公开(公告)号：US06410415B1

公开(公告)日：2002-06-25

申请号：US09724019

申请日：2000-11-28

申请人： Richard H. Estes ,  James E. Clayton ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori ,  Minoru Wada

发明人： Richard H. Estes ,  James E. Clayton ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori ,  Minoru Wada

IPC分类号： H01L2144

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/01094 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599

摘要： The invention provides processes for bonding a flip chip to a substrate in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. Electrically conductive polymer bumps are formed on bond pads of a substrate, and a layer of electrically insulating adhesive paste is then applied on the substrate, covering the substrate polymer bumps with the adhesive. The bond pads of the flip chip are then aligned with the bond pads of the substrate and the at least partially hardened flip chip polymer bumps are then pushed through the substrate adhesive and at least partially into the substrate polymer bumps. In a further method, electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. A layer of electrically insulating adhesive paste is formed on a substrate having bond pads, covering the bond pads with the adhesive. The bond pads of the flip chip are aligned with the bond pads of the substrate, and then the at least partially hardened flip chip polymer bumps are pushed through the substrate adhesive with pressure sufficient for the flip chip polymer bumps to directly contact and deform the substrate bond pads.

摘要翻译： 本发明提供了使倒装芯片以最大限度地提高接合操作的可靠性的方式与基板结合的工艺。 导电聚合物凸块形成在倒装芯片的接合焊盘上，并且倒装芯片聚合物凸块至少部分硬化。 导电性聚合物凸块形成在基板的接合焊盘上，然后将一层电绝缘粘合剂浆料涂覆在基板上，用粘合剂覆盖基板聚合物凸块。 然后将倒装芯片的接合焊盘与衬底的接合焊盘对准，然后将至少部分硬化的倒装芯片聚合物凸块推入衬底粘合剂并且至少部分地推入衬底聚合物凸块中。 在另一种方法中，导电聚合物凸块形成在倒装芯片的接合焊盘上，并且倒装芯片聚合物凸块至少部分硬化。 在具有接合焊盘的基板上形成电绝缘粘合剂糊层，用粘合剂覆盖接合焊盘。 倒装芯片的接合焊盘与衬底的接合焊盘对准，然后将至少部分硬化的倒装芯片聚合物凸块按压足以使倒装芯片聚合物凸块直接接触和变形衬底的衬底粘合剂 接合垫

公开(公告)号：US06189208B1

公开(公告)日：2001-02-20

申请号：US09378847

申请日：1999-08-23

申请人： Richard H. Estes ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori ,  Minoru Wada

发明人： Richard H. Estes ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori ,  Minoru Wada

IPC分类号： H05K334

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2224/05664

摘要： The invention provides a flip chip mounting process in which a layer of electrically insulating adhesive paste is applied on a substrate having bond pads, covering the bond pads with the adhesive. Electrically conductive polymer bumps are formed on bond pads of a flip chip to be bonded to the substrate, and the polymer bumps are at least partially hardened. The bond pads of the flip chip are then aligned with the bond pads of the substrate, and the at least partially hardened polymer bumps are pushed through the adhesive on the substrate to contact directly and bond the polymer bumps to the bond pads of the substrate. This process results in direct electrical and mechanical bonding of the polymer bumps between the chip and substrate bond pads, even though the adhesive film was applied on the substrate in a manner that covered the substrate bond pads. The polymer bumps displace the adhesive as they are pushed through it and expand laterally on the substrate bond pads. As a result, the area around the polymer bumps between the chip and the substrate is filled with the adhesive, in the manner of an underfill, whereby a separate, post-bond underfill process is not required.

摘要翻译： 本发明提供了一种倒装芯片安装工艺，其中将电绝缘粘合剂浆料层施加在具有接合焊盘的基板上，用粘合剂覆盖接合焊盘。 导电性聚合物凸块形成在与芯片接合的倒装芯片的接合焊盘上，聚合物凸块至少部分硬化。 然后将倒装芯片的接合焊盘与衬底的接合焊盘对准，并且将至少部分硬化的聚合物凸块推动通过衬底上的粘合剂直接接触并将聚合物凸块接合到衬底的接合焊盘。 即使以覆盖衬底接合焊盘的方式将粘合剂膜施加在衬底上，该过程也导致聚合物凸块在芯片和衬底接合焊盘之间的直接电和机械结合。 聚合物凸块在粘合剂被推过时移动粘合剂并且在衬底接合焊盘上横向膨胀。 结果，芯片和基板之间的聚合物凸起周围的区域以底部填充的方式用粘合剂填充，由此不需要单独的后粘合底部填充工艺。

公开(公告)号：US06219911B1

公开(公告)日：2001-04-24

申请号：US09274748

申请日：1999-03-23

申请人： Richard H. Estes ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori

发明人： Richard H. Estes ,  Koji Ito ,  Masanori Akita ,  Toshihiro Mori

IPC分类号： H05K334

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  H05K2203/1189 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2924/00014

摘要： In a flip chip bonding method, polymer bumps are formed, using a bonding tool, on an IC chip, held via suction to the bonding tool. An insulating adhesive film is pressed onto the upper surface of a circuit board held via suction with a suction stage. Heat is then applied to bring the film into close contact with bond pads of the circuit board. At this point, the bonding tool is moved downward, bonding the polymer bumps to the circuit board electrodes. During the time of this downward movement, bonding of the polymer bumps to the circuit board bond pads can be achieved by piercing the insulating adhesive film with the polymer bumps, and it is found that strong bonding can be achieved with adequate reliability. This method eliminates the need for a process in which through-holes must be pierced in the insulating adhesive film to accommodate the polymer bumps.

摘要翻译： 在倒装芯片接合方法中，使用接合工具在IC芯片上形成聚合物凸块，该芯片通过抽吸保持在粘合工具上。 绝缘粘合膜被压到通过吸力保持的电路板的上表面上。 然后施加热量以使膜与电路板的接合焊盘紧密接触。 此时，接合工具向下移动，将聚合物凸块接合到电路板电极。 在这种向下移动的时间期间，通过用聚合物凸块刺穿绝缘粘合剂膜，可以实现聚合物凸块与电路板接合焊盘的接合，并且发现可以以足够的可靠性实现牢固的接合。 该方法不需要在绝缘粘合剂膜中穿透通孔以适应聚合物凸块的工艺。

公开(公告)号：US06779733B2

公开(公告)日：2004-08-24

申请号：US10204090

申请日：2002-08-19

申请人： Masanori Akita ,  Koji Ito ,  Toshihiro Mori ,  Yoshio Nogami ,  Yoshio Kuramoto

发明人： Masanori Akita ,  Koji Ito ,  Toshihiro Mori ,  Yoshio Nogami ,  Yoshio Kuramoto

IPC分类号： G06K1906

CPC分类号： G06K19/07722 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/05155

摘要： This noncontact ID card or the like comprises an antenna circuit board having an antenna formed on a substrate and an interposer board having expanded electrodes formed on a substrate where an IC chip is embedded, the expanded electrodes being connected to electrodes of the IC chip, wherein both boards are stacked in such a way that the electrodes of the antenna are joined to the expanded electrodes.

摘要翻译： 该非接触式ID卡等包括天线形成在基板上的天线电路板和形成在基板上形成有放大IC芯片的扩展电极的插入板，发光电极与IC芯片的电极连接， 两个板以这样的方式堆叠，使得天线的电极连接到扩展电极。

公开(公告)号：US06841419B2

公开(公告)日：2005-01-11

申请号：US10240673

申请日：2001-03-30

申请人： Masanori Akita ,  Toshihiro Mori ,  Koji Ito

发明人： Masanori Akita ,  Toshihiro Mori ,  Koji Ito

IPC分类号： G06K19/077 ,  H01L29/06 ,  H01L21/48

CPC分类号： G06K19/07745 ,  H01L29/0657 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/1579

摘要： A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.

摘要翻译： 一种制造COF封装的方法包括以下步骤：提供具有用于接收芯片的孔的树脂膜基板，提供具有电极的IC芯片，将IC芯片插入孔中，以将它的电极固定在基板上方 并且在衬底表面上形成用于与电极连接的电路图案。 孔和IC芯片是锥形的，IC芯片用密封剂或粘合剂固定在孔中。

公开(公告)号：US07267926B2

公开(公告)日：2007-09-11

申请号：US10204308

申请日：2001-02-20

申请人： Hiroaki Tsuruta ,  Minoru Nakamura ,  Masanori Akita ,  Koji Ito ,  Toshihiro Mori

发明人： Hiroaki Tsuruta ,  Minoru Nakamura ,  Masanori Akita ,  Koji Ito ,  Toshihiro Mori

IPC分类号： G03F7/26

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H05K1/095 ,  Y10T428/24835

摘要： There are disclosed; an active energy beam curing type conductive paste, containing a conductive substance, and an active energy beam polymerizable compound, wherein a cured matter, obtained when a composition of the paste excluding the conductive substance is cured with an electron beam having an acceleration voltage of 150 kV and an irradiated dose of 40 kGy, has an internal stress of 5 to 50 Mpa; a production method and a device for a conductor circuit substrate using the active energy beam curing type conductive paste; and a non-contact ID using the active energy beam curing type conductive paste and a production method for the ID.

摘要翻译： 有披露; 含有导电物质的活性能量束固化型导电膏和活性能量束聚合性化合物，其中当除了导电物质之外的糊料的组合物用加速电压为150的电子束固化时获得的固化物 kV，照射剂量为40kGy，内应力为5〜50Mpa; 使用活性能量束固化型导电浆料的导体电路基板的制造方法和装置; 以及使用活性能量束固化型导电糊的非接触ID和ID的制造方法。

公开(公告)号：US09371756B2

公开(公告)日：2016-06-21

申请号：US14110617

申请日：2011-04-15

申请人： Toshihiro Mori ,  Hidetaka Fuse

发明人： Toshihiro Mori ,  Hidetaka Fuse

IPC分类号： F01N3/00 ,  F01N3/10 ,  F01N3/20 ,  F01N3/38 ,  F01N9/00 ,  F01N3/36

CPC分类号： F01N3/10 ,  F01N3/2033 ,  F01N3/36 ,  F01N3/38 ,  F01N9/00 ,  F01N2900/10 ,  F01N2900/1602 ,  Y02A50/2322 ,  Y02T10/26 ,  Y02T10/47

摘要： There is provided an exhaust purifying system for an internal combustion engine comprising a fuel supply valve for supplying fuel to an exhaust passage for an internal combustion engine of a vehicle, an ignition device for igniting the fuel supplied from the fuel supply valve, and a controller for heating the ignition device to selectively realize at least an ignition temperature Ti in which the fuel can be ignited and a waiting temperature Ts in which the fuel cannot be ignited. The controller controls the waiting temperature Ts to be the lower as a predicted deceleration time tp that is the time for which a decelerating state of the vehicle lasts is larger.

摘要翻译： 提供了一种用于内燃机的排气净化系统，其包括用于向车辆的内燃机的排气通道供应燃料的燃料供给阀，用于点燃从燃料供给阀供给的燃料的点火装置和控制器 用于加热点火装置以选择性地实现燃料可点燃的至少点火温度Ti和燃料不能被点燃的等待温度Ts。 控制器将等待温度Ts控制为较低的预定减速时间tp，该预测减速时间tp是车辆的减速状态持续时间较大的时间。

公开(公告)号：US09212585B2

公开(公告)日：2015-12-15

申请号：US14118622

申请日：2011-07-28

申请人： Toshihiro Mori ,  Yuki Bisaiji

发明人： Toshihiro Mori ,  Yuki Bisaiji

IPC分类号： F01N3/20 ,  F01N9/00 ,  F01N3/28 ,  F01N3/025 ,  F01N3/035 ,  F01N13/00 ,  F01N3/08 ,  F01N3/10

CPC分类号： F01N3/20 ,  F01N3/0253 ,  F01N3/035 ,  F01N3/0821 ,  F01N3/0864 ,  F01N3/103 ,  F01N3/206 ,  F01N3/2892 ,  F01N9/00 ,  F01N9/002 ,  F01N13/009 ,  F01N2560/025 ,  F01N2900/1602 ,  F01N2900/1621 ,  F01N2900/1622 ,  Y02T10/47

摘要： An exhaust gas purifying apparatus for an internal combustion engine is provided with: a first catalyst (234) which is disposed in an exhaust passage of the internal combustion engine (200); a second catalyst (235) which is disposed in the exhaust passage on a downstream side of the first catalyst; a reducing agent supplying device (233) which is disposed on an upstream side of the first catalyst and which is configured to supply a reducing agent into the exhaust passage; and a reducing agent supply controlling device (100) which is configured to control the reducing agent supplying device such that an air-fuel ratio on the upstream side of the first catalyst becomes momentarily rich.

摘要翻译： 一种用于内燃机的废气净化装置，具备：设置在内燃机（200）的排气通路内的第一催化剂（234） 第二催化剂（235），其设置在第一催化剂的下游侧的排气通道中; 还原剂供给装置（233），其设置在所述第一催化剂的上游侧，并且构造成将还原剂供给到所述排气通路中; 以及还原剂供给控制装置（100），其被配置为控制所述还原剂供给装置，使得所述第一催化剂的上游侧的空燃比变得短暂。

公开(公告)号：US09156402B2

公开(公告)日：2015-10-13

申请号：US13388619

申请日：2010-07-28

申请人： Noboru Nagamine ,  Kazuya Watanabe ,  Tomoyuki Matsuba ,  Jun Kadowaki ,  Toshihiro Mori ,  Yuuichi Ooshita

发明人： Noboru Nagamine ,  Kazuya Watanabe ,  Tomoyuki Matsuba ,  Jun Kadowaki ,  Toshihiro Mori ,  Yuuichi Ooshita

IPC分类号： H04N7/18 ,  B60R1/00

CPC分类号： B60R1/00 ,  B60R2300/105 ,  B60R2300/303 ,  B60R2300/306 ,  B60R2300/605 ,  B60R2300/607 ,  B60R2300/804 ,  G06T3/0018 ,  H04N7/181

摘要： A vehicle periphery image generation apparatus for generating a vehicle periphery image with a wide view. The apparatus includes an image acquisition unit that acquires vehicle periphery images obtained by vehicle mounted photographic cameras, a display device, a viewing point position setting unit that sets the position to a viewing point from a perpendicular upward direction, a fish-eye image generation unit for generating a fish-eye image using the periphery images and a position set by the viewing point position setting unit, a self vehicle image generation unit that generates a self vehicle image as the fish-eye image with the position set by the viewing point position setting unit, and a display image generation unit for generating an image to be displayed on the display device using the fish-eye image and the self vehicle image, wherein the position of the viewing point of the fish-eye image can be changed.

摘要翻译： 一种用于产生具有宽视野的车辆周边图像的车辆周边图像生成装置。 该装置包括：图像获取单元，其获取通过车载照相机获得的车辆周边图像;显示装置;从垂直向上方向设置观察点的位置设定单元;鱼眼图像生成单元 用于使用周边图像和由观察点位置设置单元设置的位置来生成鱼眼图像的自车辆图像生成单元，其生成具有由观察点位置设置的位置的鱼眼图像的自车辆图像 设置单元，以及显示图像生成单元，用于使用鱼眼图像和自身车辆图像来生成要在显示装置上显示的图像，其中可以改变鱼眼图像的视点的位置。

公开(公告)号：US08208744B2

公开(公告)日：2012-06-26

申请号：US11447103

申请日：2006-06-06

申请人： Toshihiro Mori

发明人： Toshihiro Mori

IPC分类号： G06K9/36

CPC分类号： G06K9/00456

摘要： An image processing apparatus separates in a scanned image a text area from a graphic area primarily including a graphic form or a graph. For the text area, neighboring black pixels are connected to perform character determination in a unit of a rectangle obtained by connecting the black pixels. For the graphic area, labeling processing is used to extract a circumscribed rectangle of consecutive black pixels, without connecting the black pixels, to perform character determination in a unit of the circumscribed rectangle.

摘要翻译： 图像处理装置将扫描图像中的文本区域与主要包括图形或图形的图形区域分离。 对于文本区域，连接相邻的黑色像素以通过连接黑色像素获得的矩形的单位来执行字符确定。 对于图形区域，标记处理用于提取连续黑色像素的外接矩形，而不连接黑色像素，以外接矩形为单位进行字符确定。