公开(公告)号：US08179693B2

公开(公告)日：2012-05-15

申请号：US11693824

申请日：2007-03-30

Applicant: William Louis Brodsky ,  Mark Kenneth Hoffmeyer

Inventor： William Louis Brodsky ,  Mark Kenneth Hoffmeyer

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K7/1069 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/714 ,  Y10T29/49169

Abstract: Apparatus for electrically connecting two substrates using a land grid array (LGA) connector provided with a frame structure having power distribution elements. In an embodiment, the frame structure includes a frame having one or more conductive layers sandwiched between non-conductive layers. The frame may, for example, be a printed wire board (PWB) having power planes that distribute power from a first substrate (e.g., a system PWB) and/or a power cable to a second substrate (e.g., an electronic module). The frame includes one or more apertures configured to receive an LGA interposer for electrically connecting the two substrates. Preferably, the frame includes four apertures arranged in quadrants that each receive an interposer, and at least one power plane extends between two quadrants and/or adjacent to a peripheral edge of one or more quadrants in the form of stacked and/or parallel bus bars each defining a power domain.

Abstract translation: 一种用于使用具有配电元件的框架结构的焊盘格栅阵列（LGA）连接器来电连接两个基板的装置。 在一个实施例中，框架结构包括具有夹在非导电层之间的一个或多个导电层的框架。 框架可以例如是具有从第一基板（例如，系统PWB）和/或电力电缆分配功率到第二基板（例如，电子模块）的电力平面的印刷线路板（PWB）。 该框架包括一个或多个孔，其构造成接收用于电连接两个基板的LGA插入器。 优选地，框架包括布置在象限中的四个孔，每个孔分别接收插入件，并且至少一个电源平面在两个象限之间延伸和/或邻近一个或多个象限的周边边缘，堆叠和/或并行母线的形式 每个定义一个电源域。

公开(公告)号：US20090111292A1

公开(公告)日：2009-04-30

申请号：US11931220

申请日：2007-10-31

Applicant: William Louis Brodsky ,  Mark Kenneth Hoffmeyer

Inventor： William Louis Brodsky ,  Mark Kenneth Hoffmeyer

IPC: H01R12/06

CPC classification number: H05K1/111 ,  H01R12/724 ,  H01R13/6471 ,  H01R13/648 ,  H05K1/0219 ,  H05K2201/09409 ,  H05K2201/10189 ,  Y02P70/611

Abstract: A pad array for a surface mount technology board includes a front row ground pad as a single pad, followed by a signal pad. The ground pads internal to the array may be arranged as pairs of pads interconnected to each other, with sandwiching signal pads on the internal portion of the array. To minimize stress on connector wafers of large scale connectors, external rows of ground pads may be enlarged by a predetermined amount in a Y-direction to minimize potential formation of stress risers, while ensuring that electrical spacing requirements to adjacent signal leads may be preserved for optimal signal integrity.

Abstract translation: 用于表面贴装技术板的焊盘阵列包括作为单个焊盘的前排接地焊盘，其后是信号焊盘。 阵列内部的接地焊盘可以布置为彼此互连的焊盘对，并且在阵列的内部部分上夹有信号焊盘。 为了最大限度地减小大尺寸连接器的连接器晶片上的应力，外部排的接地焊盘可以在Y方向上扩大预定量，以最小化应力梯级的潜在形成，同时确保可以保持对相邻信号引线的电气间隔要求， 最佳信号完整性。

公开(公告)号：US07486516B2

公开(公告)日：2009-02-03

申请号：US11201972

申请日：2005-08-11

Applicant: John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

Inventor： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC: H05K7/20

CPC classification number: H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract translation: 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

公开(公告)号：US20080264603A1

公开(公告)日：2008-10-30

申请号：US12164367

申请日：2008-06-30

Applicant: John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

Inventor： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC: F28F7/00

CPC classification number: H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

公开(公告)号：US07435622B2

公开(公告)日：2008-10-14

申请号：US11876095

申请日：2007-10-22

Applicant: John Lee Colbert ,  Mark Kenneth Hoffmeyer

Inventor： John Lee Colbert ,  Mark Kenneth Hoffmeyer

IPC: H01L21/00

CPC classification number: H01L23/3736 ,  H01L23/3672 ,  H01L23/42 ,  H01L23/427 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322

Abstract: A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.

Abstract translation: 提供了一种制造方法和一种具有焊料释放层的高性能可重复工作的散热器和封装结构。 散热器结构包括散热器底座。 所选择的热管或蒸气室中的一个以及多个平行翅片焊接到散热器基座。 将焊料释放层施加到散热器基座的外表面。 焊料释放层具有比用于将所选择的一个热管或蒸气室固定的每个焊料以及多个平行散热片连接到散热器基座的熔融温度范围更低的温度范围。 在施加焊料释放层之后，用选定的传热介质填充热管或蒸汽室。

公开(公告)号：US06912780B2

公开(公告)日：2005-07-05

申请号：US10860427

申请日：2004-06-03

Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H01R12/00 ,  H05K1/11 ,  H05K3/22 ,  H05K3/40 ,  H05K3/42 ,  H01K3/10

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US5873512A

公开(公告)日：1999-02-23

申请号：US847940

申请日：1997-04-25

Applicant: James Daniel Bielick ,  Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs ,  Thomas Donald Kidd ,  David Allen Sluzewski

Inventor： James Daniel Bielick ,  Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs ,  Thomas Donald Kidd ,  David Allen Sluzewski

IPC: H01L21/60 ,  H05K3/12 ,  H05K3/34

CPC classification number: H01L24/83 ,  H01L24/31 ,  H05K3/3484 ,  H01L2224/11332 ,  H01L2224/13611 ,  H01L2224/29111 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2201/10992 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K3/1216

Abstract: A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.

Abstract translation: 公开了一种形成用于集成电路和半导体电子器件和载体组件的接合结构的方法。 冶金膏通过模板丝网印刷，并在回流过程中将模板留在原位。 键合结构和冶金膏的熔点低于电子部件上的互连件的熔点，并且小于电子部件粘合到的载体组件的分解温度。

公开(公告)号：US5769989A

公开(公告)日：1998-06-23

申请号：US530452

申请日：1995-09-19

Applicant: Mark Kenneth Hoffmeyer ,  David A. Sluzewski

Inventor： Mark Kenneth Hoffmeyer ,  David A. Sluzewski

IPC: H01L21/60 ,  H05K1/02 ,  H05K3/34 ,  H05K3/42 ,  B32B35/00

CPC classification number: H01L24/83 ,  H01L24/32 ,  H05K1/0206 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H05K1/0212 ,  H05K2201/09572 ,  H05K2203/049 ,  H05K2203/176 ,  H05K3/341 ,  H05K3/429 ,  Y10S156/941 ,  Y10S428/901 ,  Y10T156/19 ,  Y10T29/4973 ,  Y10T428/31681

Abstract: A configuration of surface-mounted circuit assembly has four layers, namely, an integrated circuit device, an adhesive layer, a solder layer and the carrier board. The integrated circuit device is attached to the solder layer which sets on top of the carrier board, with the adhesive layer between the integrated circuit device and the solder layer. The carrier board has at least one via located beneath where the integrated circuit is located. The via is filled with solder such that the solder layer at which the integrated circuit device is situated is thermo-conductively connected to the back side of the carrier board. This configuration allows the integrated circuit device to be easily removed from the carrier board by the application of heat to the back side of the carrier board.

Abstract translation: 表面安装电路组件的结构具有四层，即集成电路器件，粘合剂层，焊料层和载体板。 集成电路器件安装在设置在载体板顶部上的焊料层，其中集成电路器件和焊料层之间的粘合剂层。 承载板具有位于集成电路所在的下方的至少一个通孔。 通孔填充有焊料，使得集成电路器件所在的焊料层热导电连接到载体板的背面。 这种配置允许通过向载板的背面施加热量来容易地将集成电路器件从载板上移除。

公开(公告)号：US08680670B2

公开(公告)日：2014-03-25

申请号：US12909980

申请日：2010-10-22

Applicant: Jon Alfred Casey ,  John Lee Colbert ,  Paul Marian Harvey ,  Mark Kenneth Hoffmeyer ,  Charles L Reynolds

Inventor： Jon Alfred Casey ,  John Lee Colbert ,  Paul Marian Harvey ,  Mark Kenneth Hoffmeyer ,  Charles L Reynolds

IPC: H01L23/10

CPC classification number: H01L23/49833 ,  H01L22/14 ,  H01L23/32 ,  H01L23/4006 ,  H01L23/467 ,  H01L2924/16251 ,  H01L2924/16747

Abstract: A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such as a processor, mounted to an sub-module organic substrate that provides interconnects to the chip. The frame into which each chip sub-module plugs sits on a mini-card organic substrate that interconnects the chip sub-modules together. The MCM may include a downstop between the mini-card organic substrate and a system board to limit or prevent solder creep of solder connections between the mini-card organic substrate and the system board.

Abstract translation: 多芯片模块（MCM）包括作为独立可测试实体制造的芯片子模块。 芯片子模块插入MCM框架中的相应插槽。 在插入MCM之前，可以对每个芯片子模块进行测试。 芯片子模块可以包括安装到向模块提供互连的子模块有机衬底的诸如处理器的IC芯片。 每个芯片子模块插入的框架位于将芯片子模块互连在一起的微型卡有机基板上。 MCM可以包括微卡有机基板和系统板之间的下停，以限制或防止微卡有机基板和系统板之间的焊料连接的焊料蠕变。

公开(公告)号：US07399185B2

公开(公告)日：2008-07-15

申请号：US11456111

申请日：2006-07-07

Applicant: John Lee Colbert ,  Mark Kenneth Hoffmeyer

Inventor： John Lee Colbert ,  Mark Kenneth Hoffmeyer

IPC: H01R12/00

CPC classification number: H01L23/4006 ,  H01L25/0655 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0058 ,  H05K3/325 ,  H05K7/1061 ,  H05K2201/09036 ,  H05K2201/10409 ,  H05K2201/10719 ,  H05K2201/2009 ,  H01L2924/00

Abstract: An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape generating module, and a clamping arrangement for clamping the first, second and shape generating modules together. The shape generating module imparts a desired shape to the second module for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer, a second insulating layer and a shape producing layer disposed between the first and second insulating layers. The shape producing layer includes an adhesive that flows and cures upon application of a heat treatment to produce the desired shape.

Abstract translation: 电触头组件包括具有第一组电触点的第一模块，具有第二组电触点的第二模块，形状产生模块以及用于将第一，第二和形状发生模块夹紧在一起的夹紧装置。 形状产生模块向第二模块施加期望的形状，用于将第二组电触点推向第一组电触点，使得将模块夹在一起导致第一和第二组电触点之间的正接触力， 在电接触组之间基本均匀。 形状发生模块包括第一绝缘层，第二绝缘层和设置在第一和第二绝缘层之间的形状产生层。 形状产生层包括在施加热处理以产生所需形状时流动和固化的粘合剂。