B6/12

    CPC分类号： G02B6/3608 ,  G02B6/3688 ,  H05K1/02 ,  H05K1/0393 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09536

    摘要： A flexible printed circuit capable of transmitting electrical and optical signals is disclosed. The flexible printed circuit includes a set of optical waveguides for transmitting optical signals and a set of conductors for transmitting electrical signals. Each of a subset of the optical waveguides is enclosed by a respectively one of the conductors. The optical waveguide is made of glass or plastic. The conductors are formed within a first building block constructed by a first dielectric layer and a first substrate layer, and a second building block constructed by a second dielectric layer and a second substrate layer.

    摘要翻译： 公开了能够发送电和光信号的柔性印刷电路。 柔性印刷电路包括用于传输光信号的一组光波导和用于传输电信号的一组导体。 光波导的一个子集中的每一个被分别由一个导体包围。 光波导由玻璃或塑料制成。 导体形成在由第一介电层和第一基底层构成的第一构建块内，以及由第二介电层和第二基底层构成的第二构建块。

    IMPLEMENTING ENHANCED LOW LOSS, THIN, HIGH PERFORMANCE FLEXIBLE CIRCUITS
    10.
    发明申请
    IMPLEMENTING ENHANCED LOW LOSS, THIN, HIGH PERFORMANCE FLEXIBLE CIRCUITS 有权
    实现增强低损耗，高性能灵活电路

    公开(公告)号：US20140005818A1

    公开(公告)日：2014-01-02

    申请号：US13535792

    申请日：2012-06-28

    申请人： John R. Dangler ,  Matthew S. Doyle

    发明人： John R. Dangler ,  Matthew S. Doyle

    IPC分类号： G06F19/00

    CPC分类号： H05K1/189 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/0005 ,  H05K3/4635 ,  H05K3/4638 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/09718 ,  H05K2203/063

    摘要： A method, system and computer program product are provided for implementing enhanced low loss, thin, high performance flexible circuits. A plurality of predefined values including predefined layout, spacing and density of conductor, signal trace construct, shape and feature values are provided for each signal layer in a flexible circuit. Volumetric calculations are performed using the predefined values for each signal layer in the flexible circuit and a respective adjacent adhesive layer is characterized for each signal layer providing a respective optimized adjacent adhesive layer.

    摘要翻译： 提供了一种方法，系统和计算机程序产品，用于实现增强型低损耗，薄型，高性能的柔性电路。 为柔性电路中的每个信号层提供多个预定值，包括预定布局，导体间距和密度，信号迹线构造，形状和特征值。 使用柔性电路中的每个信号层的预定值进行体积计算，并且相应的相邻粘合剂层的特征在于每个信号层提供相应优化的相邻粘合剂层。