CERAMIC SUBSTRATE, PROCESS FOR PRODUCING THE SAME, AND DIELECTRIC-PORCELAIN COMPOSITION
    2.
    发明申请
    CERAMIC SUBSTRATE, PROCESS FOR PRODUCING THE SAME, AND DIELECTRIC-PORCELAIN COMPOSITION 有权
    陶瓷基板,其制造方法和电介质组合物

    公开(公告)号:US20100197478A1

    公开(公告)日:2010-08-05

    申请号:US12669839

    申请日:2008-07-18

    IPC分类号: C04B35/04

    摘要: A ceramic substrate is provided as one having a large coefficient of thermal expansion α, having properties suitable for use as a high-frequency substrate, being capable of being fired at a low temperature, and having an excellent substrate strength. The ceramic substrate has a main composition containing Mg2SiO4 and a low-temperature-fired component, has the coefficient of thermal expansion α of not less than 9.0 ppm/° C., and contains up to 25 vol. % (excluding zero) ZnAl2O4 or up to 7 vol. % (excluding zero) Al2O3.A dielectric-porcelain composition is provided as one being capable of being fired at a temperature lower than a melting point of an Ag-based metal and being capable of demonstrating a sufficient bending strength even through firing at a low firing temperature. The dielectric-porcelain composition contains Mg2SiO4 as a major component and contains a zinc oxide, a boron oxide, an alkaline earth metal oxide, a copper compound, and a lithium compound as minor components.

    摘要翻译: 提供陶瓷基板作为具有大的热膨胀系数α的材料,具有适合用作高频基板的性能,能够在低温下烧制并且具有优异的基板强度。 陶瓷基板具有含有Mg 2 SiO 4和低温烧成分的主要成分,其热膨胀系数α为9.0ppm /℃以上,含有25体积%以下。 %(不包括零)ZnAl2O4或高达7体积% %(不包括零)Al2O3。 提供了一种电介质瓷组合物,其能够在低于Ag系金属的熔点的温度下被烧制,并且即使在低烧成温度下也能够显示出足够的弯曲强度。 介电瓷组合物含有Mg2SiO4作为主要成分,并含有氧化锌,氧化硼,碱土金属氧化物,铜化合物和作为次要成分的锂化合物。

    Low-temperature co-fired ceramics material and multilayer wiring board using the same
    10.
    发明申请
    Low-temperature co-fired ceramics material and multilayer wiring board using the same 有权
    低温共烧陶瓷材料和使用其的多层线路板

    公开(公告)号:US20050288167A1

    公开(公告)日:2005-12-29

    申请号:US11166367

    申请日:2005-06-27

    摘要: Objects of the present invention are to provide a low-temperature co-fired ceramic material having a coefficient of linear thermal expansion controlled and has a high dielectric constant, and to reduce the warpage of a fired product even if it has an unsymmetrical lamination structure in a multilayer wiring board in which glass-ceramic mixed layers of different compositions are laminated. A low-temperature co-fired ceramic material in accordance with the present invention includes: SiO2—B2O3—Al2O3-alkaline earth metal oxide based glass, alumina, titania, and cordierite; glass, titania, and cordierite; or glass, titania, and mullite. When a multilayer wiring board is made of the low-temperature co-fired ceramic material, the content of cordierite or mullite of the substrate material is adjusted to control a difference in a coefficient of linear thermal expansion between the layers of the substrate material to not more than 0.25×10−6/° C.

    摘要翻译: 本发明的目的是提供一种具有控制线性热膨胀系数并具有高介电常数的低温共烧陶瓷材料,并且即使其具有不对称层压结构也能减少烧制产品的翘曲 层叠不同组成的玻璃 - 陶瓷混合层的多层布线基板。 根据本发明的低温共烧陶瓷材料包括:SiO 2 -S 2 O 3 O 3 -Al < 碱土金属氧化物基玻璃,氧化铝,二氧化钛和堇青石; 玻璃,二氧化钛和堇青石; 或玻璃,二氧化钛和莫来石。 当由低温共烧陶瓷材料制成多层布线板时,调整基板材料的堇青石或莫来石的含量,以控制基板材料层之间的线性热膨胀系数的差异 大于0.25×10 -6 /℃