Temperature measuring apparatus
    2.
    发明授权
    Temperature measuring apparatus 失效
    温度测量仪

    公开(公告)号:US4172384A

    公开(公告)日:1979-10-30

    申请号:US909303

    申请日:1978-05-24

    摘要: A measuring apparatus comprises: a first series circuit having first and second resistors connected between a power source terminal and ground; a second series circuit having a thermistor and a third resistor connected between the power source and ground; a first variable frequency oscillator for generating a pulse signal with the frequency corresponding to the current derived from the junction between the first and second resistors of the first series circuit; a second variable frequency oscillator for generating a pulse signal with the frequency corresponding to the current derived from the junction between the thermistor and the third resistor; a first counter which counts the pulse signal from the second variable frequency oscillator to produce a high level signal till it counts a given number of pulses; and AND gate connected to the output terminal of the first variable frequency oscillator and the first counter, a second counter for counting the pulse fed from the first variable frequency oscillator via the AND gate; and a display circuit for displaying the contents of the counter. The first and second variable oscillating circuits each have an odd number of inverters which are cascade-connected and each formed of an integrated injection logic circuit with a power receiving terminal connected to the first or second series circuit, the output terminal of the last stage inverter being connected to the input terminal of the first stage inverter.

    摘要翻译: 一种测量装置包括:第一串联电路,其具有连接在电源端子和地之间的第一和第二电阻器; 第二串联电路,具有连接在电源和地之间的热敏电阻和第三电阻; 第一可变频率振荡器,用于产生具有与从第一串联电路的第一和第二电阻器之间的结点导出的电流的频率的脉冲信号; 第二可变频率振荡器,用于产生具有与从热敏电阻和第三电阻器之间的结点导出的电流相对应的频率的脉冲信号; 计数来自第二可变频率振荡器的脉冲信号以产生高电平信号的第一计数器,直到它计数给定数量的脉冲; 和与门连接到第一可变频率振荡器的输出端和第一计数器,第二计数器,用于通过与门对从第一可变频率振荡器馈送的脉冲进行计数; 以及显示计数器的内容的显示电路。 第一和第二可变振荡电路各自具有串联连接的奇数个反相器,并且每个都由具有连接到第一或第二串联电路的电力接收端子的集成注入逻辑电路,最后一级反相器的输出端子 连接到第一级逆变器的输入端子。

    Gate circuit
    3.
    发明授权
    Gate circuit 失效
    门电路

    公开(公告)号:US4110634A

    公开(公告)日:1978-08-29

    申请号:US712668

    申请日:1976-08-09

    摘要: A gate circuit is constituted by a plurality of logical elements formed on the same P type semiconductor substrate. Each logical element is composed of an N type first region and P type second region formed by double diffusion in one of a plurality of P type isolated islands formed on a P type semiconductor substrate, and an N type isolating region and N type buried region surrounding the islands. The P type second region, N type first region and P type island constitute a first vertical PNP transistor by operating as an emitter, base and collector, respectively, while the N type first region, P type island and N type buried region constitute a second vertical NPN transistor by operating as an emitter, base and collector, respectively. In the plurality of logical elements, a Schottky diode is provided for each input section thereof. Connected to a connection point between an anode of this Schottky diode and a base of the second vertical NPN transistor of one logical element is a collector of that of another logical element. A collector of the second NPN transistor of one logical element constitutes an output section.

    摘要翻译: 门电路由形成在同一P型半导体衬底上的多个逻辑元件构成。 每个逻辑元件由形成在P型半导体衬底上的多个P型隔离岛中的一个中的双扩散形成的N型第一区和P型第二区组成,N型隔离区和N型掩埋区围绕 岛屿。 P型第二区域,N型第一区域和P型岛分别通过作为发射极,基极和集电极而构成第一垂直PNP晶体管,而N型第一区域,P型岛状物和N型掩埋区域构成第二垂直PNP晶体管 垂直NPN晶体管分别作为发射极,基极和集电极工作。 在多个逻辑元件中,为其每个输入部分提供肖特基二极管。 连接到该肖特基二极管的阳极和一个逻辑元件的第二垂直NPN晶体管的基极之间的连接点是另一个逻辑元件的集电极。 一个逻辑元件的第二NPN晶体管的集电极构成输出部分。

    Semiconductor R-S flip-flop circuit
    4.
    发明授权
    Semiconductor R-S flip-flop circuit 失效
    半导体R-S触发器电路

    公开(公告)号:US4091296A

    公开(公告)日:1978-05-23

    申请号:US746169

    申请日:1976-11-30

    CPC分类号: H03K3/288

    摘要: A semiconductor R-S flip-flop circuit comprises first and second input terminals, first and second output terminals, a first integrated injection logic unit consisting of a first transistor acting as a switching element and a second transistor acting as an injector, and a second integrated injection logic unit consisting of a third transistor acting as a switching element and a fourth transistor acting as an injector. The R-S flip-flop circuit further includes a first diode having a cathode connected to the first input terminal and an anode connected to the base of the first transistor, a second diode having a cathode connected to the second input terminal and an anode connected to the base of the third transistor, a third diode having an anode connected to the base of the first transistor and a cathode connected to the collector of the third transistor, and a fourth diode having an anode connected to the base of the third transistor and a cathode connected to the collector of the first transistor.

    摘要翻译: 半导体RS触发器电路包括第一和第二输入端,第一和第二输出端,由充当开关元件的第一晶体管和充当注入器的第二晶体管组成的第一集成注入逻辑单元和第二集成注入 逻辑单元由用作开关元件的第三晶体管和用作注入器的第四晶体管组成。 RS触发器电路还包括具有连接到第一输入端子的阴极和连接到第一晶体管的基极的阳极的第一二极管,具有连接到第二输入端子的阴极和连接到第二晶体管的阳极的第二二极管 第三晶体管的基极,具有连接到第一晶体管的基极的阳极和连接到第三晶体管的集电极的阴极的第三二极管,以及连接到第三晶体管的基极的阳极和阴极的第四二极管 连接到第一晶体管的集电极。

    Super abrasive grain wire saw winding structure, super abrasive grain wire saw cutting device, and super abrasive grain wire saw winding method
    6.
    发明授权
    Super abrasive grain wire saw winding structure, super abrasive grain wire saw cutting device, and super abrasive grain wire saw winding method 有权
    超级磨粒线绕线结构,超级磨粒锯线切割装置,超细磨料线锯绕线方式

    公开(公告)号:US07926478B2

    公开(公告)日:2011-04-19

    申请号:US10571131

    申请日:2004-06-03

    摘要: A superabrasive wire saw-wound structure includes a superabrasive wire saw (10) formed with an average diameter D and a reel (1). The superabrasive wire saw (10) includes a core wire (11), a bonding material (12) surrounding a surface of the core wire (11), and a plurality of superabrasive grains (13) bonded to the surface of the core wire (11) with the bonding material (12). The reel (1) includes a peripheral surface (2) having one end (3) and the other end (4). The superabrasive wire saw (10) which is to be unreeled successively toward a workpiece is wound around the peripheral surface (2) reciprocatingly between the one end (3) and the other end (4) to be multi-layered. A pitch P for winding the superabrasive wire saw (10) around the peripheral surface (2) between the one end (3) and the other end (4) satisfies a relation of D

    摘要翻译: 超级磨损线锯绕结构包括形成有平均直径D和卷轴(1)的超级磨损线锯(10)。 所述超细金属丝锯(10)包括芯线(11),围绕所述芯线(11)的表面的接合材料(12)以及与所述芯线的表面接合的多个超磨粒(13) 11)与接合材料(12)。 卷轴(1)包括具有一端(3)和另一端(4)的外周表面(2)。 将要向工件连续取出的超级磨料钢丝绳(10)围绕在一端(3)和另一端(4)之间往复运动的外周表面(2)缠绕成多层。 围绕一端(3)和另一端(4)之间的周边表面(2)缠绕超级磨料线锯(10)的间距P满足D

    IL Buffer having higher breakdown levels
    7.
    发明授权
    IL Buffer having higher breakdown levels 失效
    IL缓冲液具有较高的击穿水平

    公开(公告)号:US4464589A

    公开(公告)日:1984-08-07

    申请号:US405272

    申请日:1982-08-04

    CPC分类号: H03K19/091 H03K19/01818

    摘要: A buffer circuit is provided wherein bipolar transistors are connected to the output terminal of an IIL gate. The buffer circuit includes an IIL gate having a plurality of output terminals. The output terminals of the IIL gate are respectively connected to the bases of the bipolar transistors of which the emitter-collector paths are connected in series between a buffer output terminal and a reference voltage terminal.

    摘要翻译: 提供了一种缓冲电路,其中双极晶体管连接到IIL门的输出端。 缓冲电路包括具有多个输出端子的IIL门。 IIL栅极的输出端子分别连接到串联在缓冲器输出端子和参考电压端子之间的发射极 - 集电极路径的双极晶体管的基极。

    Integrated injection logic semiconductor devices
    8.
    发明授权
    Integrated injection logic semiconductor devices 失效
    集成注入逻辑半导体器件

    公开(公告)号:US4459606A

    公开(公告)日:1984-07-10

    申请号:US644296

    申请日:1975-12-24

    CPC分类号: H01L27/0214

    摘要: The integrated injection logic semiconductor device comprises an N type semiconductor substrate, a P type semiconductor layer laminated on the N type semiconductor substrate, a first N type region extending through the P type semiconductor layer to reach the N type semiconductor substrate, a P type region formed in the first N type region and having a periphery along the outer periphery of the first N type region and a second N type region formed in the P type semiconductor layer. The integrated injection logic semiconductor device is constituted by a PNP lateral transistor utilizing the P type region, the first N type region and the P type semiconductor layer as the emitter, base and collector electrodes respectively, and a NPN vertical transistor utilizing the N type semiconductor substrate, P type semiconductor layer and the second N type region as the emitter, base and collector electrodes, respectively.

    摘要翻译: 集成注入逻辑半导体器件包括N型半导体衬底,层叠在N型半导体衬底上的P型半导体层,延伸穿过P型半导体层到达N型半导体衬底的第一N型区域,P型区域 形成在第一N型区域中,并且沿着第一N型区域的外周具有周边,以及形成在P型半导体层中的第二N型区域。 集成注入逻辑半导体器件分别由利用P型区域,第一N型区域和P型半导体层作为发射极,基极和集电极的PNP横向晶体管构成,以及利用N型半导体的NPN垂直晶体管 基板,P型半导体层和第二N型区域分别作为发射极,基极和集电极。

    Method of manufacturing integrated injection logic semiconductor devices
utilizing self-aligned double-diffusion techniques
    9.
    发明授权
    Method of manufacturing integrated injection logic semiconductor devices utilizing self-aligned double-diffusion techniques 失效
    使用自对准双扩散技术制造集成注入逻辑半导体器件的方法

    公开(公告)号:US4058419A

    公开(公告)日:1977-11-15

    申请号:US644294

    申请日:1975-12-24

    摘要: A P type semiconductor layer is formed on an N type semiconductor layer by vapour epitaxial growth technique, an insulating film is formed on the P type semiconductor layer and a grid shape first opening is provided through the insulating film. Then, phosphorus is diffused into the P type semiconductor layer through the grid shape opening to form a first N type region extending through the semiconductor layer to reach the N type semiconductor layer. Then, second openings are formed through respective sections of the insulating film divided by and surrounded by the grid shape first opening and boron is diffused through the first and second openings to form first and second P type regions in the grid shape first N type region and the P type semiconductor layer, respectively. Finally, third openings are formed through respective portions of the insulating film and phosphorus is diffused into the P type semiconductor layer through the third openings to form second N type regions thereby forming an integrated injection logic semiconductor device including a lateral PNP transistor and a vertical NPN transistor.

    摘要翻译: 通过蒸气外延生长技术在N型半导体层上形成P型半导体层,在P型半导体层上形成绝缘膜,通过绝缘膜设置栅格状的第一开口。 然后,磷通过栅格形状开口扩散到P型半导体层中,以形成延伸穿过半导体层的第一N型区域到达N型半导体层。 然后,通过由栅格形状的第一开口分隔并被其包围的绝缘膜的各个部分形成第二开口,并且硼通过第一和第二开口扩散,以形成网格形状的第一N型区域中的第一和第二P型区域, P型半导体层。 最后,通过绝缘膜的各部分形成第三开口,并且磷通过第三开口扩散到P型半导体层中,以形成第二N型区域,从而形成包括横向PNP晶体管和垂直NPN的集成注入逻辑半导体器件 晶体管。

    Super abrasive grain wire saw winding structure, super abrasive grain wire saw cutting device, and super abrasive grain wire saw winding method
    10.
    发明申请
    Super abrasive grain wire saw winding structure, super abrasive grain wire saw cutting device, and super abrasive grain wire saw winding method 有权
    超级磨粒线绕线结构,超级磨粒锯线切割装置,超细磨料线锯绕线方式

    公开(公告)号:US20070023027A1

    公开(公告)日:2007-02-01

    申请号:US10571131

    申请日:2004-06-03

    IPC分类号: B28D1/08

    摘要: A superabrasive wire saw-wound structure includes a superabrasive wire saw (10) formed with an average diameter D and a reel (1). The superabrasive wire saw (10) includes a core wire (11), a bonding material (12) surrounding a surface of the core wire (11), and a plurality of superabrasive grains (13) bonded to the surface of the core wire (11) with the bonding material (12). The reel (1) includes a peripheral surface (2) having one end (3) and the other end (4). The superabrasive wire saw (10) which is to be unreeled successively toward a workpiece is wound around the peripheral surface (2) reciprocatingly between the one end (3) and the other end (4) to be multi-layered. A pitch P for winding the superabrasive wire saw (10) around the peripheral surface (2) between the one end (3) and the other end (4) satisfies a relation of D

    摘要翻译: 超级磨损线锯绕结构包括形成有平均直径D和卷轴(1)的超级磨损线锯(10)。 所述超细金属丝锯(10)包括芯线(11),围绕所述芯线(11)的表面的接合材料(12)以及与所述芯线的表面接合的多个超磨粒(13) 11)与接合材料(12)。 卷轴(1)包括具有一端(3)和另一端(4)的外周表面(2)。 将要向工件连续取出的超级磨料钢丝绳(10)围绕在一端(3)和另一端(4)之间往复运动的外周表面(2)缠绕成多层。 围绕一端(3)和另一端(4)之间的周边表面(2)缠绕超级磨料线锯(10)的间距P满足D