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    Apparatus for accessing and probing the connections between a chip package and a printed circuit board
    2.
    发明授权
    Apparatus for accessing and probing the connections between a chip package and a printed circuit board 失效
    用于访问和探测芯片封装和印刷电路板之间的连接的装置

    公开(公告)号：US07525299B1

    公开(公告)日：2009-04-28

    申请号：US12163346

    申请日：2008-06-27

    申请人： Paul W. Rudrud ,  Roger A. Booth, Jr. ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse M. Hefner ,  Ankur K. Patel ,  Thomas W. Liang

    发明人： Paul W. Rudrud ,  Roger A. Booth, Jr. ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse M. Hefner ,  Ankur K. Patel ,  Thomas W. Liang

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2812 ,  G01R31/046

    摘要： A device to access and/or verify connections between a chip package and a printed circuit board (“PCB”), specifically within packages lacking back-side measurement access, includes a housing for insertion between the chip package and PCB. A passageway in the housing connects an entrance and an exit from the housing. The entrance is disposed on an end of the housing facing away from the chip package. The exit is disposed on a side of the housing below the chip package such that the passageway is directed at a signal path between the chip package and the PCB. A conductor disposed in the passageway is movable between a retracted position in which a contact end of the conductor is disposed within the passageway of the housing and an extended position in which the contact end of the conductor is disposed outside of the housing and in contact with the signal path.

    摘要翻译： 访问和/或验证芯片封装和印刷电路板（“PCB”）之间的连接的装置，特别是在没有背面测量通路的封装中，包括用于插入芯片封装和PCB之间的壳体。 壳体中的通道连接入口和出口与壳体。 入口设置在壳体的远离芯片封装的一端。 出口设置在芯片封装下方的壳体的一侧，使得通道指向芯片封装和PCB之间的信号路径。 设置在通道中的导体可在缩回位置之间移动，在该缩回位置，导体的接触端设置在壳体的通道内，并且延伸位置，其中导体的接触端设置在壳体的外部并与其接触 信号路径。

    METHODS FOR MANUFACTURING A SEMI-BURIED VIA AND ARTICLES COMPRISING THE SAME
    3.
    发明申请
    METHODS FOR MANUFACTURING A SEMI-BURIED VIA AND ARTICLES COMPRISING THE SAME 审中-公开
    制造半岛威力的方法及其包含的文章

    公开(公告)号：US20090056998A1

    公开(公告)日：2009-03-05

    申请号：US11848330

    申请日：2007-08-31

    申请人： Roger A. Booth, Jr. ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse Hefner ,  Thomas W. Liang ,  Ankur K. Patel ,  Paul Rudrud

    发明人： Roger A. Booth, Jr. ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse Hefner ,  Thomas W. Liang ,  Ankur K. Patel ,  Paul Rudrud

    IPC分类号： H05K1/11 ,  H05K3/10

    CPC分类号： H05K3/429 ,  H05K1/0222 ,  H05K1/115 ,  H05K2201/09536 ,  H05K2201/09809 ,  H05K2203/061 ,  Y10T29/49165

    摘要： Disclosed herein is a method comprising drilling a first hole in a multilayered device; the multilayered device comprising a fill layer disposed between and in intimate contact with two layers of a first electrically conducting material; the fill layer being electrically insulating; plating the first hole with a slurry; the slurry comprising a magnetic material, an electrically conducting material, or a combination comprising at least one of the foregoing materials; filling the first hole with a fill material; the fill material being electrically insulating; laminating a first layer and a second layer on opposing faces of the multilayered device to form a laminate; the opposing faces being the faces through which the first hole is drilled; the first layer and the second layer each comprising a second electrically conducting material; drilling a second hole through the laminate; the second hole having a circumference that is encompassed by a circumference of the first hole; and plating the surface of the second hole with a third electrically conducting material.

    摘要翻译： 本文公开了一种方法，包括在多层装置中钻出第一孔; 所述多层器件包括设置在两层第一导电材料之间并与之紧密接触的填充层; 填充层电绝缘; 用浆料电镀第一个孔; 所述浆料包括磁性材料，导电材料或包含至少一种前述材料的组合; 用填充材料填充第一个孔; 填充材料电绝缘; 在所述多层器件的相对面上层叠第一层和第二层以形成层压体; 相对的面是钻出第一孔的面; 所述第一层和所述第二层各自包括第二导电材料; 穿过层压板钻出第二个孔; 所述第二孔具有由所述第一孔的圆周包围的圆周; 以及用第三导电材料电镀所述第二孔的表面。

    PROGRAMMABLE OPTICAL INTERCONNECT FOR MULTI-NODE COMPUTER SYSTEMS
    5.
    发明申请
    PROGRAMMABLE OPTICAL INTERCONNECT FOR MULTI-NODE COMPUTER SYSTEMS 失效
    多节点计算机系统的可编程光学互连

    公开(公告)号：US20120275798A1

    公开(公告)日：2012-11-01

    申请号：US13096365

    申请日：2011-04-28

    申请人： Emmanuel Atta ,  Darcy Berger ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse M. Hefner ,  Thomas W. Liang

    发明人： Emmanuel Atta ,  Darcy Berger ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse M. Hefner ,  Thomas W. Liang

    IPC分类号： H04B10/00

    CPC分类号： H04B10/803

    摘要： A device for connecting a plurality of assemblage-mounted optical transmitters to a plurality of assemblage-mounted optical receivers mounted on a selected side of an assemblage includes a planar frame configured to be coupled to the selected side of the assemblage. A plurality of first redirecting structures is affixed to the planar frame and each is configured to receive a first optical signal from a different assemblage-mounted optical transmitter. Each first redirecting structure transmits a second optical signal, corresponding to the first optical signal, along a preselected path. A plurality of second redirecting structures is affixed to the planar frame and each is configured to receive the second optical signal from a different one of the first redirecting structures. Each of the second redirecting structures transmits a third optical signal, corresponding to the second optical signal, to a different one of the assemblage-mounted optical receivers.

    摘要翻译： 用于将多个组装安装的光发射器连接到安装在组合件的选定侧上的多个组装安装的光学接收器的装置包括被配置为耦合到组件的选定侧的平面框架。 多个第一重定向结构被固定到平面框架，并且每个重新定向结构被配置成从不同的组装安装的光发送器接收第一光信号。 每个第一重定向结构沿预选路径发送对应于第一光信号的第二光信号。 多个第二重定向结构被固定到平面框架，并且每个被配置为从第一重定向结构中的不同的一个接收第二光信号。 第二重定向结构中的每一个将对应于第二光信号的第三光信号发送到装配在一起的光接收器中的不同的一个。

    Programmable optical interconnect for multi-node computer systems
    6.
    发明授权
    Programmable optical interconnect for multi-node computer systems 失效
    用于多节点计算机系统的可编程光学互连

    公开(公告)号：US08488968B2

    公开(公告)日：2013-07-16

    申请号：US13096365

    申请日：2011-04-28

    申请人： Emmanuel Atta ,  Darcy Berger ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse M. Hefner ,  Thomas W. Liang

    发明人： Emmanuel Atta ,  Darcy Berger ,  John R. Dangler ,  Matthew S. Doyle ,  Jesse M. Hefner ,  Thomas W. Liang

    IPC分类号： H04B10/00

    CPC分类号： H04B10/803

    摘要： A device for connecting a plurality of assemblage-mounted optical transmitters to a plurality of assemblage-mounted optical receivers mounted on a selected side of an assemblage includes a planar frame configured to be coupled to the selected side of the assemblage. A plurality of first redirecting structures is affixed to the planar frame and each is configured to receive a first optical signal from a different assemblage-mounted optical transmitter. Each first redirecting structure transmits a second optical signal, corresponding to the first optical signal, along a preselected path. A plurality of second redirecting structures is affixed to the planar frame and each is configured to receive the second optical signal from a different one of the first redirecting structures. Each of the second redirecting structures transmits a third optical signal, corresponding to the second optical signal, to a different one of the assemblage-mounted optical receivers.

    摘要翻译： 用于将多个组装安装的光发射器连接到安装在组合件的选定侧上的多个组装安装的光学接收器的装置包括被配置为耦合到组件的选定侧的平面框架。 多个第一重定向结构被固定到平面框架，并且每个重新定向结构被配置成从不同的组装安装的光发送器接收第一光信号。 每个第一重定向结构沿预选路径发送对应于第一光信号的第二光信号。 多个第二重定向结构被固定到平面框架，并且每个被配置为从第一重定向结构中的不同的一个接收第二光信号。 第二重定向结构中的每一个将对应于第二光信号的第三光信号发送到装配在一起的光接收器中的不同的一个。

    EMC SHIELDING FOR PRINTED CIRCUITS USING FLEXIBLE PRINTED CIRCUIT MATERIALS
    9.
    发明申请
    EMC SHIELDING FOR PRINTED CIRCUITS USING FLEXIBLE PRINTED CIRCUIT MATERIALS 审中-公开
    使用柔性印刷电路材料打印电路的EMC屏蔽

    公开(公告)号：US20090213565A1

    公开(公告)日：2009-08-27

    申请号：US12038356

    申请日：2008-02-27

    申请人： Roger A. Booth, Jr. ,  John M. Dangler ,  Matthew S. Doyle

    发明人： Roger A. Booth, Jr. ,  John M. Dangler ,  Matthew S. Doyle

    IPC分类号： H05K9/00 ,  H01R43/00

    CPC分类号： H05K1/0218 ,  H05K3/403 ,  H05K2201/0355 ,  H05K2201/056 ,  H05K2201/0715 ,  Y10T29/49117

    摘要： Exemplary embodiments of the present invention relate to a method for making multilayer flexible printed circuit carrier. The method comprises producing a first flexible conductor layer having a first width, producing a second flexible conductor layer having a second width larger than the first width, and separating a first side of the first flexible conductor and a first side of the second flexible conductors with a first insulator. The method also comprises placing a second insulator over at least a portion of a second surface of the first flexible conductor, and wrapping a portion of the second flexible conductor over the at least a portion of the second surface of the first flexible conductor.

    摘要翻译： 本发明的示例性实施例涉及制造多层柔性印刷电路载体的方法。 该方法包括制造具有第一宽度的第一柔性导体层，产生具有大于第一宽度的第二宽度的第二柔性导体层，以及将第一柔性导体的第一侧和第二柔性导体的第一侧分别与 第一绝缘体。 该方法还包括将第二绝缘体放置在第一柔性导体的第二表面的至少一部分上，以及将第二柔性导体的一部分包裹在第一柔性导体的第二表面的至少一部分上。

    IMPLEMENTING ENHANCED LOW LOSS, THIN, HIGH PERFORMANCE FLEXIBLE CIRCUITS
    10.
    发明申请
    IMPLEMENTING ENHANCED LOW LOSS, THIN, HIGH PERFORMANCE FLEXIBLE CIRCUITS 有权
    实现增强低损耗，高性能灵活电路

    公开(公告)号：US20140005818A1

    公开(公告)日：2014-01-02

    申请号：US13535792

    申请日：2012-06-28

    申请人： John R. Dangler ,  Matthew S. Doyle

    发明人： John R. Dangler ,  Matthew S. Doyle

    IPC分类号： G06F19/00

    CPC分类号： H05K1/189 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/0005 ,  H05K3/4635 ,  H05K3/4638 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/09718 ,  H05K2203/063

    摘要： A method, system and computer program product are provided for implementing enhanced low loss, thin, high performance flexible circuits. A plurality of predefined values including predefined layout, spacing and density of conductor, signal trace construct, shape and feature values are provided for each signal layer in a flexible circuit. Volumetric calculations are performed using the predefined values for each signal layer in the flexible circuit and a respective adjacent adhesive layer is characterized for each signal layer providing a respective optimized adjacent adhesive layer.

    摘要翻译： 提供了一种方法，系统和计算机程序产品，用于实现增强型低损耗，薄型，高性能的柔性电路。 为柔性电路中的每个信号层提供多个预定值，包括预定布局，导体间距和密度，信号迹线构造，形状和特征值。 使用柔性电路中的每个信号层的预定值进行体积计算，并且相应的相邻粘合剂层的特征在于每个信号层提供相应优化的相邻粘合剂层。