公开(公告)号：US4120041A

公开(公告)日：1978-10-10

申请号：US747059

申请日：1976-12-03

申请人： Masao Hayakawa ,  Masahiro Nomura

发明人： Masao Hayakawa ,  Masahiro Nomura

IPC分类号： H05K1/14 ,  H05K1/18 ,  G06F15/00 ,  H05K1/04

CPC分类号： H05K1/145 ,  H05K1/18 ,  H05K2201/10037 ,  H05K2201/10053 ,  H05K2201/10136 ,  H05K2201/10689

摘要： In a semiconductor device of the Dual In-line Plug-in Package type, input terminals for receiving, for example, key input signals derived from key input means are aligned on a side of the semiconductor device, and output terminals for developing, for example, driving signals for display means are aligned on another side of said semiconductor device. The input terminals and the output terminals function, in combination, not only to electrically connect the key input means, the semiconductor device and the display means with one another, but also to mechanically connect a circuit board for supporting the key input means and another circuit board for supporting the display means with each other.

摘要翻译： 在双列直插式封装类型的半导体器件中，用于接收例如从键输入装置导出的键输入信号的输入端子在半导体器件的一侧对齐，并且例如用于显影的输出端子 ，用于显示装置的驱动信号在所述半导体器件的另一侧对准。 输入端子和输出端子组合起来不仅将键输入装置，半导体装置和显示装置彼此电连接，而且机械地连接用于支撑键输入装置的电路板和另一电路 用于支持显示装置的板。

公开(公告)号：US4926239A

公开(公告)日：1990-05-15

申请号：US390448

申请日：1989-08-02

申请人： Kazuya Fujita ,  Takamichi Maeda ,  Masao Hayakawa

发明人： Kazuya Fujita ,  Takamichi Maeda ,  Masao Hayakawa

IPC分类号： H01L23/29

CPC分类号： H01L23/293 ,  H01L24/50 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T428/239

摘要： A plastic encapsulant for a semiconductor chip comprises an epoxy resin, an organosilicon compound, a hardener, a pigment, and an organic solvent. The epoxy resin is an epichlorohydrin-bisphenol A type epoxy resin, and the organosilicon compound is an organosilicon compound with a methoxy group, preferably, three methoxy groups. The hardener is a resol type phenol resin hardener. The organic solvent is a mixture of ketones, alcohols, and aromatic hydrocarbons.

摘要翻译： 用于半导体芯片的塑料密封剂包括环氧树脂，有机硅化合物，硬化剂，颜料和有机溶剂。 环氧树脂是表氯醇 - 双酚A型环氧树脂，有机硅化合物是具有甲氧基的有机硅化合物，优选三个甲氧基。 固化剂是甲阶型酚醛树脂固化剂。 有机溶剂是酮，醇和芳烃的混合物。

公开(公告)号：US09498840B2

公开(公告)日：2016-11-22

申请号：US13388239

申请日：2010-07-30

申请人： Takahiko Kanai ,  Munehisa Hatta ,  Fumiaki Ikuta ,  Kazuhiro Kawasaki ,  Eizaburou Nakanishi ,  Masayuki Miyake ,  Kotobu Nagai ,  Masao Hayakawa ,  Takehiko Itagaki

发明人： Takahiko Kanai ,  Munehisa Hatta ,  Fumiaki Ikuta ,  Kazuhiro Kawasaki ,  Eizaburou Nakanishi ,  Masayuki Miyake ,  Kotobu Nagai ,  Masao Hayakawa ,  Takehiko Itagaki

IPC分类号： B23K9/28 ,  B23K11/11 ,  B23K11/24 ,  B23K11/26 ,  B23K11/31 ,  C22C38/00

CPC分类号： B23K11/115 ,  B23K11/24 ,  B23K11/26 ,  B23K11/312 ,  B23K2101/006 ,  B23K2101/18 ,  B23K2103/04 ,  C22C38/00 ,  Y10T428/12965

摘要： A welding structural part 1 is manufactured by overlapping the surfaces of steel sheets 2, and forming a weld zone by spot welding. The weld zone 3 includes: a weld nugget 4; and a heat affected zone 5 surrounding the weld nugget 4, wherein the hardness in the weld zone increases along an exterior region 6 of the heat affected zone 5 toward the heat affected zone 5, and then decreases along the heat affected zone 5 toward the central region of the weld nugget 4. In the boundary region between the weld nugget 4 and the heat affected zone 5, the weld nugget 4 may have a convex portion 4A bulging into the heat affected zone 5 along the overlapped portion. The steel sheets 2 contain carbon in 0.15 mass % or more.

摘要翻译： 通过重叠钢板2的表面，通过点焊形成焊接区域来制造焊接结构体1。 焊接区3包括：焊点4; 以及围绕焊点4的热影响区域5，其中焊接区域中的硬度沿着热影响区域5的外部区域6朝向热影响区域5增加，然后沿热影响区域5朝向中心 在焊接熔核4与热影响区5之间的边界区域中，焊点4可以具有沿重叠部分向热影响区5内凸出的凸部4A。 钢板2含有0.15质量％以上的碳。

公开(公告)号：US4536786A

公开(公告)日：1985-08-20

申请号：US39820

申请日：1979-05-17

申请人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

发明人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

IPC分类号： H01L21/603 ,  H01L21/60 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52

CPC分类号： H01L24/50 ,  H01L24/79 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15787

摘要： Raised contacts included within a semiconductor chip are bonded to respective external leads through the use of a bonding tool. The raised contacts and/or the external leads are varied in a fashion depending on their locations on a semiconductor substrate so as to compensate for lack of uniformity of the surface temperature of the bonding tool.

摘要翻译： 包含在半导体芯片内的升高的触点通过使用接合工具被接合到相应的外部引线。 升高的触点和/或外部引线以取决于它们在半导体衬底上的位置的方式变化，以便补偿焊接工具的表面温度的不均匀性。

公开(公告)号：US4300153A

公开(公告)日：1981-11-10

申请号：US190744

申请日：1980-09-25

申请人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

发明人： Masao Hayakawa ,  Takamichi Maeda ,  Masao Kumura

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/28 ,  H01L23/02 ,  H01L39/02

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L2224/16

摘要： Electrodes are formed on one major surface of a semiconductor chip and electrically connected to lead electrodes carried by a support substrate. A cover plate is fixed to the opposing major surface of the semiconductor chip to determine one major surface of semiconductor device. Remaining surfaces of the semiconductor chip are encapsulated by a resin mold. The cover plate comprises a flexible glass cloth impregnated with half cured epoxy resin.

摘要翻译： 电极形成在半导体芯片的一个主表面上并电连接到由支撑衬底承载的引线电极。 盖板固定到半导体芯片的相对主表面以确定半导体器件的一个主表面。 半导体芯片的剩余表面被树脂模具封装。 盖板包括浸渍有半固化环氧树脂的柔性玻璃布。

公开(公告)号：US20110305595A1

公开(公告)日：2011-12-15

申请号：US13203102

申请日：2010-01-29

申请人： Saburo Matsuoka ,  Masao Hayakawa ,  Etsuo Takeuchi ,  Nobuo Nagashima

发明人： Saburo Matsuoka ,  Masao Hayakawa ,  Etsuo Takeuchi ,  Nobuo Nagashima

IPC分类号： C22C38/04 ,  C22C38/14 ,  C22C38/12 ,  C22C38/02 ,  C22C38/06

CPC分类号： H01M8/04208 ,  C21D8/005 ,  C21D9/14 ,  C21D2211/005 ,  C22C38/02 ,  C22C38/04 ,  C22C38/12 ,  C22C38/14 ,  H01M8/04201 ,  Y02P70/56

摘要： A ferritic steel having tensile properties and fatigue properties capable of withstanding use in a hydrogen environment and a method of manufacture thereof are provided. By adding one or more element selected from among vanadium (V), titanium (Ti) and niobium (Nb) so that the steel includes, together with at least ferrite grains in the structure, a carbide or carbides of one or more element selected from among V, Ti and Nb, the reduction of area and the fatigue crack propagation rate of the ferritic steel in a hydrogen environment are improved. The advantages of the invention were confirmed in cases where the ferrite grains are small grains of 1 μm or less in size, and in cases where the ferrite grains are coarse grains from several micrometers to 20 μm in size, and moreover in cases where the ferrite grains are coarse grains from several micrometers to 60 μm in size.

摘要翻译： 提供一种具有耐氢气环境中使用的拉伸性能和疲劳特性的铁素体钢及其制造方法。 通过添加选自钒（V​​），钛（Ti）和铌（Nb）中的一种或多种元素，使得钢至少与结构中的铁素体晶粒一起包含一种或多种元素的碳化物或碳化物， 在V，Ti和Nb中，在氢环境中铁素体钢的面积减小和疲劳裂纹扩展速率提高。 在铁素体晶粒尺寸小于1μm的小晶粒的情况下，在铁素体晶粒的尺寸为几微米至20μm的粗晶粒的情况下，在铁素体的情况下，在本发明的优点的情况下， 晶粒是尺寸从几微米到60μm的粗晶粒。

公开(公告)号：US4696452A

公开(公告)日：1987-09-29

申请号：US834103

申请日：1986-02-24

申请人： Teiji Miyagawa ,  Yoshio Iwamura ,  Masao Hayakawa

发明人： Teiji Miyagawa ,  Yoshio Iwamura ,  Masao Hayakawa

IPC分类号： F16K31/124 ,  F16K31/143

CPC分类号： F16K31/143 ,  F16K31/124

摘要： A trip throttle valve with a manual exerciser and combination of a hydraulic piston and a biasing force bearing sleeve is provided in place of a piston. The piston is not directly connected to a valve stem and the sleeve is threadably engaged with the valve stem so as to cause relative axial movement between the sleeve and the valve stem when the stem is rotated through the manual exerciser. The hydraulic portion of the valve is provided with a by-pass passage so that the piston is made axially movable toward the sleeve under the pressure which occurs when the by-pass passage for the hydraulic liquid is blocked but the piston is arrested at a certain axial position where the by-pass passage is still blocked and the axial movement of the sleeve is restricted against the piston. Blocking of the by-pass passage is arranged to take place after the axial separating distance between the sleeve and the piston reaches a predetermined value so that any inadvertent movement of the valve stem by the engagement of the piston with the sleeve is avoided.

摘要翻译： 提供具有手动锻炼器和组合液压活塞和偏压力轴承套筒的行程节流阀来代替活塞。 活塞不直接连接到阀杆，并且套筒与阀杆螺纹接合，以便当阀杆通过手动锻炼器旋转时，使得套筒和阀杆之间产生相对的轴向运动。 阀的液压部分设置有旁通通道，使得当液压液体的旁通通道被阻塞但活塞在某一特定的位置被停止时，活塞能够在压力下朝向套筒轴向移动 旁路通道仍被阻挡的轴向位置，并且套筒的轴向运动被限制在活塞上。 旁通通道的封闭被布置成在套筒和活塞之间的轴向分离距离达到预定值之后发生，从而避免了通过活塞与套筒接合而导致的阀杆的任何无意的移动。

公开(公告)号：US4247590A

公开(公告)日：1981-01-27

申请号：US858636

申请日：1977-12-08

申请人： Masao Hayakawa ,  Takamichi Maeda ,  Teruo Horii ,  Masao Kumura ,  Yasunori Chikawa

发明人： Masao Hayakawa ,  Takamichi Maeda ,  Teruo Horii ,  Masao Kumura ,  Yasunori Chikawa

IPC分类号： H01L21/683 ,  H01L21/60 ,  H05K1/03 ,  B32B3/00 ,  B32B3/26

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01014 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/09701 ,  H05K1/0306 ,  Y10T428/24926 ,  Y10T428/249994

摘要： A semiconductor wafer is supported by a supporting plate via adhesive in some steps of fabricating a semiconductor device. The supporting plate is a porous ceramic plate impregnated with or painted with resin such as epoxy resin, silicone resin and polyimide varnish. The porous ceramic supporting plate has a low thermal conductivity to ensure stable bonding operation.

摘要翻译： 半导体晶片在制造半导体器件的一些步骤中通过粘合剂由支撑板支撑。 支撑板是浸渍或用树脂涂覆的多孔陶瓷板，例如环氧树脂，硅树脂和聚酰亚胺清漆。 多孔陶瓷支撑板具有低导热性，以确保稳定的接合操作。

公开(公告)号：US08932416B2

公开(公告)日：2015-01-13

申请号：US13375156

申请日：2010-05-26

申请人： Eizaburou Nakanishi ,  Masayuki Miyake ,  Kotobu Nagai ,  Masao Hayakawa ,  Takehito Itagaki ,  Takahiko Kanai ,  Munehisa Hatta ,  Kazuhiro Kawasaki

发明人： Eizaburou Nakanishi ,  Masayuki Miyake ,  Kotobu Nagai ,  Masao Hayakawa ,  Takehito Itagaki ,  Takahiko Kanai ,  Munehisa Hatta ,  Kazuhiro Kawasaki

IPC分类号： C21D9/00 ,  B21D22/02 ,  B21D22/20 ,  B21D37/16 ,  C21D1/42 ,  C22C38/18 ,  C22C38/22

CPC分类号： B21D22/02 ,  B21D22/20 ,  B21D37/16 ,  C21D1/42 ,  C21D1/673 ,  C21D9/00 ,  C21D2211/001 ,  C21D2211/004 ,  C21D2211/008 ,  C22C38/18 ,  C22C38/22 ,  Y02P10/253

摘要： A high-strength die-quenched part 1 is formed by heating a high-strength steel sheet 11 up to an austenite region, hot stamping and cooling inside a mold, and its microstructure has the martensite wherein carbide particles 2 are finely dispersed over an entire region including prior-austenite grain boundaries. It is desirable that the prior-austenite grain size in the microstructure of the high-strength steel sheet, which is a base material, be 10 μm or smaller. The high-strength die-quenched part has high-strength and high-ductility thanks to its martensite.

摘要翻译： 通过将高强度钢板11加热至奥氏体区域，在模具内部进行热冲压和冷却来形成高强度的模具淬火部件1，其微结构具有马氏体，其中碳化物粒子2在整个中精细分散 区域包括先前的奥氏体晶界。 优选的是，作为基材的高强度钢板的微观结构中的以前的奥氏体晶粒尺寸为10μm以下。 高强度模具淬火部分由于其马氏体而具有高强度和高延展性。

公开(公告)号：US20120129006A1

公开(公告)日：2012-05-24

申请号：US13388239

申请日：2010-07-30

申请人： Takahiko Kanai ,  Munehisa Hatta ,  Fumiaki Ikuta ,  Kazuhiro Kawasaki ,  Eizaburou Nakanishi ,  Masayuki Miyake ,  Kotobu Nagai ,  Masao Hayakawa ,  Takehiko Itagaki

发明人： Takahiko Kanai ,  Munehisa Hatta ,  Fumiaki Ikuta ,  Kazuhiro Kawasaki ,  Eizaburou Nakanishi ,  Masayuki Miyake ,  Kotobu Nagai ,  Masao Hayakawa ,  Takehiko Itagaki

IPC分类号： B32B15/01 ,  B23K11/11

CPC分类号： B23K11/115 ,  B23K11/24 ,  B23K11/26 ,  B23K11/312 ,  B23K2101/006 ,  B23K2101/18 ,  B23K2103/04 ,  C22C38/00 ,  Y10T428/12965

摘要： A welding structural part 1 is manufactured by overlapping the surfaces of steel sheets 2, and forming a weld zone by spot welding. The weld zone 3 includes: a weld nugget 4; and a heat affected zone 5 surrounding the weld nugget 4, wherein the hardness in the weld zone increases along an exterior region 6 of the heat affected zone 5 toward the heat affected zone 5, and then decreases along the heat affected zone 5 toward the central region of the weld nugget 4. In the boundary region between the weld nugget 4 and the heat affected zone 5, the weld nugget 4 may have a convex portion 4A bulging into the heat affected zone 5 along the overlapped portion. The steel sheets 2 contain carbon in 0.15 mass % or more.

摘要翻译： 通过重叠钢板2的表面，通过点焊形成焊接区域来制造焊接结构体1。 焊接区3包括：焊点4; 以及围绕焊点4的热影响区域5，其中焊接区域中的硬度沿着热影响区域5的外部区域6朝向热影响区域5增加，然后沿热影响区域5朝向中心 在焊接熔核4与热影响区5之间的边界区域中，焊点4可以具有沿重叠部分向热影响区5内凸出的凸部4A。 钢板2含有0.15质量％以上的碳。