摘要:
An apparatus for monitoring strain in an optical chip in silicon photonics platform. The apparatus includes a silicon photonics substrate shared with the optical chip. Additionally, the apparatus includes an optical input configured in the silicon photonics substrate to supply an input signal of a single wavelength. The apparatus further includes a first waveguide arm and a second waveguide arm embedded in the silicon photonics substrate to form an on-chip interferometer. The second waveguide arm forms a delay line being disposed at a region in or adjacent to the optical chip. The on-chip interferometer is configured to generate an interference pattern serving as an indicator of strain distributed at the region in or adjacent to the optical chip. The interference pattern is caused by a temperature-independent phase shift at the single wavelength of the interferometer between the first waveguide arm and the second waveguide arm.
摘要:
A liquid discharge head includes a plurality of nozzles to discharge a liquid; a plurality of pressure chambers communicating with the plurality of nozzles; a plurality of individual supply channels communicating with the plurality of pressure chambers; a plurality of supply ports communicating with the plurality of individual supply channels; a plurality of common-supply branch channels communicating with two or more of the plurality of individual supply channels through the plurality of supply ports; a common-supply main channel communicating with the plurality of common-supply branch channels; and a plurality of supply-side dampers, each of the plurality of supply-side dampers forming a part of a wall of each of the plurality of common-supply branch channels.
摘要:
Two or more switching devices (36) and two or more lead frames (41, 42, 43, and 44) are integrally molded by use of a molding resin (37) so that a power module (30) is formed; the power module (30) is made to adhere to a heat sink (32) via an insulating material (31); the power module (30) and the heat sink (32) are fixed to a housing (33) of the power module composite (23); the power module composite (23) is fixed to a case (6) of an electric rotating machine (1) via the housing (33).
摘要:
The rotary electric machine main body includes: a stator; a rotor that includes a rotating shaft and that is rotatable relative to the stator; and a supporting body that supports the stator and the rotor. The controlling apparatus includes a power circuit portion that is disposed around the rotating shaft, and that converts electric power that is received from the rotary electric machine main body or electric power that is supplied to the rotary electric machine main body between alternating current and direct current. The power circuit portion includes: a power module; and an electric power interconnecting part that includes a conductor that is connected to a terminal of the power module. The electric power interconnecting part is disposed so as to avoid overlapping with a region of the power module when the power circuit portion is viewed in an axial direction of the rotating shaft.
摘要:
Consistent with one example of the disclosed implementations, a photonic integrated circuit (PIC) may be provided that includes s group of lasers and an arrayed waveguide grating (AWG) disposed on a substrate. Each laser in the group may supply an optical signal, such that each optical signal has a different wavelength. Each laser may be tunable to at least two designated wavelengths, which are separated from one another by a free spectral range (FSR) of the AWG. As a result, the optical signals provided from each laser may be combined by the AWG, regardless of which designated wavelength the optical signals have. Accordingly, a PIC may be provided that has a relatively simple construction but can supply optical signals having tunable wavelengths.
摘要:
Consistent with the present disclosure, an AWG is provided that has grating waveguide groupings that extend between a first free space region and a second free space region. The difference in length (ΔL) between successive grating waveguides differs for each grouping of grating waveguides, such that, for example, the ΔL associated with a given grating waveguide grouping is not an integer multiple of any of the other grating waveguide groupings. The grating waveguide groupings direct images having relatively small wavelength differences to a given output waveguide, and each grating waveguide grouping has an associated passband, which is similar to that of the conventional AWG. Unlike the conventional AWG, however, multiple grating waveguide groupings are included in the same AWG, such that the spectra associated with the grating waveguide groupings combine to provide a transmission characteristic having a passband that is greater than any individual passband. Accordingly, even if the optical signal wavelengths vary or are offset from the center wavelength of the passband, such wavelengths may still be transmitted with less loss.
摘要:
A power semiconductor module (100) includes: an electrode plate (2) in which a body portion (2a) and an external connection terminal portion (2b) are integrally formed, and the body portion (2a) is arranged on the same flat surface; a semiconductor chip (1) mounted on one surface (mounting surface) (2c) of the body portion (2a); and a resin package (3) in which the other surface (heat dissipation surface) (2d) of the body portion (2a) is exposed, and the body portion (2a) of the electrode plate (2) and the semiconductor chip (1) are sealed with resin. The heat dissipation surface (2d) is the same surface as the bottom (3a) of the resin package (3); and consequently, heat dissipation properties and reliability are improved and a reduction in size can be achieved.
摘要:
A coolerless photonic integrated circuit (PIC), such as a semiconductor electro-absorption modulator/laser (EML) or a coolerless optical transmitter photonic integrated circuit (TxPIC), may be operated over a wide temperature range at temperatures higher then room temperature without the need for ambient cooling or hermetic packaging. Since there is large scale integration of N optical transmission signal WDM channels on a TxPIC chip, a new DWDM system approach with novel sensing schemes and adaptive algorithms provides intelligent control of the PIC to optimize its performance and to allow optical transmitter and receiver modules in DWDM systems to operate uncooled. Moreover, the wavelength grid of the on-chip channel laser sources may thermally float within a WDM wavelength band where the individual emission wavelengths of the laser sources are not fixed to wavelength peaks along a standardized wavelength grid but rather may move about with changes in ambient temperature. However, control is maintained such that the channel spectral spacing between channels across multiple signal channels, whether such spacing is periodic or aperiodic, between adjacent laser sources in the thermally floating wavelength grid are maintained in a fixed relationship. Means are then provided at an optical receiver to discover and lock onto floating wavelength grid of transmitted WDM signals and thereafter demultiplex the transmitted WDM signals for OE conversion.
摘要:
An optical device may include a substrate and an arrayed waveguide grating provided on the substrate. The arrayed waveguide grating may include a first slab or a second slab and multiple waveguides extending therebetween. The optical device may also include a layer of material provided on one of the first slab or second slab. The layer of material may have a thickness such that first light may have a first polarization is absorbed by the material and second light may have a second polarization passes through the one of the first slab or the second slab.
摘要:
A power module composite includes a power module (34) in which switching devices (32) included in an electric-power conversion circuit are molded, a driver module (37) that includes a control circuit (35) for controlling the switching devices (32) and is molded, a housing (39) containing the power module (34) and the driver module (37), and a heat sink (38) that is fixed to the housing (39) and refrigerates the switching devices (32); the power module 34 and the driver module 37 are mounted in that order on the heat sink (38) in such a way as to be superimposed on each other.