公开(公告)号：US06779733B2

公开(公告)日：2004-08-24

申请号：US10204090

申请日：2002-08-19

申请人： Masanori Akita ,  Koji Ito ,  Toshihiro Mori ,  Yoshio Nogami ,  Yoshio Kuramoto

发明人： Masanori Akita ,  Koji Ito ,  Toshihiro Mori ,  Yoshio Nogami ,  Yoshio Kuramoto

IPC分类号： G06K1906

CPC分类号： G06K19/07722 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/05155

摘要： This noncontact ID card or the like comprises an antenna circuit board having an antenna formed on a substrate and an interposer board having expanded electrodes formed on a substrate where an IC chip is embedded, the expanded electrodes being connected to electrodes of the IC chip, wherein both boards are stacked in such a way that the electrodes of the antenna are joined to the expanded electrodes.

摘要翻译： 该非接触式ID卡等包括天线形成在基板上的天线电路板和形成在基板上形成有放大IC芯片的扩展电极的插入板，发光电极与IC芯片的电极连接， 两个板以这样的方式堆叠，使得天线的电极连接到扩展电极。

公开(公告)号：US06189208B1

公开(公告)日：2001-02-20

申请号：US09378847

申请日：1999-08-23

申请人： Richard H. Estes ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori ,  Minoru Wada

发明人： Richard H. Estes ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori ,  Minoru Wada

IPC分类号： H05K334

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2224/05664

摘要： The invention provides a flip chip mounting process in which a layer of electrically insulating adhesive paste is applied on a substrate having bond pads, covering the bond pads with the adhesive. Electrically conductive polymer bumps are formed on bond pads of a flip chip to be bonded to the substrate, and the polymer bumps are at least partially hardened. The bond pads of the flip chip are then aligned with the bond pads of the substrate, and the at least partially hardened polymer bumps are pushed through the adhesive on the substrate to contact directly and bond the polymer bumps to the bond pads of the substrate. This process results in direct electrical and mechanical bonding of the polymer bumps between the chip and substrate bond pads, even though the adhesive film was applied on the substrate in a manner that covered the substrate bond pads. The polymer bumps displace the adhesive as they are pushed through it and expand laterally on the substrate bond pads. As a result, the area around the polymer bumps between the chip and the substrate is filled with the adhesive, in the manner of an underfill, whereby a separate, post-bond underfill process is not required.

摘要翻译： 本发明提供了一种倒装芯片安装工艺，其中将电绝缘粘合剂浆料层施加在具有接合焊盘的基板上，用粘合剂覆盖接合焊盘。 导电性聚合物凸块形成在与芯片接合的倒装芯片的接合焊盘上，聚合物凸块至少部分硬化。 然后将倒装芯片的接合焊盘与衬底的接合焊盘对准，并且将至少部分硬化的聚合物凸块推动通过衬底上的粘合剂直接接触并将聚合物凸块接合到衬底的接合焊盘。 即使以覆盖衬底接合焊盘的方式将粘合剂膜施加在衬底上，该过程也导致聚合物凸块在芯片和衬底接合焊盘之间的直接电和机械结合。 聚合物凸块在粘合剂被推过时移动粘合剂并且在衬底接合焊盘上横向膨胀。 结果，芯片和基板之间的聚合物凸起周围的区域以底部填充的方式用粘合剂填充，由此不需要单独的后粘合底部填充工艺。

公开(公告)号：US07267926B2

公开(公告)日：2007-09-11

申请号：US10204308

申请日：2001-02-20

申请人： Hiroaki Tsuruta ,  Minoru Nakamura ,  Masanori Akita ,  Koji Ito ,  Toshihiro Mori

发明人： Hiroaki Tsuruta ,  Minoru Nakamura ,  Masanori Akita ,  Koji Ito ,  Toshihiro Mori

IPC分类号： G03F7/26

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H05K1/095 ,  Y10T428/24835

摘要： There are disclosed; an active energy beam curing type conductive paste, containing a conductive substance, and an active energy beam polymerizable compound, wherein a cured matter, obtained when a composition of the paste excluding the conductive substance is cured with an electron beam having an acceleration voltage of 150 kV and an irradiated dose of 40 kGy, has an internal stress of 5 to 50 Mpa; a production method and a device for a conductor circuit substrate using the active energy beam curing type conductive paste; and a non-contact ID using the active energy beam curing type conductive paste and a production method for the ID.

摘要翻译： 有披露; 含有导电物质的活性能量束固化型导电膏和活性能量束聚合性化合物，其中当除了导电物质之外的糊料的组合物用加速电压为150的电子束固化时获得的固化物 kV，照射剂量为40kGy，内应力为5〜50Mpa; 使用活性能量束固化型导电浆料的导体电路基板的制造方法和装置; 以及使用活性能量束固化型导电糊的非接触ID和ID的制造方法。

公开(公告)号：US06219911B1

公开(公告)日：2001-04-24

申请号：US09274748

申请日：1999-03-23

申请人： Richard H. Estes ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori

发明人： Richard H. Estes ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori

IPC分类号： H05K334

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  H05K2203/1189 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2924/00014

摘要： In a flip chip bonding method, polymer bumps are formed, using a bonding tool, on an IC chip, held via suction to the bonding tool. An insulating adhesive film is pressed onto the upper surface of a circuit board held via suction with a suction stage. Heat is then applied to bring the film into close contact with bond pads of the circuit board. At this point, the bonding tool is moved downward, bonding the polymer bumps to the circuit board electrodes. During the time of this downward movement, bonding of the polymer bumps to the circuit board bond pads can be achieved by piercing the insulating adhesive film with the polymer bumps, and it is found that strong bonding can be achieved with adequate reliability. This method eliminates the need for a process in which through-holes must be pierced in the insulating adhesive film to accommodate the polymer bumps.

摘要翻译： 在倒装芯片接合方法中，使用接合工具在IC芯片上形成聚合物凸块，该芯片通过抽吸保持在粘合工具上。 绝缘粘合膜被压到通过吸力保持的电路板的上表面上。 然后施加热量以使膜与电路板的接合焊盘紧密接触。 此时，接合工具向下移动，将聚合物凸块接合到电路板电极。 在这种向下移动的时间期间，通过用聚合物凸块刺穿绝缘粘合剂膜，可以实现聚合物凸块与电路板接合焊盘的接合，并且发现可以以足够的可靠性实现牢固的接合。 该方法不需要在绝缘粘合剂膜中穿透通孔以适应聚合物凸块的工艺。

公开(公告)号：US06841419B2

公开(公告)日：2005-01-11

申请号：US10240673

申请日：2001-03-30

申请人： Masanori Akita ,  Toshihiro Mori ,  Koji Ito

发明人： Masanori Akita ,  Toshihiro Mori ,  Koji Ito

IPC分类号： G06K19/077 ,  H01L29/06 ,  H01L21/48

CPC分类号： G06K19/07745 ,  H01L29/0657 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/1579

摘要： A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.

摘要翻译： 一种制造COF封装的方法包括以下步骤：提供具有用于接收芯片的孔的树脂膜基板，提供具有电极的IC芯片，将IC芯片插入孔中，以将它的电极固定在基板上方 并且在衬底表面上形成用于与电极连接的电路图案。 孔和IC芯片是锥形的，IC芯片用密封剂或粘合剂固定在孔中。

公开(公告)号：US06410415B1

公开(公告)日：2002-06-25

申请号：US09724019

申请日：2000-11-28

申请人： Richard H. Estes ,  James E. Clayton ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori ,  Minoru Wada

发明人： Richard H. Estes ,  James E. Clayton ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori ,  Minoru Wada

IPC分类号： H01L2144

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/01094 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention provides processes for bonding a flip chip to a substrate in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. Electrically conductive polymer bumps are formed on bond pads of a substrate, and a layer of electrically insulating adhesive paste is then applied on the substrate, covering the substrate polymer bumps with the adhesive. The bond pads of the flip chip are then aligned with the bond pads of the substrate and the at least partially hardened flip chip polymer bumps are then pushed through the substrate adhesive and at least partially into the substrate polymer bumps. In a further method, electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. A layer of electrically insulating adhesive paste is formed on a substrate having bond pads, covering the bond pads with the adhesive. The bond pads of the flip chip are aligned with the bond pads of the substrate, and then the at least partially hardened flip chip polymer bumps are pushed through the substrate adhesive with pressure sufficient for the flip chip polymer bumps to directly contact and deform the substrate bond pads.

摘要翻译： 本发明提供了使倒装芯片以最大限度地提高接合操作的可靠性的方式与基板结合的工艺。 导电聚合物凸块形成在倒装芯片的接合焊盘上，并且倒装芯片聚合物凸块至少部分硬化。 导电性聚合物凸块形成在基板的接合焊盘上，然后将一层电绝缘粘合剂浆料涂覆在基板上，用粘合剂覆盖基板聚合物凸块。 然后将倒装芯片的接合焊盘与衬底的接合焊盘对准，然后将至少部分硬化的倒装芯片聚合物凸块推入衬底粘合剂并且至少部分地推入衬底聚合物凸块中。 在另一种方法中，导电聚合物凸块形成在倒装芯片的接合焊盘上，并且倒装芯片聚合物凸块至少部分硬化。 在具有接合焊盘的基板上形成电绝缘粘合剂糊层，用粘合剂覆盖接合焊盘。 倒装芯片的接合焊盘与衬底的接合焊盘对准，然后将至少部分硬化的倒装芯片聚合物凸块按压足以使倒装芯片聚合物凸块直接接触和变形衬底的衬底粘合剂 接合垫

公开(公告)号：USRE41778E1

公开(公告)日：2010-09-28

申请号：US11104643

申请日：2005-04-13

申请人： Shoji Maruyama ,  Masanori Akita

发明人： Shoji Maruyama ,  Masanori Akita

IPC分类号： G03G15/00

CPC分类号： G03G15/5029 ,  G03G2215/00616 ,  G03G2215/00751

摘要： To provide a recording-material type determination apparatus and recording-material type determination method which can determine the type of recording material using simple calculations as well as to provide an image forming apparatus capable of obtaining stable image quality independent of the type of recording material using the apparatus and method.Based on data read by a read unit which reads surface images of recording material, a first calculation unit calculates the depth of irregularities in the surface of recording material and stores the results of calculation in a register A while a second calculation unit calculates the spacing of irregularities on the surface of the recording material and stores the results of calculation in a register B. Based on the values in the registers A and B, the type of recording material such as gloss paper, plain paper, rough paper or OHT is determined.

摘要翻译： 为了提供能够使用简单的计算来确定记录材料的类型的记录材料类型确定装置和记录材料类型确定方法，并且提供一种能够独立于使用的记录材料的类型获得稳定的图像质量的图像形成装置 该装置和方法。 基于读取记录材料的表面图像的读取单元读取的数据，第一计算单元计算记录材料表面的不规则深度，并将计算结果存储在寄存器A中，而第二计算单元计算记录材料的间隔 记录材料表面上的不规则性，并将计算结果存储在寄存器B中。根据寄存器A和B中的值，确定诸如光泽纸，普通纸，粗糙纸或OHT的记录材料的类型。

公开(公告)号：US07529493B2

公开(公告)日：2009-05-05

申请号：US11303242

申请日：2005-12-16

申请人： Hiroshi Shiba ,  Yoshitaka Kokubo ,  Masanori Akita ,  Tomoyuki Okada ,  Kengo Umeda

发明人： Hiroshi Shiba ,  Yoshitaka Kokubo ,  Masanori Akita ,  Tomoyuki Okada ,  Kengo Umeda

IPC分类号： G03G15/00

CPC分类号： G03G15/5029

摘要： A sensor system includes an LED configured to emit light to a recording medium and a light-receiving sensor configured to receive a transmitted light that has passed through the recording medium after having been emitted from the LED to the recording medium. An emitting optical axis of the LED is away from a perpendicular receiving optical axis of the light-receiving sensor.

摘要翻译： 传感器系统包括被配置为向记录介质发射光的LED和被配置为在从LED发射到记录介质之后接收已经通过记录介质的透射光的光接收传感器。 LED的发射光轴远离光接收传感器的垂直接收光轴。

公开(公告)号：US20080152390A1

公开(公告)日：2008-06-26

申请号：US11959154

申请日：2007-12-18

申请人： Masanori Akita

发明人： Masanori Akita

IPC分类号： G03G15/01

CPC分类号： G03G15/0121 ,  G03G15/6585 ,  G03G2215/00805 ,  G03G2215/0129

摘要： An image forming apparatus having a plurality of image bearing members, a plurality of colored toner developing units, and a transparent toner developing unit. Each colored toner developing unit has a developer bearing member. The rotational direction of the developer bearing members of the colored toner developing units is opposite to the rotational direction of the corresponding image bearing member, and the rotational direction of the developer bearing member of the transparent toner developing unit is the same as the rotational direction of the corresponding image bearing member.

摘要翻译： 具有多个图像承载部件，多个着色调色剂显影单元和透明调色剂显影单元的图像形成装置。 每个彩色调色剂显影单元具有显影剂承载部件。 彩色调色剂显影单元的显影剂承载构件的旋转方向与相应的图像承载构件的旋转方向相反，并且透明调色剂显影单元的显影剂承载构件的旋转方向与旋转方向相同 相应的图像承载部件。

公开(公告)号：US07339702B2

公开(公告)日：2008-03-04

申请号：US10420711

申请日：2003-04-23

申请人： Masanori Akita ,  Shoji Maruyama

发明人： Masanori Akita ,  Shoji Maruyama

IPC分类号： H04N1/23 ,  G06T7/40

CPC分类号： H04N1/6097 ,  G06K15/021 ,  H04N1/60

摘要： Provided is a picture reading device that is suited for discriminating the type/surface condition of a recording medium while requiring only a small circuit scale and less memory, and an image forming apparatus that uses the picture reading device. In a CMOS area sensor chip having a plurality of photoelectric conversion elements, there is provided a calculating unit for calculating the maximum value, the minimum value, and an average value of digital information related to a photoelectric conversion element in a specific area among the plurality of photoelectric conversion elements. Information calculated by the calculating unit is output in addition to digital information related to the plurality of photoelectric conversion elements.

摘要翻译： 提供了一种图像读取装置，其适用于识别记录介质的类型/表面状态，同时仅需要较小的电路规模和较少的存储器，以及使用图像读取装置的图像形成装置。 在具有多个光电转换元件的CMOS区域传感器芯片中，设置有用于计算多个光电转换元件中的特定区域中与光电转换元件相关的数字信息的最大值，最小值和平均值的计算单元 的光电转换元件。 除了与多个光电转换元件相关的数字信息之外，还输出由计算单元计算出的信息。